AI-Powered Innovation: Driving the Next Wave of Semiconductor Breakthroughs
Empowering Europe’s Semiconductor Future: Innovation, Integration & Independence
Enabling the Future of AI: Innovations in HBM, Advanced Packaging, and Power Semiconductors
Empowering Europe’s Semiconductor Future: Innovation, Integration & Independence
Enabling Intelligence at the Edge: MEMS and Sensors Powering the AI Era
Enabling the Future of AI: Innovations in HBM, Advanced Packaging, and Power Semiconductors
European Role in the Global Semiconductor Industry
Strategy and role for Data Center, AI and EV?
EU WBG Pilot Line
I.S.E.S. Middle East 2023
Empowering a Sustainable Future: Innovation, Collaboration and Navigating Challenges in Power Electronics Industry
Empowering a Sustainable Future: Innovation, Collaboration and Navigating Challenges in Power Electronics Industry
Shaping an AI-Powered Future: Driving Semiconductor Innovation with Silicon Photonics and Advanced Packaging and Testing, Along With I.S.I.G. 15th Year Anniversary Exclusive Edition – Advanced Packaging Legends Forum
Shaping an AI-Powered Future: Driving Semiconductor Innovation with Silicon Photonics and Advanced Packaging and Testing, Along With I.S.I.G. 15th Year Anniversary Exclusive Edition – Advanced Packaging Legends Forum
Demonstrating the Impact of MEMS and Sensors and Strategic Collaboration & Investments Needed for Further Adoption
I.S.E.S. China 2024
AI-Powered Innovation: Driving the Next Wave of Semiconductor Breakthroughs
I.S.E.S. China 2024
I.S.E.S. China 2024
I.S.E.S. SEA 2024
I.S.E.S. SEA 2024
07:00 – 08:00
Registration
07:15 – 08:15
Registration
07:30 – 08:30
Registration
07:30 – 08:30
Registration
07:30 – 08:10
Registration
07:30 – 08:15
Registration
November 5 | Day 1: Innovations and Trends in Advanced Manufacturing
Officials（官方活动）
08:00 – 08:55
Registration & Welcome Coffee
08:00 – 08:40
Registration
08:00 – 08:25
Welcome Speech
Salah Nasri
CEO & Co-Founder
I.S.E.S.
Salah Nasri is the CEO & Co-Founder of the International Semiconductor Executive Summits (ISES), a division of the International Semiconductor Industry Group Ltd. an influential organization within the semiconductor industry. With extensive experience in the sector, Nasri has played a pivotal role in fostering global collaboration among semiconductor leaders. Under his leadership, ISES has become a premier platform for industry executives to connect, share insights, and drive innovation across various regions including the United States, Europe, Asia, and the Middle East.
Salah Nasri has been instrumental in expanding the reach and impact of ISES, organizing significant events that bring together decision-makers from across the semiconductor ecosystem. These events provide opportunities for networking, collaboration, and the exchange of ideas crucial for advancing the industry in areas such as semiconductor manufacturing, MEMS, AI, automotive electronics, and more.
His leadership has not only enhanced the visibility of ISES globally but also strengthened partnerships with key industry players, ensuring that ISES remains at the forefront of semiconductor innovation and development. Salah Nasri has previously worked at Goldman Sachs’s, Credit Suisse and International Business Development Group. Salah Nasri graduated from Oxford University and Loughborough University in International Relations and Economics. In 2024, Salah Nasri became a Stanford University Alumni after completing the Stanford Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today!
08:00 – 08:40
Registration
08:10 – 08:30
ISIG 15th Year Anniversary Welcome
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (I.S.I.G.)
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Saeed Amidi
Founder & CEO
Plug and Play Tech Center
Saeed is a seasoned investor and executive with over 30 years of experience growing businesses in numerous industries, including real estate, bottled water, packaging, and technology investing. Following the early success of his various businesses, The Amidi Group initially purchased a building in Palo Alto and decided to rent the extra office spaces to startups.
As the CEO and founder of Plug and Play, Saeed applies his passion for the tech industry daily by working with forward-thinking partners and the best global startups to facilitate positive change worldwide. Since Plug and Play’s launch in 2006, the company has worked with over 90,000 startups, made over 2,000 investments, and boasts over 30 unicorns including Dropbox, PayPal, Lending Club, N26, and Honey. Similar to his unexpected success with the “Lucky Building,” Saeed considered himself lucky overall when he moved to Silicon Valley in the late 70s, where he was then unaware of the ecosystem it would become.
Company Profile
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
Rouzbeh Borhani
Head of Semiconductors
Plug and Play Tech Center
Rouzbeh is the Founder and Head of the Semiconductor practice at Plug and Play, the largest corporate innovation platform in the world and one of the most active early-stage investors globally. He collaborates closely with entrepreneurs, corporate innovation leaders, and investors, focusing on the semiconductor industry value chain.
Previously, Rouzbeh served as the Country Retail Management Director in the Consumer Electronics sector.
Rouzbeh holds a Master of Business Administration and a Master of Science in Disruptive Innovation, along with a Bachelor of Science in Mechatronics Engineering. He is currently a PhD candidate in Electrical and Computer Engineering. His passion lies at the intersection of technology and business.
Company Profile
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
Rouzbeh Borhani
Head of Semiconductors
Plug and Play Tech Center
Rouzbeh is the Founder and Head of the Semiconductor practice at Plug and Play, the largest corporate innovation platform in the world and one of the most active early-stage investors globally. He collaborates closely with entrepreneurs, corporate innovation leaders, and investors, focusing on the semiconductor industry value chain.
Previously, Rouzbeh served as the Country Retail Management Director in the Consumer Electronics sector.
Rouzbeh holds a Master of Business Administration and a Master of Science in Disruptive Innovation, along with a Bachelor of Science in Mechatronics Engineering. He is currently a PhD candidate in Electrical and Computer Engineering. His passion lies at the intersection of technology and business.
Company Profile
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
08:15 – 08:45
Registration
08:15 – 08:25
Understand the Present; Predict the Future
In this presentation, Mr. Sherman will present examples from the ISIG Chips & Wafers data reports that demonstrate the depth and scope of the information we provide to our customers.
Whether you are a Fabless company, an equipment manufacturer or an OSAT our reports provide the timely data you need to make better decisions.
Simi Sherman
VP of Research
International Semiconductor Industry Group (I.S.I.G.)
Simi Sherman is Co-Founder and CEO of Chips & Wafers, a semiconductor data and research platform, and VP of Research with ISIG.
After six years at a Buy-Side global equities Hedge Fund, where he was a Partner and led semiconductor research, Simi Co-founded Chips & Wafers. Working together with ISIG, Chips & Wafers provides semiconductor companies and investors with timely and actionable data they utilize in making more informed decisions.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
08:15 – 08:30
I.S.I.G. 15th Year Anniversary Opening
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (I.S.I.G.)
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
November 6 | Day 2: Sustainable Practices and Future Directions
08:20 – 08:55
Registration & Welcome Coffee
Scaling AI Performance & Chiplet Architectures
08:30 – 08:55
Japan’s Policy Trends in Semiconductor and Digital Industry Strategy
Two years have passed since the formulation of the Semiconductor and Digital Industry Strategy in June 2021, the Ministry of Economy, Trade and Industry revised its Semiconductor and Digital Industry Strategy in June 2023.
