AI-Powered Innovation: Driving the Next Wave of Semiconductor Breakthroughs

Empowering Europe’s Semiconductor Future: Innovation, Integration & Independence

Enabling the Future of AI: Innovations in HBM, Advanced Packaging, and Power Semiconductors

Empowering Europe’s Semiconductor Future: Innovation, Integration & Independence

Enabling Intelligence at the Edge: MEMS and Sensors Powering the AI Era

Enabling the Future of AI: Innovations in HBM, Advanced Packaging, and Power Semiconductors

European Role in the Global Semiconductor Industry

Strategy and role for Data Center, AI and EV?

EU WBG Pilot Line

I.S.E.S. Middle East 2023

Empowering a Sustainable Future: Innovation, Collaboration and Navigating Challenges in Power Electronics Industry

Empowering a Sustainable Future: Innovation, Collaboration and Navigating Challenges in Power Electronics Industry

Shaping an AI-Powered Future: Driving Semiconductor Innovation with Silicon Photonics and Advanced Packaging and Testing, Along With I.S.I.G. 15th Year Anniversary Exclusive Edition – Advanced Packaging Legends Forum

Shaping an AI-Powered Future: Driving Semiconductor Innovation with Silicon Photonics and Advanced Packaging and Testing, Along With I.S.I.G. 15th Year Anniversary Exclusive Edition – Advanced Packaging Legends Forum

Demonstrating the Impact of MEMS and Sensors and Strategic Collaboration & Investments Needed for Further Adoption

I.S.E.S. China 2024

AI-Powered Innovation: Driving the Next Wave of Semiconductor Breakthroughs

I.S.E.S. China 2024

I.S.E.S. China 2024

I.S.E.S. SEA 2024

I.S.E.S. SEA 2024

07:00 – 08:00

Registration

07:15 – 08:15

Registration

07:30 – 08:30

Registration

07:30 – 08:30

Registration

07:30 – 08:10

Registration

07:30 – 08:15

Registration

November 5 | Day 1: Innovations and Trends in Advanced Manufacturing

Officials(官方活动)

08:00 – 08:55

Registration & Welcome Coffee

08:00 – 08:40

Registration

08:00 – 08:25

Welcome Speech

Salah Nasri

CEO & Co-Founder

I.S.E.S.

08:00 – 08:40

Registration

08:10 – 08:30

ISIG 15th Year Anniversary Welcome

Salah Nasri

CEO and Co-Founder

International Semiconductor Industry Group (I.S.I.G.)

Saeed Amidi

Founder & CEO

Plug and Play Tech Center

Rouzbeh Borhani

Head of Semiconductors

Plug and Play Tech Center

Rouzbeh Borhani

Head of Semiconductors

Plug and Play Tech Center

08:15 – 08:45

Registration

08:15 – 08:25

Understand the Present; Predict the Future

In this presentation, Mr. Sherman will present examples from the ISIG Chips & Wafers data reports that demonstrate the depth and scope of the information we provide to our customers.
Whether you are a Fabless company, an equipment manufacturer or an OSAT our reports provide the timely data you need to make better decisions. 

Simi Sherman

VP of Research

International Semiconductor Industry Group (I.S.I.G.)

08:15 – 08:30

I.S.I.G. 15th Year Anniversary Opening

Salah Nasri

CEO and Co-Founder

International Semiconductor Industry Group (I.S.I.G.)

November 6 | Day 2: Sustainable Practices and Future Directions

08:20 – 08:55

Registration & Welcome Coffee

Scaling AI Performance & Chiplet Architectures

08:30 – 08:55

Japan’s Policy Trends in Semiconductor and Digital Industry Strategy

Two years have passed since the formulation of the Semiconductor and Digital Industry Strategy in June 2021, the Ministry of Economy, Trade and Industry revised its Semiconductor and Digital Industry Strategy in June 2023.

In this strategy, in the semiconductor sector, Japan aims to achieve total sales of 15 trillion yen or more for domestic semiconductor manufacturing companies by 2030, and while step 1 is developing semiconductor manufacturing capability, step 2 will bethe establishment of manufacturing technology for 2nm and beyond logic semiconductors. Finally, it will work on the development of future, game-changing technologies, such as photonics-electronics convergence in step 3.

In this presentation, specific initiatives such as research and development, human resource development, and international collaboration based on the Semiconductor and Digital Industry Strategy will be explained, along with the latest policy trends.

