14:15 – 14:35
Advanced packaging essential for full utilization of SiC semiconductors
Whether Si or SiC is the desired chip technology for an application, advanced packaging is needed to fully utilize and optimize the chip performance. Packaging must be designed for peak loads, though benefits of SiC are at average load. Semikron Danfoss has the technologies needed for the future need of high performance power electronics allowing electrification – in both industry and automotive – to scale up for a sustainable and decarbonized future.
Dominic Dorfner, Ph.D.
Semikron Danfoss
Company Profile
Semikron Danfoss is a global technology leader in power electronics. Our product offerings include semiconductor devices, power modules, stacks and systems.
In a world that is going electric, Semikron Danfoss technologies are more relevant than ever. With our innovative solutions for automotive, industrial and renewable applications we help the world utilize energy more efficiently and sustainably and thus to significantly reduce overall CO2 emissions – facing one of the biggest challenges today.
We take care of our employees and create value for our customers by investing significantly in innovation, technology, capacity, and service to deliver best-in-industry performance and for a sustainable future.