In this strategy, in the semiconductor sector, Japan aims to achieve total sales of 15 trillion yen or more for domestic semiconductor manufacturing companies by 2030, and while step 1 is developing semiconductor manufacturing capability, step 2 will bethe establishment of manufacturing technology for 2nm and beyond logic semiconductors. Finally, it will work on the development of future, game-changing technologies, such as photonics-electronics convergence in step 3.
In this presentation, specific initiatives such as research and development, human resource development, and international collaboration based on the Semiconductor and Digital Industry Strategy will be explained, along with the latest policy trends.
Hisashi Kanazashi
Director, IT Div
Ministry of Economy, Trade and Industry (METI)
Director, IT Industry Division, Commerce and Information Policy Bureau, METI(Ministry of Economy, Trade and Industry)
1998 Joined the Ministry of International Trade and Industry (MITI)
2007 Visiting Scholar, Stanford University
2008 MBA from EDHEC Business School, France
2009 Industrial Revitalization Division
2011 Policy Planning and Coordination Division, Minister’s Secretariat
2014 Japan Economic Revitalization Bureau, Cabinet Secretariat
2016 Deputy Director, JETRO Los Angeles Office,
Director, Industry Creation Policy Division, Principal Director, IT Industry and Digital Economic Security, etc
2021 Counselor for Information Industry and Digital Economy and Security, Minister’s Secretariat
July 1, 2022 Current Position
08:30 – 08:50
Welcome Speech
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (I.S.I.G.)
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
08:30 – 08:50
Keynote
AI use cases in semiconductor data analytics and quality management
AI agents are already making waves by improving known applications that long been used by engineers, developers and every day ordinary users. Semiconductor manufacturing alike has been impacted in the areas of data analytics , traceability, commonality study , corner case identification and more. this presentation will go over some of those AI use cases.
Bizhan Delgoshaei
Head of Custom Silicon Engineering Operation
Bizhan Delgoshaei leads custom silicon engineering operation at google in charge of Tensor manufacturing, test and quality. His career spans over two decades ramping leading edge semiconductor products (FPGA, Memory and Storage, SoC and PMIC, Security Chips and more) from new product introduction to high volume manufacturing. Bizhan has led product engineering , supplier quality engineering and engineering operation organizations in Fabless Semiconductor companies such as Altera, Apple and Google. He holds a masters degree in VLSI from University of Southern California and BS in Electrical Engineering from Sharif University of Technology, Tehran Iran.
Company Profile
A problem isn’t truly solved until it’s solved for all. Googlers build products that help create opportunities for everyone, whether down the street or across the globe. Bring your insight, imagination and a healthy disregard for the impossible. Bring everything that makes you unique. Together, we can build for everyone.
08:30 – 08:50
M.S.W.S., I.S.I.G. and P&P Welcome
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (I.S.I.G.)
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Saeed Amidi
Founder & CEO
Plug and Play Tech Center
Saeed is a seasoned investor and executive with over 30 years of experience growing businesses in numerous industries, including real estate, bottled water, packaging, and technology investing. Following the early success of his various businesses, The Amidi Group initially purchased a building in Palo Alto and decided to rent the extra office spaces to startups.
As the CEO and founder of Plug and Play, Saeed applies his passion for the tech industry daily by working with forward-thinking partners and the best global startups to facilitate positive change worldwide. Since Plug and Play’s launch in 2006, the company has worked with over 90,000 startups, made over 2,000 investments, and boasts over 30 unicorns including Dropbox, PayPal, Lending Club, N26, and Honey. Similar to his unexpected success with the “Lucky Building,” Saeed considered himself lucky overall when he moved to Silicon Valley in the late 70s, where he was then unaware of the ecosystem it would become.
Company Profile
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
Rouzbeh Borhani
Head of Semiconductors
Plug and Play Tech Center
Rouzbeh is the Founder and Head of the Semiconductor practice at Plug and Play, the largest corporate innovation platform in the world and one of the most active early-stage investors globally. He collaborates closely with entrepreneurs, corporate innovation leaders, and investors, focusing on the semiconductor industry value chain.
Previously, Rouzbeh served as the Country Retail Management Director in the Consumer Electronics sector.
Rouzbeh holds a Master of Business Administration and a Master of Science in Disruptive Innovation, along with a Bachelor of Science in Mechatronics Engineering. He is currently a PhD candidate in Electrical and Computer Engineering. His passion lies at the intersection of technology and business.
Company Profile
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
Rouzbeh Borhani
Head of Semiconductors
Plug and Play Tech Center
Rouzbeh is the Founder and Head of the Semiconductor practice at Plug and Play, the largest corporate innovation platform in the world and one of the most active early-stage investors globally. He collaborates closely with entrepreneurs, corporate innovation leaders, and investors, focusing on the semiconductor industry value chain.
Previously, Rouzbeh served as the Country Retail Management Director in the Consumer Electronics sector.
Rouzbeh holds a Master of Business Administration and a Master of Science in Disruptive Innovation, along with a Bachelor of Science in Mechatronics Engineering. He is currently a PhD candidate in Electrical and Computer Engineering. His passion lies at the intersection of technology and business.
Company Profile
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
08:30 – 08:45
M.S.W.S. & I.S.I.G. Welcome
Fostering High Tech Innovation & Expansions Regionally
Data Centers & AI: Challenges and Opportunities in Power Electronics
08:35 – 08:55
Keynote
Next-Generation GaN/SiC To Accelerate Electrification
New developments in both GaN and SiC combined with new power systems architecture are creating new opportunities to accelerate electrification of our planet across multiple, major markets including electric transportation, renewables, energy storage and more. Technology details, application examples and market implications will be presented.
Gene Sheridan
CEO
Navitas Semiconductor
Gene Sheridan brings over 25 years of experience in power management & semiconductors with an impressive track record in creating, leading and scaling businesses that have enjoyed excellent value creation, growth and profitability.
Most recently, Gene served as CEO of the VC-backed semiconductor start-up BridgeCo that captured 80% market share in the wireless audio market before a successful sale to Standard Microsystems Corporation (SMSC). Prior to BridgeCo, Gene served as VP & GM at International Rectifier where he managed a business unit with a team of over 100 employees and $600M annual revenues.
At IRF, Gene held several positions that spanned engineering, manufacturing, sales & marketing including the creation of a $70M/yr start-up. Gene holds a BSEE from Clarkson University.
Company Profile
Founded in 2014, Navitas develops ultra-efficient gallium nitride (GaN) semiconductors that are revolutionizing the world of power electronics in terms of efficiency, performance, size, cost and sustainability.
GaN is growing in importance because of its ability to offer significantly improved performance over conventional silicon semiconductors while reducing the energy and the physical space needed to deliver that performance. GaN technology will accelerate the transition to a sustainable future by delivering efficiency improvements, lowering the cost of clean energy and reducing the materials and energy needed to create power semiconductors.
Navitas is the industry leader in GaN with drive, control and protection in a single easy-to-use integrated circuit (IC). Navitas GaNFast ICs are easy-to-use ‘digital in, power out’ building blocks that enable up to one hundred times faster switching speeds while increasing energy savings by as much as 40%.
08:35 – 08:50
Welcome
Saeed Amidi
Founder & CEO
Plug and Play Tech Center
Saeed is a seasoned investor and executive with over 30 years of experience growing businesses in numerous industries, including real estate, bottled water, packaging, and technology investing. Following the early success of his various businesses, The Amidi Group initially purchased a building in Palo Alto and decided to rent the extra office spaces to startups.