Hisashi Kanazashi photo

Hisashi Kanazashi

Director, IT Div

Ministry of Economy, Trade and Industry (METI)

08:30 – 08:50

Welcome Speech

Salah Nasri

CEO and Co-Founder

International Semiconductor Industry Group (I.S.I.G.)

08:30 – 08:50

Keynote

AI use cases in semiconductor data analytics and quality management

AI agents are already making waves by improving known applications that long been used by engineers, developers and every day ordinary users. Semiconductor manufacturing alike has been impacted in the areas of data analytics , traceability, commonality study , corner case identification and more. this presentation will go over some of those AI use cases.

Bizhan Delgoshaei

Head of Custom Silicon Engineering Operation

Google

08:30 – 08:50

M.S.W.S., I.S.I.G. and P&P Welcome

Salah Nasri

CEO and Co-Founder

International Semiconductor Industry Group (I.S.I.G.)

Saeed Amidi

Founder & CEO

Plug and Play Tech Center

Rouzbeh Borhani

Head of Semiconductors

Plug and Play Tech Center

Rouzbeh Borhani

Head of Semiconductors

Plug and Play Tech Center

08:30 – 08:45

M.S.W.S. & I.S.I.G. Welcome

Fostering High Tech Innovation & Expansions Regionally

Data Centers & AI: Challenges and Opportunities in Power Electronics

08:35 – 08:55

Keynote

Next-Generation GaN/SiC To Accelerate Electrification

New developments in both GaN and SiC combined with new power systems architecture are creating new opportunities to accelerate electrification of our planet across multiple, major markets including electric transportation, renewables, energy storage and more. Technology details, application examples and market implications will be presented.

Gene Sheridan

CEO

Navitas Semiconductor

08:35 – 08:50

Welcome

Saeed Amidi

Founder & CEO

Plug and Play Tech Center

Day 2 Morning Session Moderator

Kuan-Neng Chen, Ph.D.

Dean/Chair Professor

NYCU

Shaping an AI-Powered Future

08:40 – 09:10

AI Powered Innovation: Driving the Next Wave of Semiconductor Breakthrough

M. Ashkan Seyedi, Ph.D.

Director, LinkX Products

NVIDIA

08:40 – 08:55

ISIG 15th Year Anniversary Welcome Address

Salah Nasri

CEO and Co-Founder

International Semiconductor Industry Group (I.S.I.G.)

Front End Technology

08:45 – 09:10

Keynote

The Challenge of Speed – The Rapidus Model for a New Manufacturing Era

As the miniaturization of advanced logic processes continues, the time from design to commercialization is lengthening.
This is due to the increasing difficulty of the manufacturing process, design, and verification associated with the growing complexity of device structures. However, LSIs, such as processors and accelerators for AI, are evolving at a rapid pace and must be commercialized in a short period of time to meet time- to-market requirements. We will introduce the Rapidus model, which solves this problem and achieves short TAT manufacturing.

Kazunari Ishimaru photo

Kazunari Ishimaru

Senior Managing Executive Officer, Silicon Technology Division, IEEE Fellow

Rapidus

08:45 – 09:05

Keynote

Francesco La Via

Research Director

CNR-IMM Institute for Microelectronics and Microsystems

08:50 – 09:10

Keynote

Ken Diest

Research Manager and Tech Lead

Meta

The Future of MEMS and Sensors in a Connected World

08:55 – 09:15

Keynote

Sensing Hope at the Edge

Machine Learning at THE EDGE. Nearly every company, investor, product launch, and presentation these days is about “ML at The Edge” as the next, great technology wave. And where there is a wave, there are riders, hoping to cash in. For me, sensors are clearly the edge, breaking the boundary between the physical and digital worlds. Driven by cost, size, power constraints, MEMS is the technology sensing the edge. And with so much data being collected, doing the analysis at the edge with ML decreases latency and saves power on data transmission. But where is the money? I’ll talk about the forces at play, large and small, and offer some experiences from MEMS at the edge. And also share my hope that beyond the hype, there is good to be done. That new understanding from all the data and algorithms will help us to leave the planet better than we found it.

Peter Hartwell, Ph.D.

VP, Engineering

TDK InvenSense

08:55 – 09:05

Follow the Data: Timely and Targeted

In this presentation, Mr. Sherman is excited to introduce the ISIG Chips & Wafers Data Reports for the first time to our members.

