Empowering Europe’s Semiconductor Future: Innovation, Integration & Independence
EU WBG Pilot Line
08:00 – 08:45
Registration
08:45 – 09:05
Keynote
WBG Pilot Line
In this talk the motivations, the structure, the services, the new devices developed in the WBG Pilot line will be presented.
Francesco La Via
Research Director
CNR-IMM
Francesco La Via was born in Catania, Italy, in September 1961. He received the M.S. degree in physics from Catania University, Catania, Italy, in 1985. From 1985 to 1990, he had a fellowship at STM, Catania. In 1990, he joined the CNR IMM in Catania as a researcher. During this time, he was a Visiting Scientist at Philips NatLab, Eindhoven, The Netherlands. In 2001 he became senior researcher of the CNR IMM and he is responsible of the research group that work on the new metallization schemes for silicon and silicon carbide. From 2003 he is responsible of the division of CNR-IMM that developed new processes for silicon carbide epitaxy and hetero-epitaxy. From 2020 he become Research Director. He is responsible of several industrial research projects and coordinator of two European projects: CHALLENGE (http://h2020challenge.eu/) and SiC Nano for picoGeo (http://picogeo.eu/). Now is the coordinator of the Wide Band Gap Pilot Line. In this period, he has published more than 350 papers on JCR journals and 4 edited books. He has presented several invited contributions to international conferences and has organized several conferences and tutorials. He has 6 patents on SiC technology and growth. The main research interests are in the field of silicon carbide growth, power devices, detectors and MEMS.
Company Profile
The Institute for Microelectronics and Microsystems (IMM) was established in Sept. 2000, by merging the Institute for Methodologies and Technologies for Microelectronics (IMETEM, Catania), the Institute for Chemistry and Technology of Materials for Electronics (LAMEL, Bologna), the Project Sensors and Microsystems (PSM, Rome) and the Institute for the Study of New Materials for Electronics (IME, Lecce). In 2010 two additional sections joined IMM: the Materials and Devices for Microelectronics Lab (MDM, Agrate Brianza) and the centre for Materials and Technologies for Information and Communication and Solar energy (MATIS, Catania).
Next Generation Power Electronics Research & Development
09:10 – 09:30
Prof. Jörg Schulze
Institute Director
Fraunhofer Institute for Integrated Systems and Device Technology (IISB)
Company Profile
As one of 76 institutes of the Fraunhofer-Gesellschaft, the IISB conducts research for customers from industry or within the framework of publicly funded projects. The aim is to develop excellent solutions for our partners as one of the leading research institutions in the field of power electronics and to set new technological standards. Central fields of application are electromobility, aerospace, and sustainable energy supply.
Company Products & Services
The institute offers broad expertise in wide-bandgap semiconductors and high-efficiency power electronics. Device know-how merges here with complex system development. For silicon carbide (SiC), the institute has the complete technological process chain at its disposal – starting with materials, via components and modules, all the way to integration in power electronic systems.
Strengthening Power Manufacturing Operations
09:35 – 09:55
STMicroelectronics: three decades of SiC innovation leading to 200mm production and full vertical integration
STMicroelectroncis’ began researching SiC in June 1996 with the physics department of University of Catania and the CNR national research institute shortly after, forming an ecosystem to foster leading edge innovation. Over the years, ST established a full vertical supply chain from raw material to the final device, with processed wafer sizes evolving from 1” to the current 8” standard allowing high volume production.
Today, more than 5 million vehicles are powered by outstanding ST SiC devices and modules, and the automotive market will continue driving the rapid rise in demand and innovation surrounding this extraordinary semiconductor technology.
Manuel Gaertner
Director Wide Band Gap & Electrification
STMicroelectronics
Manuel Gärtner joined STMicroelectronics Munich in 1999 and is Director of wide bandgap & Electrification for automotive applications. He has worked as a development engineer for smart power products and as a research engineer at the university of Berlin and in the Fraunhofer Institute ISiT in Berlin. He has published over 50 articles and conference speeches on automotive power electronics and holds several patents. He is member of the EEHE Scientific Advisory Board, the SIA POWER TRAIN & ELECTRONICS scientific committee for Power Electronics, Member of Technical Program committee for CIPS 2026, and he represents STMicroelectronics as principal partner and is Member of the Board of Directors in ECPE.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
10:00 – 11:00
Networking Break, Coffee and Business Meetings
11:05 – 11:25
Keynote
Reserved
Infineon Technologies AG
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
11:30 – 12:30
Panel Session: Optimizing Fab Operations
Moderator
Mike Rosa, Ph.D.