As the CEO and founder of Plug and Play, Saeed applies his passion for the tech industry daily by working with forward-thinking partners and the best global startups to facilitate positive change worldwide. Since Plug and Play’s launch in 2006, the company has worked with over 90,000 startups, made over 2,000 investments, and boasts over 30 unicorns including Dropbox, PayPal, Lending Club, N26, and Honey. Similar to his unexpected success with the “Lucky Building,” Saeed considered himself lucky overall when he moved to Silicon Valley in the late 70s, where he was then unaware of the ecosystem it would become.
Company Profile
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
Day 2 Morning Session Moderator
Kuan-Neng Chen, Ph.D.
Dean/Chair Professor
NYCU
Dr. Kuan-Neng Chen is Dean of International College of Semiconductor Technology and Chair Professor at Institute of Electronics at National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, as well as his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). Dr. Chen has held several prominent positions including Vice President for International Affairs, Associate Dean of International College of Semiconductor Technology at NYCU, Program Director of the Micro-Electronics Program at National Science and Technology Council in Taiwan, Adjunct R&D Director at Industrial Technology and Research Institute (ITRI), and Research Staff Member at IBM Thomas J. Watson Research Center.
Dr. Chen has received numerous awards and honors throughout his career, including IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST/NSTC Outstanding Research Award (twice), MOST/NSTC Futuristic Breakthrough Technology Award (twice), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored over 400 publications, including 3 books and 7 book chapters, and holds 88 patents. Dr. Chen served as Guest Editor for the MRS Bulletin, IEEE Transactions on Components, Packaging, and Manufacturing Technology, and Materials Science in Semiconductor Processing, and has held leadership roles in various conferences and committees, such as IEEE IITC General Chair. Dr. Chen is Fellow of National Academy of Inventors (NAI), IEEE, IET, IMAPS, and CIEE and member of Phi Tau Phi Scholastic Honor Society.
Additionally, Dr. Chen is Specially Appointed Professor at Institute of Tokyo Science (previously Tokyo Tech). His current research interests focus on three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
Company Profile
NYCU was founded on the idea that, in a great university, people work across the disciplines to solve real-world problems. At our university, putting this idea into practice requires integrating Chiao Tung’s strengths in information and communications technology with Yang Ming’s strengths in biomedical research. It also requires contributing to fields located at the intersection of these research areas, for example, digital medicine and bioinformatics. And it requires training our students in such a way that the next generation will not be as constrained by disciplinary boundaries as the previous one.
At NYCU, we are striving to be a great university that transcends disciplinary divides to solve the increasingly complex problems that the world faces. We will continue to be guided by the idea that we can achieve something much greater together than we can individually. After all, that was the idea that led to the creation of our university in the first place.
Shaping an AI-Powered Future
08:40 – 09:10
AI Powered Innovation: Driving the Next Wave of Semiconductor Breakthrough
M. Ashkan Seyedi, Ph.D.
Director, LinkX Products
NVIDIA
Ashkan Seyedi received a dual bachelor’s in electrical and computer engineering from the University of Missouri-Columbia and a Ph.D. from University of Southern California working on photonic crystal devices, high-speed nanowire photodetectors, efficient white LEDs, and solar cells. With a decade of industry experience at Intel, Hewlett Packard Enterprise and now NVidia, Dr. Seyedi has been working on developing high-bandwidth, efficient optical interconnects for exascale, and high-performance computing applications.
Company Profile
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.
08:40 – 08:55
ISIG 15th Year Anniversary Welcome Address
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (I.S.I.G.)
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Front End Technology
08:45 – 09:10
Keynote
The Challenge of Speed – The Rapidus Model for a New Manufacturing Era
As the miniaturization of advanced logic processes continues, the time from design to commercialization is lengthening.
This is due to the increasing difficulty of the manufacturing process, design, and verification associated with the growing complexity of device structures. However, LSIs, such as processors and accelerators for AI, are evolving at a rapid pace and must be commercialized in a short period of time to meet time- to-market requirements. We will introduce the Rapidus model, which solves this problem and achieves short TAT manufacturing.
Kazunari Ishimaru
Senior Managing Executive Officer, Silicon Technology Division, IEEE Fellow
Rapidus
Joined Toshiba, Semiconductor Device Engineering Labs. in 1988 and engaged in development of advanced SRAM/Logic technologies. 2006-2010: engaged in development of 32nm~20nm CMOS platform technologies with IBM as Toshiba’s representative (VP of R&D). 2013 Senior Manager of Advanced Memory Technology Development Dept. 2022 Director of Memory Technology R&D Center. Joined Rapidus Corporation in April 2023.
08:45 – 09:05
Keynote
Francesco La Via
Research Director
CNR-IMM Institute for Microelectronics and Microsystems
08:50 – 09:10
Keynote
Ken Diest
Research Manager and Tech Lead
Meta
Ken Diest is a Research Manager and Tech Lead at Meta’s Reality Labs, where he leads programs focused on MEMS and micro-actuator technologies. His focus is on developing these technologies from early stage through production to address critical opto-mechanical and display challenges in AR/MR.
A Materials Scientist by training, Ken’s prior work focused on tunable devices and materials with an emphasis on optical systems. He was the editor and co-author of the book Numerical Methods for Metamaterial Design, and has previously held technology development roles at Apple, MIT Lincoln Laboratories, and Northrop Grumman that focused on new displays and nano-photonics.
Company Profile
Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.
The Future of MEMS and Sensors in a Connected World
08:55 – 09:15
Keynote
Sensing Hope at the Edge
Machine Learning at THE EDGE. Nearly every company, investor, product launch, and presentation these days is about “ML at The Edge” as the next, great technology wave. And where there is a wave, there are riders, hoping to cash in. For me, sensors are clearly the edge, breaking the boundary between the physical and digital worlds. Driven by cost, size, power constraints, MEMS is the technology sensing the edge. And with so much data being collected, doing the analysis at the edge with ML decreases latency and saves power on data transmission. But where is the money? I’ll talk about the forces at play, large and small, and offer some experiences from MEMS at the edge. And also share my hope that beyond the hype, there is good to be done. That new understanding from all the data and algorithms will help us to leave the planet better than we found it.
Peter Hartwell, Ph.D.
VP, Engineering
TDK InvenSense
Dr. Peter G. Hartwell is VP of Engineering at TDK US Corporation driving global technology and strategy. Peter came to TDK through its acquisition of Invensense where he was the CTO. Peter has over 30 years experience commercializing silicon MEMS systems, working on sensors, actuators, and software at all levels. Prior to InvenSense, Peter was Architect of Sensing Hardware at Apple and was a Distinguished Technologist at Hewlett-Packard Labs. Peter has over 40 worldwide patents on MEMS devices and sensor applications. Peter has a B.S. in Materials Science from the University of Michigan and a Ph. D. in Electrical Engineering from Cornell University.
Company Profile
InvenSense, a TDK Group company, is a world-leading provider of sensor solutions, including MEMS and magnetic sensors for consumer, industrial, and automotive applications. InvenSense MEMS sensors are known to be best-in-class for reasons that include high performance and reliability, high-volume manufacturing capacity and supply stability, ongoing hardware and software innovation, and ultra-low power consumption. They can be found in Mobile, Wearable, Smart Home, Industrial, Automotive, IoT, and Robotics products, among others. Founded in 2003, InvenSense has a 20+ year history of patented sensor technology across Motion, Sound, and Ultrasonic solutions, including the invention of the 6-axis IMU. InvenSense is dedicated to enabling partner success and enhancing lives through sustainable sensor innovation. In May of 2017, InvenSense became part of the MEMS Sensors Business Group of TDK Corporation, based in Tokyo, Japan. InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia, and Italy.
