12:00 – 12:20
The Development of Silicon Photonics in Optical Communications, and its Challenges
AI GPU link is playing an increasingly critical role in data centers and high-performance edge computing systems. Among the enabling technologies, silicon photonics is rapidly advancing—particularly in pluggable optical transceivers and the emerging field of co-packaged optics. Currently, external laser sources (ELS) are the mainstream approach for optical input. Assembling laser chip and fiber onto PICs remains a bottleneck. In the talk, I’ll also discuss Internal Laser Source (ILS) on PIC and 2D fiber array with metalens.
David Chang, Ph.D.
AuthenX. Inc
Dr. David Chang is the CTO of AuthenX Inc., where he leads the research and development division, focusing on silicon photonics, optoelectronics, and optical communication technologies.
Prior to his industry career, Dr. Chang was a professor at National Central University, Taiwan, where his research centered on nano-optics and optoelectronics. His work has contributed to advancements in optical communications, solid-state lighting, and biophotonics. He has authored over 100 research papers and holds more than 30 patents.
Dr. Chang earned his Ph.D. in Materials Engineering from Massachusetts Institute of Technology.
AuthenX. Inc
Company Profile
Founded in 2019, AuthenX is an optoelectronic product development company specializing in Silicon Photonics and III-V Photonics key components. Our core technologies include optical design, high-speed circuits, precision packaging, and system integration. Leveraging industrial chain integration, we provide solutions and products for next-generation data centers, AI GPU systems, FTTX, and PON applications.
Company Products & Services
Our products and services include 400Gbps, 800Gbps, and up to 1.6Tbps optical transceivers, as well as high-power ELS modules for CPO in data centers and AI GPU systems. In silicon photonics, we focus on the hybrid integration of Optical I/O on PICs, including laser-to-PIC and PIC-to-FAU integration, aiming to improve PIC I/O packaging tolerance and throughput. Our products are applicable in fields ranging from PON and FTTX to data centers and AI GPU systems.