CMO & SVP Strategy
Onto Innovation
Mike Rosa is chief marketing officer (CMO) and senior vice president responsible for strategy at Onto Innovation. Prior to his current role, Mike served as CMO for Applied Materials ICAPS and Advanced Packaging Groups, where he was responsible for leadership of strategic and technical marketing, marketing communications, charting device segment inflection roadmaps and providing strategic business development support toward M&A activities. He has over 25 years’ experience in semiconductor engineering and technology, with roles that span device design and fabrication, equipment development, marketing and sales. His technical qualifications include B.Eng. (Hons) and Ph.D. degrees in Microelectronic Engineering and an MBA with dual majors in Marketing and Business Strategy. Mike has authored over 40 journal and conference publications and holds over 29 U.S. patents
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Panelist
Michael Woittennek
CEO of X-FAB Dresden
X-FAB
Company Profile
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
Panelist
Dirk Drescher, Ph.D.
Plant Manager
Bosch
Dirk Drescher is Plant Manager of BOSCH Semiconductor Manufacturing Dresden.
He started his career in semiconductors in 1995 as process engineer for Siemens Microelectronics Center Dresden and served in different managerial functions until 1999. In 2000 he joined Infineon’s Semiconductor 300 organization as Module Manager to help starting up the worlds first 300mm Semiconductor Manufacturing Line. In 2008 he joined Calyxo GmbH managing a thin film Solar Panel manufacturing line. 2010 Mr. Drescher joined Globalfoundries to help starting up its green field/ leading edge 300mm Manufacturing Site, Fab8, Malta, NY, USA. In 2013 he took over a managerial position at Globalfoundries Fab1, Dresden, Germany. From 2016-2023 Mr. Drescher worked at X-FAB. After managing Semiconductor Fabs in Dresden and Corbeil-Essonnes, France, he served as VP Operations in X-FAB’s corporate management.
Dirk is member of the board at Silicon Saxony
Mr. Drescher holds a diploma in Physics from Dresden Technical University and a PhD in Experimental Physics from the Technical University Chemnitz.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Panelist
Matthias Bonkaß
VP Advanced Manufacturing Engineering
GlobalFoundries
Company Profile
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.
Panelist
Torsten Mueller, Ph.D.
Senior Director IC Technologies
Infineon Technologies AG
Dr. Torsten Müller holds a PhD in Physics and brings 25 years of expertise in semiconductor research, development, and production. Throughout his career, he has contributed to advancing Flash technology at Infineon and Qimonda, managed solar cell production at Conergy and Sovello, and led the technology development and ramp of a 28nm high-k metal gate technology at Globalfoundries. Returning to Infineon Dresden, he managed the 300mm technology transfer portfolio before taking his current role as Head of IC Technologies. With a proven track record in innovation, leadership, and operations, Dr. Müller remains a driving force in semiconductor advancements.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Panelist
Rodney Pelzel, Ph.D.
CTO & COO
IQE
Dr. Rodney Pelzel is the Chief Technology Officer at IQE, the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry
Rodney has over 20 years of experience in the semiconductor industry, with deep expertise in semiconductor materials engineering and the epitaxial growth of compound semiconductors. Rodney joined IQE as a Production Engineer in 2000 and during his first twelve years at IQE he held various engineering and operational management roles focusing on scaling leading edge epitaxial technology for high volume manufacturing for wireless applications.
In 2012, Rodney was appointed as head of R&D for the IQE Group and was tasked with creating unique materials solutions that enable IQE’s customers and provided them with a competitive edge. Throughout his career, Rodney has been involved in numerous new product introductions, including IQE’s highly successful launch of 6” VCSELs for consumer applications.
Rodney is a chemical engineer by training and graduated from the University of Colorado in 1995 with a bachelor’s degree (high distinction) in Chemical Engineering and a PhD in Chemical Engineering (surface chemistry of semiconductors, GaAs and Si) from the University of California in 2000. He is a Chartered Engineer, Chartered Scientist, and a Fellow of the Institution of Chemical Engineers, with his work widely published and a co-inventor of 30+ patents.
Company Profile
IQE is the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry that enable a diverse range of applications across mobile handsets, global telecoms infrastructure, smart connected devices, electric vehicles, infrared and sensing applications.
Panelist
Tim Maloney
Senior Director BD
Polar Semiconductor
Company Profile
Polar Semiconductor is a U.S.-owned MN located 200mm foundry specializing in sensor and power semiconductors, for high-volume manufacturing of silicon and wide-bandgap ICs and discrete devices, and specialty products tailored for Automotive, Industrial, and Aerospace & Defense applications.