08:55 – 09:05
Follow the Data: Timely and Targeted
In this presentation, Mr. Sherman is excited to introduce the ISIG Chips & Wafers Data Reports for the first time to our members.
The ISIG data reports are designed as a reliable and actionable resource for semiconductor companies; providing timely and targeted data to help our members make more informed decisions.
Simi Sherman
VP of Research
International Semiconductor Industry Group (I.S.I.G.)
Simi Sherman is Co-Founder and CEO of Chips & Wafers, a semiconductor data and research platform, and VP of Research with ISIG.
After six years at a Buy-Side global equities Hedge Fund, where he was a Partner and led semiconductor research, Simi Co-founded Chips & Wafers. Working together with ISIG, Chips & Wafers provides semiconductor companies and investors with timely and actionable data they utilize in making more informed decisions.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
08:55 – 09:15
Future of AI Hardware Enabled by Advanced Packaging
Chiplet architectures are fundamental to the continued economic viable growth of power efficiency of AI hardware and edge computing. The slowing of Moore’s law has also placed advanced packaging at the critical juncture of technology-architecture intersection driving unique product capabilities. New heterogeneous architectures like 2.5D architectures and 3D Hybrid bonded architectures driving AMD’s industry leading advanced technology roadmap to enable power, performance, area, and cost (PPAC) will be discussed. Other topics including Chiplets for AI, challenges and solutions for large chiplet modules etc. will also be discussed.
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD
Dr. Raja Swaminathan is the Corporate Vice President of Packaging at AMD, spearheading the development of AMD’s advanced packaging and heterogeneous integration roadmap. With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan’s expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple’s Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators. Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to their name, Dr. Swaminathan was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
08:55 – 09:05
Frank Bösenberg
Managing Director
Silicon Saxony
08:55 – 09:10
Track the Tariffs; Timely and Targeted Data
Update on Global Semiconductor Market Trends
In this presentation Mr. Sherman is excited to announce the launch of the ISIG Chips & Wafers Data Reports.
The ISIG Data reports provide timely and targeted data, used by semiconductor companies to make more informed decisions for their businesses.
Mr. Sherman will demonstrate the value of diving beyond the surface and exploring a more granular view of the available data, and show how timely tracking can help monitor the impact of global tariffs.
Simi Sherman
VP of Research
International Semiconductor Industry Group (I.S.I.G.)
Simi Sherman is Co-Founder and CEO of Chips & Wafers, a semiconductor data and research platform, and VP of Research with ISIG.
After six years at a Buy-Side global equities Hedge Fund, where he was a Partner and led semiconductor research, Simi Co-founded Chips & Wafers. Working together with ISIG, Chips & Wafers provides semiconductor companies and investors with timely and actionable data they utilize in making more informed decisions.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
08:56 –
Opening Ceremony Overview of the Southeast Asian Semiconductor Industry Landscape Strategic Focus: Aligning with Malaysia’s Investment Strategy
Day 1 Morning Session Moderator
Yu-Po Wang, Ph.D.
Vice President, R&D Center
SPIL
Yu-Po Wang received Ph.D. in Mechanical Engineering from Binghamton University, State University of New York , U.S.A.
In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore.
He joins SPIL in 1998 and leads the R&D Package Application and Technology Support Team in substrate/package design, material characterization and advanced package.
Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has over 83 patents in US.
IEEE Electronics Packaging Society Board of Governors (BoG) member from 2025
IEEE Electronics Packaging Society Taipei Chapter Executive Committee from 2025
Wuxi IC Innovation and Development Summit Opening Ceremony 无锡集成电路创新与发展峰会开幕式
Speaker Session: “Smart Semiconductor Manufacturing: The Next Frontier”
Silicon Photonics Session
09:00 – 09:05
Welcome Speech by Government 政府开幕致辞
Dr. Ali Amur Ali Al Shidhani
Undersecretary of Communications and Information Technology
Ministry of Transport, Communications and Information Technology (MTCIT)
Company Profile
The Ministry of Transport, Communications and Information Technology supervises a number of national projects Such as, the ports and airports that connect the Sultanate with the world and contribute to diversifying the sources of income and achieve sustainable development in various economic, industrial, commercial, tourism and other fields.
These efforts are accompanied with the Ministry’s relentless strive to make the transport and logistics sectors in the Sultanate have a global reputation, to be the second source of national income and within the top ten in logistics performance at the international level by 2040.
At the local level, side by side with all these projects, The Ministry works to regulate land and sea transport industries by issuing the needed legislations.
The Ministry is also the responsible body for formulating and implementing the government digital strategies and programs in the Sultanate of Oman. Its main mission is to raise the level of efficiency in government performance, support innovation in service delivery, and enhance spending and economic growth through the use of information and communication technology.
Ellen Wendelin-Loh
GM Southeast Asia
I.S.E.S.
Ellen Wendelin is the General Manager of the International Semiconductor Executive Summit Southeast Asia (I.S.E.S. SEA), a role in which she excels at bringing together industry leaders to foster collaboration within the semiconductor sector. With a passion for orchestrating high-profile summits that merge innovation, strategy, and growth, Ellen is known for her expertise in event management, business development, and networking. She has successfully led initiatives that connect semiconductor executives globally, creating strategic partnerships and opportunities that drive the future of the industry. Her work is centered on delivering exceptional event experiences and fostering meaningful dialogue among stakeholders.
Company Profile
Established in 2010, the International Semiconductor Industry Group (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today!
09:00 – 09:20
Keynote
We power AI: High density solutions for AI accelerators
In today’s rapidly evolving technological landscape, the demand for cutting-edge Artificial Intelligence (AI) solutions has never been greater. At the heart of these innovations lies an often-overlooked yet crucial component: power. As a leader in the semiconductor industry, we are at the forefront of powering AI from grid to core. This approach ensures that every stage of the power conversion process is optimized to meet the stringent demands of AI data centers. Enabling efficient power conversion from grid to core is essential for achieving superior power densities, thereby enhancing performance/watt while reducing the total cost of ownership (TCO). In this talk, we will focus on the final power conversion step, specifically the second stage down to the core voltage. Our power modules, which enable true vertical power delivery, significantly reduce power delivery network losses, thereby increasing overall system efficiency. Infineon high density solutions push the power density envelope without compromising thermal performance. Additionally, we will talk about our new quad module and demonstrate the benefits of its vertical power flow through chip embedding.
Athar Zaidi
SVP & GM, Power ICs and Connectivity Systems
Infineon Technologies AG
Athar Zaidi is a SVP/GM at Infineon Technologies where he manages Power ICs and Connectivity Systems (PCS) Business Line under Power and Sensor Systems (PSS) Division. Athar joined Infineon in 2016, prior to that he held leadership positions at Dialog Semiconductors, Maxim Integrated and Semtech Corporation where he managed global semiconductor businesses focusing on power management in Enterprise, Consumer, Industrial, Telecom and Automotive space. Athar has an MBA from UC Berkeley and Dual MS in Mechanical and Computer Engineering from North Carolina State University.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
09:00 – 09:25
Keynote
Glass Core Substrate: Next Gen Advanced Packaging Technology
Advanced packaging is enabling unprecedented levels of product performance as logic and memory chiplets are connected in unique architectures merging back-end silicon fabrication with package assembly. To meet future scaling, high speed signaling and power delivery needs, the package substrate must evolve beyond the capabilities offered by organic substrates. Glass substrates contain the
mechanical, physical and optical properties that allow for more transistors to be delivered in a package, providing better scaling and enabling the assembly of larger chiplet complexes. Intel is driving glass substrate technology and supply chain for advanced packaging solutions and plans to deliver this breakthrough innovation to the market in the second half of this decade.