The ISIG data reports are designed as a reliable and actionable resource for semiconductor companies; providing timely and targeted data to help our members make more informed decisions.

Simi Sherman

VP of Research

International Semiconductor Industry Group (I.S.I.G.)

08:55 – 09:15

Future of AI Hardware Enabled by Advanced Packaging

Chiplet architectures are fundamental to the continued economic viable growth of power efficiency of AI hardware and edge computing. The slowing of Moore’s law has also placed advanced packaging at the critical juncture of technology-architecture intersection driving unique product capabilities. New heterogeneous architectures like 2.5D architectures and 3D Hybrid bonded architectures driving AMD’s industry leading advanced technology roadmap to enable power, performance, area, and cost (PPAC) will be discussed. Other topics including Chiplets for AI, challenges and solutions for large chiplet modules etc. will also be discussed.

Raja Swaminathan, Ph.D.

CVP, Advanced Packaging

AMD

08:55 – 09:05

Frank Bösenberg

Managing Director

Silicon Saxony

08:55 – 09:10

Track the Tariffs; Timely and Targeted Data

Update on Global Semiconductor Market Trends

In this presentation Mr. Sherman is excited to announce the launch of the ISIG Chips & Wafers Data Reports.

The ISIG Data reports provide timely and targeted data, used by semiconductor companies to make more informed decisions for their businesses.

Mr. Sherman will demonstrate the value of diving beyond the surface and exploring a more granular view of the available data, and show how timely tracking can help monitor the impact of global tariffs.

Simi Sherman

VP of Research

International Semiconductor Industry Group (I.S.I.G.)

08:56 –

Opening Ceremony Overview of the Southeast Asian Semiconductor Industry Landscape Strategic Focus: Aligning with Malaysia’s Investment Strategy

Day 1 Morning Session Moderator

Yu-Po Wang, Ph.D.

Vice President, R&D Center

SPIL

Wuxi IC Innovation and Development Summit Opening Ceremony 无锡集成电路创新与发展峰会开幕式

Speaker Session: “Smart Semiconductor Manufacturing: The Next Frontier”

Silicon Photonics Session

09:00 – 09:05

Welcome Speech by Government 政府开幕致辞

09:00 – 09:10

Welcome Speech

Dr. Ali Amur Ali Al Shidhani photo

Dr. Ali Amur Ali Al Shidhani

Undersecretary of Communications and Information Technology

Ministry of Transport, Communications and Information Technology (MTCIT)

09:00 – 09:15

Welcome Address

Ellen Wendelin-Loh photo

Ellen Wendelin-Loh

GM Southeast Asia

I.S.E.S.

09:00 – 09:20

Keynote

We power AI: High density solutions for AI accelerators

In today’s rapidly evolving technological landscape, the demand for cutting-edge Artificial Intelligence (AI) solutions has never been greater. At the heart of these innovations lies an often-overlooked yet crucial component: power. As a leader in the semiconductor industry, we are at the forefront of powering AI from grid to core. This approach ensures that every stage of the power conversion process is optimized to meet the stringent demands of AI data centers. Enabling efficient power conversion from grid to core is essential for achieving superior power densities, thereby enhancing performance/watt while reducing the total cost of ownership (TCO). In this talk, we will focus on the final power conversion step, specifically the second stage down to the core voltage. Our power modules, which enable true vertical power delivery, significantly reduce power delivery network losses, thereby increasing overall system efficiency. Infineon high density solutions push the power density envelope without compromising thermal performance. Additionally, we will talk about our new quad module and demonstrate the benefits of its vertical power flow through chip embedding.

Athar Zaidi

SVP & GM, Power ICs and Connectivity Systems

Infineon Technologies AG

09:00 – 09:25

Keynote

Glass Core Substrate: Next Gen Advanced Packaging Technology

Advanced packaging is enabling unprecedented levels of product performance as logic and memory chiplets are connected in unique architectures merging back-end silicon fabrication with package assembly. To meet future scaling, high speed signaling and power delivery needs, the package substrate must evolve beyond the capabilities offered by organic substrates. Glass substrates contain the
mechanical, physical and optical properties that allow for more transistors to be delivered in a package, providing better scaling and enabling the assembly of larger chiplet complexes. Intel is driving glass substrate technology and supply chain for advanced packaging solutions and plans to deliver this breakthrough innovation to the market in the second half of this decade.