Hamid Azimi, Ph.D.
Chairman of the Board
International Semiconductor Industry Group (I.S.I.G.)
Dr Hamid Azimi, formerly Corporate VP, Director of Substrate Packaging TD of Intel. He was responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
09:00 – 09:30
Keynote
GenAI in Semiconductor Manufacturing
Breakthrough in AI capabilities will revolutionize every aspect of human life, from autonomous vehicles, healthcare, natural disaster prediction to smart manufacturing. As AI model parameters increase, the model capability and accuracy increases, but the complexity requires more memory for training. Micron’s high bandwidth memory products lead the industry for AI workloads. Moreover, Micron is harnessing the power of AI to transform our business. From close to 10 years of AI/ML journey, Micron has demonstrated significant gains across manufacturing operation and business functions use cases, e.g., AI powered scheduling and simulation, AI assisted virtual engineer, image analytics for process control and yield improvement and AI powered productivity solutions, etc..
Koen De Backer
CVP Smart Manufacturing & AI
Micron Technology, Inc.
Koen De Backer is the Corporate Vice President of smart manufacturing and artificial intelligence at Micron Technology. He is responsible for driving Micron’s smart manufacturing initiatives and digital operations including capabilities with IoT, artificial intelligence, advanced analytics, cognitive computing and machine learning to enhance our business, global operations and product development.
Prior to joining Micron, Koen led large-scale operations projects for more than a decade to help clients reduce inefficiencies and achieve excellence in manufacturing, procurement, supply chain and support functions. Most recently, Koen was a Partner at McKinsey & Company where he steered the semiconductor consulting practice in Southeast Asia and was one of the firm’s leading experts on applying artificial intelligence and automation techniques across operations and support functions such as finance, human resources and procurement. Additionally, Koen consulted with high-tech global clients while working at Deloitte Consulting, Altran Europe and CSC.
Koen holds a master’s degree in business administration from INSEAD and master’s degrees in both industrial management and electromechanical engineering from Katholieke Universiteit Leuven.
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
09:00 – 09:35
Registration
09:00 – 09:10
Opening Videos 宣传片播放
Salah Nasri
CEO & Co-Founder
I.S.E.S.
Salah Nasri is the CEO & Co-Founder of the International Semiconductor Executive Summits (ISES), a division of the International Semiconductor Industry Group Ltd. an influential organization within the semiconductor industry. With extensive experience in the sector, Nasri has played a pivotal role in fostering global collaboration among semiconductor leaders. Under his leadership, ISES has become a premier platform for industry executives to connect, share insights, and drive innovation across various regions including the United States, Europe, Asia, and the Middle East.
Salah Nasri has been instrumental in expanding the reach and impact of ISES, organizing significant events that bring together decision-makers from across the semiconductor ecosystem. These events provide opportunities for networking, collaboration, and the exchange of ideas crucial for advancing the industry in areas such as semiconductor manufacturing, MEMS, AI, automotive electronics, and more.
His leadership has not only enhanced the visibility of ISES globally but also strengthened partnerships with key industry players, ensuring that ISES remains at the forefront of semiconductor innovation and development. Salah Nasri has previously worked at Goldman Sachs’s, Credit Suisse and International Business Development Group. Salah Nasri graduated from Oxford University and Loughborough University in International Relations and Economics. In 2024, Salah Nasri became a Stanford University Alumni after completing the Stanford Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today!
Next Generation Power Electronics Research & Development
09:10 – 09:30
Global Semiconductor Overview & Landscape Understanding
Salah Nasri
CEO & Co-Founder
I.S.E.S.
Salah Nasri is the CEO & Co-Founder of the International Semiconductor Executive Summits (ISES), a division of the International Semiconductor Industry Group Ltd. an influential organization within the semiconductor industry. With extensive experience in the sector, Nasri has played a pivotal role in fostering global collaboration among semiconductor leaders. Under his leadership, ISES has become a premier platform for industry executives to connect, share insights, and drive innovation across various regions including the United States, Europe, Asia, and the Middle East.
Salah Nasri has been instrumental in expanding the reach and impact of ISES, organizing significant events that bring together decision-makers from across the semiconductor ecosystem. These events provide opportunities for networking, collaboration, and the exchange of ideas crucial for advancing the industry in areas such as semiconductor manufacturing, MEMS, AI, automotive electronics, and more.
His leadership has not only enhanced the visibility of ISES globally but also strengthened partnerships with key industry players, ensuring that ISES remains at the forefront of semiconductor innovation and development. Salah Nasri has previously worked at Goldman Sachs’s, Credit Suisse and International Business Development Group. Salah Nasri graduated from Oxford University and Loughborough University in International Relations and Economics. In 2024, Salah Nasri became a Stanford University Alumni after completing the Stanford Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today!
09:10 – 09:40
Future Packaging/System Challenges for AI Data Centers
Artificial Intelligence is the largest technology transformation since Internet revolutionized communication and business. This transformation has required advancement in Si, Memory, Packaging, and System technologies. In this talk, the packaging and system technology challenges will be presented.
Babak Sabi, Ph.D.
VP of Technology
AWS Annapurna Labs
Dr. Babak Sabi is VP of Technology at AWS/Annapurna Lab. Babak joined AWS in 2024 after 40 years in Intel. Babak was Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development. During Babak’s tenure in ATTD 2.5D and 3D Advanced Packages were developed and ramp to high Volume Manufacturing. Additionally ATTD team made many advancement in Substrate and Test Technology.
Prior to leading ATTD, Babak oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.
Babak joined Intel in 1984 after receiving Babak his Ph.D. in solid state electronics from Ohio State University in 1984.
Company Profile
Launched in 2006, Amazon Web Services (AWS) began exposing key infrastructure services to businesses in the form of web services — now widely known as cloud computing. The ultimate benefit of cloud computing, and AWS, is the ability to leverage a new business model and turn capital infrastructure expenses into variable costs. Businesses no longer need to plan and procure servers and other IT resources weeks or months in advance. Using AWS, businesses can take advantage of Amazon’s expertise and economies of scale to access resources when their business needs them, delivering results faster and at a lower cost.
Today, Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. With data center locations in the U.S., Europe, Singapore, and Japan, customers across all industries are taking advantage of our low cost, elastic, open and flexible, secure platform.
09:10 – 09:30
Keynote
Gustav Kalbe
Acting Director in Directorate C “Emerging and Enabling Technologies
EU Commission
Company Profile
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
09:10 – 09:30
Prof. Jörg Schulze
Institute Director
Fraunhofer Institute for Integrated Systems and Device Technology (IISB)
Company Profile
As one of 76 institutes of the Fraunhofer-Gesellschaft, the IISB conducts research for customers from industry or within the framework of publicly funded projects. The aim is to develop excellent solutions for our partners as one of the leading research institutions in the field of power electronics and to set new technological standards. Central fields of application are electromobility, aerospace, and sustainable energy supply.
Company Products & Services
The institute offers broad expertise in wide-bandgap semiconductors and high-efficiency power electronics. Device know-how merges here with complex system development. For silicon carbide (SiC), the institute has the complete technological process chain at its disposal – starting with materials, via components and modules, all the way to integration in power electronic systems.
09:10 – 09:15
Introduction of Government Officials and VIPs 介绍与会领导 及嘉宾
09:10 – 09:30
Keynote
AI Inspired. Systems Accelerated.
The shifting landscape of technology requires a multi-faceted foundry approach to keep pace with increasing workload of data centers and high-performance computing (HPC) systems. The use of chiplets and “system of chips” offer a way to unlock exponential improvements in semiconductor products. Intel Foundry is addressing these needs with decades of experience in world class manufacturing, innovative advancements in packaging and system technology optimization, delivered through a more resilient and more sustainable global supply chain. Join us as we outline how Intel Foundry is tackling the next wave of semiconductor breakthroughs.
Kevin O’Buckley
SVP and GM Foundry Services
Intel Foundry
Kevin O’Buckley is senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet standards and software, as well as U.S.- and Europe-based capacity.
Prior to joining Intel, O’Buckley was senior vice president of Marvell’s Compute and Custom Solutions Engineering teams, developing advanced technology chips for infrastructure applications including artificial intelligence and machine learning, 5G wireless, and data center compute and networking. While at Marvell he also served as senior vice president and general manager of the company’s ASIC business, and he was a member of the board of directors at Marvell Government Solutions, developing semiconductor solutions for aerospace and defense customers.
O’Buckley joined Marvell as part of its 2019 acquisition of Avera Semiconductor, where he served as chief executive. He has also held various executive engineering and business leadership roles at Global Foundries and at IBM, where he served for more than 17 years leading technology development and manufacturing organizations.
Company Profile
Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards. Intel Foundry is an independent foundry business that meets our customers’ unique product needs, including our industry-leading sort and test capabilities. Whether front-end or back-end design is needed, when integrated with our foundry co-optimized development kits based on industry-standard tools and flows and powerful silicon IPs, the result is true innovation.
09:15 – 09:35
Keynote
Christina Strohrmann, Ph.D.
Director Engineering, Advanced Products
Bosch Sensortec
Dr. Christina Strohrmann is an engineering director and thought leader in advanced sensor technologies, currently serving as Director of Engineering Advanced Products at Bosch Sensortec. With over a decade of experience spanning MEMS, TMR, optical sensors, and AI-driven product development, she is responsible for technology management and leading cross-functional teams from early-stage innovation to mass production. Named an “Emerging Leader” by the SEMI MEMS & Sensors Industry Group, she combines deep technical expertise with strategic vision, having driven groundbreaking advancements in dual-core sensors, automated data pipelines, and smart sensing for consumer electronics.
Company Profile
Bosch Sensortec is a wholly owned subsidiary of the Bosch Group, dedicated to developing and marketing a comprehensive portfolio of microelectromechanical systems (MEMS)-based sensors and solutions for consumer electronics. Headquartered in Reutlingen, Germany, the company was founded in 2005 and has since become a global leader in MEMS sensor innovation. Bosch Sensortec’s product offerings include motion sensors, environmental sensors, smart sensors, and software solutions that power a wide range of devices such as smartphones, wearables, drones, and IoT applications.
By leveraging Bosch’s decades of experience and leadership in automotive MEMS sensor technology, Bosch Sensortec brings industrial-grade performance to the consumer market. With a focus on miniaturization, energy efficiency, and intelligent sensing, the company enables smart, connected devices that respond to their environments with precision and reliability. Through continuous innovation and a strong global network, Bosch Sensortec plays a pivotal role in advancing next-generation sensor technologies for an increasingly digital and mobile world.
09:15 – 09:40
Keynote
Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry
The semiconductor industry is in the midst of a paradigm shift together with its applied systems triggered by digitalization accelerated by AI technology evolutions in all the systems like evident trends of electrifications and SDV (Software Defined Vehicle) in the automotive industry. As the magnitude and complexity of its applied systems grow exponentially, semiconductor solutions need to integrate more, execute faster with less power, and realize users much better development productivity. Renesas believes the challenge is resolved by building system-oriented solutions for integrations and improving UX (User Experience) values like easier to develop for users. The keynote speech addresses Renesas’ attempts with innovative technologies like chiplet and digitalization/virtualization for system development environment.
Shinichi Yoshioka
Senior Vice President and Chief Technology Officer
Renesas Electronics
Mr. Yoshioka serves as the Senior Vice President and CTO at Renesas. He was appointed to these roles in August 2019, from his experience and technological expertise of the products and the market following the years he has dedicated to Renesas.
He began his career in Hitachi, Ltd in 1986. Since Renesas Electronics Corporation was established in 2010 based on Hitachi, Mitsubishi Electric, and NEC Electronics, he has held many key roles, such as the Vice President of Automotive Control and Analog & Power Systems Business Division, Safety Solution Business Division, and the Senior Vice President of the Automotive Solutions Business Unit.
He has a Bachelor of Engineering degree in Applied Physics from the University of Tokyo and graduated from Stanford University with a Master of Science in Electrical Engineering.
Company Profile
Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.
A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
09:15 – 09:45
Keynote
The New Era in Si Photonics
AI has been extending its influence in nearly every aspect of our daily endeavors; but, the power consumption seems to be the accompanied pain as the industry continue to push for ever- increasing computing power.
Over the years, among other things, Si Photonics has been heralded as a breakthrough in power saving.
However, so far, it appears to lack large volume production for >100G optical solution.
The debut of the 200G CPO with MRM is the watershed for the new era in Si photonics.
This presentation will address the driving force of the new era along with the illustration of critical aspects in Si photonics device manufacturing, followed by the introduction of technology platforms that are intended to power the AI acceleration.
C.S. Yoo, Ph.D
Vice President, Research & Development / More-than-Moore Technologies
TSMC
C.S. is a 30+ years’ veteran of semiconductor industry.
Ever since joined TSMC, he has been working in various technology R&D fields and Operations.
He took various managerial positions in RD Process Module, SRAM, DRAM and Embedded DRAM.
CS also led TSMC Mask RD and Operation Division before taking the position of VP in Specialty Technology RD.
CS received his PhD in Chemical Engineering from WPI (Worcester Polytechnic Institute)
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
09:15 – 09:40
Welcome Address * 3 领导致辞
09:20 – 09:35
Huishan District People’s Government Promotion Speech 惠山区集成电路产业推荐
Jinfeng Ding 丁劲锋 无锡市惠山区高新技术企业协会副秘书长
09:20 – 09:40
Keynote
Sensors and Systems in an AI first world
It seems that everything today is an AI first device, but what does this mean? In this talk I will discuss some of the ways that AI is impacting how Google thinks about our hardware devices and the components within. I will talk through some of the growing systems level considerations for number of sensors, quality and precision of measurements as well as how compute is distributed to handle the various AI models that exist. The goal will be to give the audience an overview of what exists today as well as some possibilities of how they can help shape devices of tomorrow.
Michael Pate, Ph.D.
Director of Audio Technology Development
Dr. Michael Pate received advanced degrees from Texas Tech University and Denmark Technical University concentrating in the design of Class-D amplifiers for audio systems. After completing his Ph.D. work he began at Texas Instruments where he led the design of some of the highest power integrated Class-D amps on the market. From there Dr Pate moved to product definition roles at Cirrus Logic, Audience and Knowles Electronics where he focused on mixed signal audio, DSP and algorithms and MEMS microphones respectively. He now works at Google as the Director of Audio Technology Development where his team builds experiences like Active Noise Cancellation, Audio Magic Eraser, Clear Calling and many more.
Company Profile
A problem isn’t truly solved until it’s solved for all. Googlers build products that help create opportunities for everyone, whether down the street or across the globe. Bring your insight, imagination and a healthy disregard for the impossible. Bring everything that makes you unique. Together, we can build for everyone.