Hamid Azimi, Ph.D.

Chairman of the Board

International Semiconductor Industry Group (I.S.I.G.)

09:00 – 09:30

Keynote

GenAI in Semiconductor Manufacturing

Breakthrough in AI capabilities will revolutionize every aspect of human life, from autonomous vehicles, healthcare, natural disaster prediction to smart manufacturing. As AI model parameters increase, the model capability and accuracy increases, but the complexity requires more memory for training. Micron’s high bandwidth memory products lead the industry for AI workloads. Moreover, Micron is harnessing the power of AI to transform our business. From close to 10 years of AI/ML journey, Micron has demonstrated significant gains across manufacturing operation and business functions use cases, e.g., AI powered scheduling and simulation, AI assisted virtual engineer, image analytics for process control and yield improvement and AI powered productivity solutions, etc..

Koen De Backer

CVP Smart Manufacturing & AI

Micron Technology, Inc.

09:00 – 09:35

Registration

09:00 – 09:10

Opening Videos 宣传片播放

09:05 – 09:20

Welcome Speech

Salah Nasri

CEO & Co-Founder

I.S.E.S.

Next Generation Power Electronics Research & Development

09:10 – 09:30

Global Semiconductor Overview & Landscape Understanding

Salah Nasri

CEO & Co-Founder

I.S.E.S.

09:10 – 09:40

Future Packaging/System Challenges for AI Data Centers

Artificial Intelligence is the largest technology transformation since Internet revolutionized communication and business. This transformation has required advancement in Si, Memory, Packaging, and System technologies. In this talk, the packaging and system technology challenges will be presented.

Babak Sabi, Ph.D.

VP of Technology

AWS Annapurna Labs

09:10 – 09:30

Keynote

Gustav Kalbe

Acting Director in Directorate C “Emerging and Enabling Technologies

EU Commission

09:10 – 09:30

Prof. Jörg Schulze

Institute Director

Fraunhofer Institute for Integrated Systems and Device Technology (IISB)

09:10 – 09:15

Introduction of Government Officials and VIPs 介绍与会领导 及嘉宾

09:10 – 09:30

Keynote

AI Inspired. Systems Accelerated.

The shifting landscape of technology requires a multi-faceted foundry approach to keep pace with increasing workload of data centers and high-performance computing (HPC) systems. The use of chiplets and “system of chips” offer a way to unlock exponential improvements in semiconductor products. Intel Foundry is addressing these needs with decades of experience in world class manufacturing, innovative advancements in packaging and system technology optimization, delivered through a more resilient and more sustainable global supply chain. Join us as we outline how Intel Foundry is tackling the next wave of semiconductor breakthroughs.

Kevin O’Buckley

SVP and GM Foundry Services

Intel Foundry

09:15 – 09:35

Keynote

Christina Strohrmann, Ph.D.

Director Engineering, Advanced Products

Bosch Sensortec

09:15 – 09:40

Keynote

Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry

The semiconductor industry is in the midst of a paradigm shift together with its applied systems triggered by digitalization accelerated by AI technology evolutions in all the systems like evident trends of electrifications and SDV (Software Defined Vehicle) in the automotive industry. As the magnitude and complexity of its applied systems grow exponentially, semiconductor solutions need to integrate more, execute faster with less power, and realize users much better development productivity. Renesas believes the challenge is resolved by building system-oriented solutions for integrations and improving UX (User Experience) values like easier to develop for users. The keynote speech addresses Renesas’ attempts with innovative technologies like chiplet and digitalization/virtualization for system development environment.

Shinichi Yoshioka photo

Shinichi Yoshioka

Senior Vice President and Chief Technology Officer

Renesas Electronics

09:15 – 09:45

Keynote

The New Era in Si Photonics

AI has been extending its influence in nearly every aspect of our daily endeavors; but, the power consumption seems to be the accompanied pain as the industry continue to push for ever- increasing computing power.
Over the years, among other things, Si Photonics has been heralded as a breakthrough in power saving.
However, so far, it appears to lack large volume production for >100G optical solution.
The debut of the 200G CPO with MRM is the watershed for the new era in Si photonics.
This presentation will address the driving force of the new era along with the illustration of critical aspects in Si photonics  device manufacturing, followed by the introduction of technology platforms that are intended to power the AI acceleration.