09:20 – 09:40
Future Packaging/System Challenges for AI Data Centers
Artificial Intelligence is the largest technology transformation since Internet revolutionized communication and business. This transformation has required advancement in Si, Memory, Packaging, and System technologies. In this talk, the packaging and system technology challenges will be presented.
Babak Sabi, Ph.D.
VP of Technology
AWS Annapurna Labs
Dr. Babak Sabi is VP of Technology at AWS/Annapurna Lab. Babak joined AWS in 2024 after 40 years in Intel. Babak was Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development. During Babak’s tenure in ATTD 2.5D and 3D Advanced Packages were developed and ramp to high Volume Manufacturing. Additionally ATTD team made many advancement in Substrate and Test Technology.
Prior to leading ATTD, Babak oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.
Babak joined Intel in 1984 after receiving Babak his Ph.D. in solid state electronics from Ohio State University in 1984.
Company Profile
Launched in 2006, Amazon Web Services (AWS) began exposing key infrastructure services to businesses in the form of web services — now widely known as cloud computing. The ultimate benefit of cloud computing, and AWS, is the ability to leverage a new business model and turn capital infrastructure expenses into variable costs. Businesses no longer need to plan and procure servers and other IT resources weeks or months in advance. Using AWS, businesses can take advantage of Amazon’s expertise and economies of scale to access resources when their business needs them, delivering results faster and at a lower cost.
Today, Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. With data center locations in the U.S., Europe, Singapore, and Japan, customers across all industries are taking advantage of our low cost, elastic, open and flexible, secure platform.
09:20 – 09:45
Opening Speeches
Overview of the Southeast Asian Semiconductor Industry Landscape
Strategic Focus: Aligning with Malaysia’s Investment Strategy
Zalina Zainol
Deputy Chief Executive Officer (Investment Development)
MIDA
Puan Zalina Zainol is the Deputy Chief Executive Officer of Investment Development at the Malaysian Investment Development Authority (MIDA), the country’s premier agency that creates new pathways for growth and development in the manufacturing and services sectors.
With a career spanning almost three decades at MIDA, she has held various senior positions, including Executive Director of Corporate Management Services, Executive Director of Strategic Planning (Services), and Director of the Corporate Communications Division.
Puan Zalina’s extensive experience also includes international postings, which have further enhanced her global perspective and understanding of investment trends. She served in MIDA’s New York and Boston offices, where she played a crucial role in attracting foreign direct investment to Malaysia.
As MIDA’s Deputy Chief Executive Officer for Investment Development, she continues to spearhead initiatives that support the country’s economic transformation and foster a vibrant and sustainable business environment.
Company Profile
MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 21 overseas offices. MIDA continues to be the strategic partner to businesses in seizing the opportunities arising from the technology revolution of this era.
Yb Jagdeep Singh Deo A/L Karpal Singh
Deputy Chief Minister II of Penang
Penang State Government
He holds a Degree in Law from University of Warwick, United Kingdom and admitted as an Advocate and Solicitor of the High Court in Malaya, practicing criminal law at Karpal Singh & Co. in Penang.
Presently, YB Tuan Jagdeep was the Deputy Chief Minister II of Penang and oversees the portfolio of Human Capital Development, Science, and Technology in the State after elected as the member of State Assemblyman of Penang (ADUN) in August 2023. He joined Democratic Action Party (DAP) in 1994 and started his journey as an elected representative of the people since 2008. In 2008 and 2013, he was elected as ADUN in Penang and, he was appointed as Penang State Executive Councillor (Exco) for Housing and Town and Country Planning in 2013. In 2018, he was re-appointed Exco for Local Government, Housing and Town & Country Planning with the added responsibility of heading the onerous Local Government portfolio in overseeing both Penang City Councils – Majlis Bandaraya Pulau Pinang and Majlis Bandaraya Seberang Perai.
Driving Innovation and Ensuring Domestic Competitiveness
Ahmad Bahai, Ph.D.
Senior Vice President and Chief Technology Officer
Texas Instruments
Dr. Ahmad Bahai is the Senior Vice President and Chief Technology Officer (CTO) at Texas Instruments, where he leads groundbreaking innovation, corporate research, and Kilby Labs.
He also serves as a Professor of the Practice at the Massachusetts Institute of Technology (MIT), is an IEEE Fellow, and is a member of the Industrial Advisory Committee for the CHIPS Act. Previously, Dr. Bahai contributed to the President’s Council of Advisors on Science and Technology’s semiconductor working group. From 2017 to 2022, he was an Adjunct Professor at Stanford University and, from 2001 to 2010, a Professor in Residence at UC Berkeley.
Dr. Bahai’s technology leadership experience includes roles as Director of Research Labs and CTO at National Semiconductor, Technical Manager of a research group at Bell Laboratories, and Founder of Algorex, a communications and acoustic IC and systems company acquired by National Semiconductor.
He has authored over 80 publications in IEEE/IEE journals and holds more than 40 patents related to systems and circuits. Dr. Bahai earned a Master of Science in Electrical Engineering from Imperial College, University of London, and a Ph.D. in Electrical Engineering from the University of California, Berkeley.
Company Profile
Texas Instruments is a global semiconductor leader focused on designing and manufacturing analog and embedded processing chips that drive electronics everywhere. With over 90 years of innovation, Tl is powering industries across automotive, industrial, communications, and personal electronics.
As part of its commitment to energy efficiency and performance, Tl is advancing Gallium Nitride (GaN) power solutions to enable smaller, faster, and more efficient systems GaN technology allows for higher power density and switching frequencies compared to traditional silicon-based power devices, making it ideal for next-generation electric vehicles,renewables, data centers, and industrial applications.
In 2024, Tl announced expanded GaN manufacturing capabilities at its Richardson, Texas facility, where it will now produce both GaN and silicon semiconductors on a single 300mm wafer line. This investment strengthens TI’s position as a fully integrated GaN supplier — from design to fabrication — ensuring quality, supply assurance, and performance leadership.
With decades of manufacturing excellence and a focus on advancing power electronics, Texas Instruments is helping to engineer a more sustainable and connected future through GaN innovation.
09:30 – 10:00
Why “Middle East” – GSME’s Journey in Search of New Talent & Hub for Semiconductor Design & Manufacturing
Semiconductors are the backbone of 4th industrial revolution enabling us to live in a smart & connected world. Connected world, Digitizing Auto Industry, social-media revolution, industrial automation, & AI decision making is spiking the demand of Integrated Circuits. Now when semiconductors are becoming the new “Oil”, fight over its control is also getting intense. Trade-war between US & China is drifting to become China-vs-West issue to gain controls over semiconductor manufacturing market. Semiconductor industry is experiencing shortage of skilled engineers in the field of microelectronics, IC design & manufacturing. GSME started its efforts over a year ago to identify & establish new hubs to support semiconductor ecosystem. GCC countries in Middle East can play a significant role in filling in the gap industry is experiencing.
Farhat Jahangir
Co-founder & CEO
GS Microelectronics
Farhat serves as the CEO at GS Microelectronics. Prior to joining GSME he was serving as VP & GM of Manufacturing at Onsemi, where he was managing ON Semiconductor’s largest 300mm Fab in East-Fishkill, New York for over two years. Farhat joined ON Semiconductor through Quantenna Communication acquisition in March 2019 where he was serving as SVP of Manufacturing, Operations & Quality for six plus years. Farhat played a pivotal role in making Quantenna successful through manufacturing optimization, process & yields improvements, cost reductions, & significant margins improvement. Farhat’s efforts enabled Quantenna’s successful IPO in October 2016.
Farhat has over 25 years of successful experience in global manufacturing, Fab & OSAT operations, supplier management, building partnerships, and the assurance of quality & reliability processes. Prior to joining ON Semi/Quantenna Communications, he headed semiconductor manufacturing operations and quality functions at Synerchip Corporation (acquired by Silicon Image) & SiTime (a MEMS based timing solution company). His contributions towards building and restructuring company’s lower margin product lines to higher margins, enabled market penetration and corporate margins growth in the companies he served. Farhat also held various engineering and management positions in the areas of semiconductor manufacturing in companies like Texas Instruments, Cypress Semiconductor, Silicon Image & IDT.
Farhat holds a Master of Science degree in Electrical Engineering from University of Arkansas at Fayetteville.
Maryam Al-Bulushi
Senior Mgr. Business Operations & Corporate Affairs
GS Microelectronics
Ammar Al-Kalbani
Lead IC Design & Verification Engineer
GS Microelectronics
Ammar Al-Kalbani
Lead IC Design & Verification Engineer
GS Microelectronics
09:30 – 09:55
Keynote
Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era
The advancements in semiconductor manufacturing and packaging technologies are revolutionizing the semiconductor industry. Splitting a SoC chip into individual chips by function brings improved yields, shorter design, development cycles, and cost reduction. However, packaging structures are becoming more complex, leading to increased design complexity. To overcome these challenges, the entire industry should promote the integration of front-end and then back-end processes and establish a chiplet ecosystem.
Dr. Yasumitsu Orii
Senior Managing Executive Officer, 3D Assembly Division
Rapidus
Education: Osaka Univ. Osaka, Japan Bachelor 1986
Graduate School of Osaka Univ. Osaka, Japan PhD 2012
Dr. Yasumitsu Orii joined IBM Japan in 1986 and was a leading expert on Flip Chip organic packages, which had contributed to the performance improvements and miniaturization of such products as servers, laptop computers, and HDDs. The packaging technology is becoming more important for next generation server products as Moore’s Law reaches its limits. His flip chip expertise extended into many related areas. Initially, he was a pioneer of flip chip on FPC (Flexible Printed Circuit) for HDDs, which allowed the read/write amplifier ICs to be mounted on the suspension and much closer to the GMR head. Later, he developed the C2 (Chip Connection) technology that supported low-cost 50-μm-pitch flip chip bonding for the commodity consumer electronics market and it was licensed to a company in Taiwan. At IBM Research Tokyo, he was leading the next generation flip chip organic package, 3D-IC projects and Neuromorphic Computing for IBM Servers and creating new technologies under a Joint Development Program involving many leading Japanese materials companies. He left IBM in 2014 and joined NAGASE & CO., LTD. He established “New Value Creation Office” under the direct control of the president and launched the material informatics software as a service in 2020. He left NAGASE and he joined Rapidus Corporation in 2022/Dec. Now he is the senior managing executive officer to lead the 3D Assembly Division.
Strengthening Power Manufacturing Operations
Mobility & AI Electrification Developments
09:35 – 09:55
Keynote
STMicroelectronics
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
09:35 – 09:55
Keynote
CRRC Automotive Power Semiconductor Technology Innovation and Industrialization 中车汽车功率半导体技术创新与产业化
Ding Rongjun
Academician of Chinese Academy of Engineering, Chief Engineer CRRC 丁荣军 院士 / 中车总工程师
CRRC
Ding Rongjun, Academician of the Chinese Academy of Engineering, expert in power electronics and control technology, recipient of the State Council Special Allowance; member of the National Industry Foundation Committee, Director of the National Key Laboratory of Power Semiconductors and Integrated Technology, Chairman of the Power Semiconductor Industry Alliance, and Editor-in-Chief of the academic journal Locomotive Electric Drive; representative of the 18th and 19th National Congresses of the Communist Party of China; currently serving as Chief Scientist of CRRC (China Railway Rolling Stock Corporation) and Dean of the School of Mechanical and Vehicle Engineering at Hunan University.
Academician Ding has long been engaged in innovative research and technology transfer in the fields of power electronic devices, traction converters, and AC drive systems. He established a standards system suited to China’s national conditions that aligns with international technical models. His contributions have played a significant role in China’s breakthrough development from conventional rail to heavy-duty rail and from regular-speed to high-speed rail. He has presided over or participated in more than 30 major national, provincial, and ministerial-level research projects, received 1 National Invention Award, 2 Second Prizes for National Scientific and Technological Progress, 3 Special Prizes, 8 First Prizes, and 4 Second Prizes at the provincial and ministerial levels. He has also been honored with the “Ho Leung Ho Lee Science and Technology Award,” “Zhan Tianyou Science and Technology Achievement Award,” “Mao Yisheng Science and Technology Award,” designation as a national-level talent in the “New Century Hundreds-Thousands-Talents Project,” and titles such as “National Model Worker,” “Most Beautiful Railway Technology Worker,” and one of the “50 Honored Figures of China’s Subway Development.”
丁荣军，中国工程院院士，电力电子及控制技术专家，国务院特殊津贴获得者；国家产业基础委员会委员、功率半导体与集成技术全国重点实验室主任、功率半导体行业联盟理事长、学术期刊《机车电传动》主编；中国共产党十八大、十九大代表；现任中国中车首席科学家，湖南大学机械与运载装备学院院长。
丁院士长期从事电力电子器件、牵引变流和交流传动系统的创新研究和成果转化，创建了适合我国国情的标准体系并与国际接轨的技术模式，为中国铁路从普载到重载、从常速到高速的突破发展做出了重大贡献。先后主持、参与国家、省部级重大科研项目30余项，获国家发明奖1项、国家科技进步二等奖2项、省部级特等奖3项、一等奖8项、二等奖4项，获“何梁何利科学技术奖”、“詹天佑科技成就奖”、“茅以升科学技术奖”、“新世纪百千万人才工程国家级人选”、“全国劳动模范”、“最美铁道科技工作者”和”中国地铁50年致敬人物“等荣誉称号。
09:35 – 10:00
The Blueprint for Sustainable Fabs
How AI machine learning and others digital technology can accelerate the path to net zero of Semicon industry.
Henri Berthe
Semiconductors Segment VP • Sales
Schneider Electric
Henri Berthe, a seasoned professional with 20 years of experience at Schneider Electric, leads the global Semiconductor Segment, driving sustainability and digitization. Previously, he was VP of Universal Enclosures, overseeing a global business focused on high-quality, standard, and connected enclosures. Before that, he served as VP of Digital Energy in MENA and Africa, deploying digital technologies and electrification solutions. Henri’s expertise spans energy management, digital power, and building management systems. He holds a master’s degree in Sales and Marketing from ESTA Belfort, France. In May 2024, he joined the Regional Advisory Board of SEMI South-East Asia and the Global Counsel of the Semiconductor Climate Consortium.
Company Profile
Schneider Electric is the global industrial technology leader, driving sustainable impact.
We are a powerhouse of electrification, automation, and digitization. The unique combination of our electrical and automation technologies intersect with our leadership in software, services and sustainability to rapidly accelerate sustainable impact.
Schneider’s purpose is to create Impact by empowering all to make the most of our energy and resources, bridging progress and sustainability for all. At Schneider we call this Life Is On.
Our mission is to be the trusted partner in Sustainability and Efficiency.
Company Products & Services
Energy management, Industrial Automation, Sustainability and Consulting Services, Industrial Software.
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