C.S. Yoo, Ph.D

Vice President, Research & Development / More-than-Moore Technologies

TSMC

09:15 – 09:40

Welcome Address * 3 领导致辞

09:20 – 09:35

Huishan District People’s Government Promotion Speech 惠山区集成电路产业推荐

Jinfeng Ding 丁劲锋 无锡市惠山区高新技术企业协会副秘书长

09:20 – 09:40

Keynote

Sensors and Systems in an AI first world

It seems that everything today is an AI first device, but what does this mean? In this talk I will discuss some of the ways that AI is impacting how Google thinks about our hardware devices and the components within. I will talk through some of the growing systems level considerations for number of sensors, quality and precision of measurements as well as how compute is distributed to handle the various AI models that exist. The goal will be to give the audience an overview of what exists today as well as some possibilities of how they can help shape devices of tomorrow.

Michael Pate, Ph.D.

Director of Audio Technology Development

Google

09:20 – 09:40

Future Packaging/System Challenges for AI Data Centers

Artificial Intelligence is the largest technology transformation since Internet revolutionized communication and business. This transformation has required advancement in Si, Memory, Packaging, and System technologies. In this talk, the packaging and system technology challenges will be presented.

Babak Sabi, Ph.D.

VP of Technology

AWS Annapurna Labs

09:20 – 09:45

Opening Speeches

Overview of the Southeast Asian Semiconductor Industry Landscape
Strategic Focus: Aligning with Malaysia’s Investment Strategy

Zalina Zainol

Deputy Chief Executive Officer (Investment Development)

MIDA

Yb Jagdeep Singh Deo A/L Karpal Singh

Deputy Chief Minister II of Penang

Penang State Government

Driving Innovation and Ensuring Domestic Competitiveness

09:25 – 09:45

Keynote

Power & AI

Ahmad Bahai, Ph.D.

Senior Vice President and Chief Technology Officer

Texas Instruments

09:30 – 10:00

Why “Middle East” – GSME’s Journey in Search of New Talent & Hub for Semiconductor Design & Manufacturing

Semiconductors are the backbone of 4th industrial revolution enabling us to live in a smart & connected world. Connected world, Digitizing Auto Industry, social-media revolution, industrial automation, & AI decision making is spiking the demand of Integrated Circuits. Now when semiconductors are becoming the new “Oil”, fight over its control is also getting intense. Trade-war between US & China is drifting to become China-vs-West issue to gain controls over semiconductor manufacturing market. Semiconductor industry is experiencing shortage of skilled engineers in the field of microelectronics, IC design & manufacturing. GSME started its efforts over a year ago to identify & establish new hubs to support semiconductor ecosystem. GCC countries in Middle East can play a significant role in filling in the gap industry is experiencing.

Farhat Jahangir photo

Farhat Jahangir

Co-founder & CEO

GS Microelectronics

GSME Oman logo

Maryam Al-Bulushi

Senior Mgr. Business Operations & Corporate Affairs

GS Microelectronics

GSME Oman logo

Ammar Al-Kalbani

Lead IC Design & Verification Engineer

GS Microelectronics

GSME Oman logo

Ammar Al-Kalbani

Lead IC Design & Verification Engineer

GS Microelectronics

09:30 – 09:55

Keynote

Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era

The advancements in semiconductor manufacturing and packaging technologies are revolutionizing the semiconductor industry. Splitting a SoC chip into individual chips by function brings improved yields, shorter design, development cycles, and cost reduction. However, packaging structures are becoming more complex, leading to increased design complexity. To overcome these challenges, the entire industry should promote the integration of front-end and then back-end processes and establish a chiplet ecosystem.

 

Dr. Yasumitsu Orii photo

Dr. Yasumitsu Orii

Senior Managing Executive Officer, 3D Assembly Division

Rapidus

Strengthening Power Manufacturing Operations

Mobility & AI Electrification Developments

09:35 – 09:55

Keynote

STMicroelectronics

09:35 – 09:55

Keynote

CRRC Automotive Power Semiconductor Technology Innovation and Industrialization 中车汽车功率半导体技术创新与产业化

Ding Rongjun

Academician of Chinese Academy of Engineering, Chief Engineer CRRC 丁荣军 院士 / 中车总工程师

CRRC

09:35 – 10:00

The Blueprint for Sustainable Fabs

How AI machine learning and others digital technology can accelerate the path to net zero of Semicon industry.

Henri Berthe

Semiconductors Segment VP • Sales

Schneider Electric

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