Panelist
Dominic Viens
VP & GM Power Test Division
Teradyne
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
Contact Us
www.teradyne.com
12:35 – 13:35
Buffet Lunch
13:40 – 14:00
HIGH-TECH HV IGBT AND SIC MODULES FOR RAILWAY APPLICATIONS
Joint Collaboration Presentation
An example of vertical solution implementation through partnership is described in this presentation using rail applications. ŠKODA ELECTRIC and HITACHI ENERGY collaborate on applying high-voltage IGBT semiconductors in various module platforms, including newest LinPak IGBT modules for serial usage in traction converters with a 3 kV DC power supply system. In recent years, the ŠKODA GROUP has been intensively developing hybrid dual-system trains with battery drive for a range of 80-120 km on non-electrified lines. A necessary condition for BEMU is the development of a high-tech DC-DC converter with galvanic isolation of 10 kV and a continuous power of 800 kW. Given the weight of LTO batteries, emphasis was placed on minimum weight and installation dimensions and high efficiency of the converter. This clearly leads to the choice to adopt on power semiconductor side SiC technology both on the 800 V traction battery side and on the 3 kV DC traction converter side. Therefore, the partnership with Hitachi Energy was used to develop a SiC module for a voltage of 3.3 kV with an insulation voltage of 10.2 kV. The development of this semiconductor took place in parallel with the development at ŠKODA ELECTRIC converter development over the last couple of years, leading to the stage that as of today 4 BEMU trains are in operation on Czech Railways and these SiC based semiconductors work absolutely reliably, and were the key enabler for this new train platform. As a further step into performance of this train platform, based on the experience with another SiC Powermodule, the RoadPak SiC, for electric buses, there is now the development of a traction inverter for BEMU trains with these SiC modules with parameters of 1200V and the record current of 1150A for powering asynchronous traction motors with a continuous power of 340 kW. The development of power SiC modules and their application in railways allows to come up with ecological solutions for modern trains and significantly reduce the environmental burden and increase the comfort of passengers on the railway. European cooperation between two major companies is a best practice example of this.
Ladislav Sobotka, Ph.D.
Director of Engineering and R&D
Skoda Electric
Ladislav is the Director of Development and Engineering at ŠKODA ELECTRIC, part of the ŠKODA Group. He joined Skoda in 1982 to develop electric locomotives, where he worked on traction drives. In 1996 he developed a new traction drive for the City Elephant double-decker unit (3 kV DC supply system ) with new HV IGBT transistors and a double star asynchronous traction motor. He also worked extensively on the development of trams and subway vehicles. He has been in the management of ŠKODA TRANSPORTATION since 1994, and in the following years he served as Technical Director and member of the Supervisory Board of ŠKODA TRANSPORTATION. In 2003, he founded ŠKODA ELECTRIC and was a member of the Board of Directors in charge of the technical departments. At ŠKODA ELECTRIC, he has been involved in a number of foreign projects, such as a traction drive for locomotives for Turkey in cooperation with the Korean company Hyundai-Rotem and a groundbreaking traction drive for a subway train for the Chinese city of Suzhou. Ladislav works very intensively with universities and is a member of three scientific councils. Since 2015 he has been working on SiC semiconductors and high efficiency traction drives.
Company Profile
We are Škoda Electric, belonging to the Škoda Group. We continue in the tradition of the one hundred and sixty-year tradition of Škoda plants and we are an experienced manufacturer of traction drives and motors for locomotives, trams, EMU, metro, mining vehicles.
Rainer Kaesmaier, Ph.D.
Managing Director Semiconductors
Hitachi Energy Ltd.
Dr. Rainer Kaesmaier is leading the semiconductor business of Hitachi Energy with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes and SiC for market segments such as energy transmission & distribution, transportation & rail, renewables, industry and eMobility. Rainer is a semiconductor industry veteran having held various management and executive positions in the sector for close to 30 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing. After stations at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, he assumed 2018 the responsibility for the global semiconductor business of Hitachi Energy. In addition to that, Rainer is since 2019 also member of the management board for Hitachi Energy Switzerland. He was a member in various industries strategy committees in Europe and the US, and currently in the advisory board for International Semiconductor Industry Group (I.S.I.G.). Rainer holds a Master’s degree in Physics from the Technical University Munich and a PhD in Physics from the University Kassel in Germany. He is based in Lenzburg near Zurich, Switzerland.
Company Profile
We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.
OSAT Advancements in SiC and GaN Packaging
14:05 – 14:25
Innovative Packages, Big Power: The Rise of Advanced Power Packaging
David Clark
VP Product Marketing
Amkor Technology, Inc.
David joined Amkor in 2013 and is currently responsible for Global Product Marketing, Market Analytics and Market Strategy. Before joining Amkor, David had held various sales management, product development and engineering positions at FlipChip International (FCI), Leica Microsystems and Agilent Technologies. David has been granted five patents in Optoelectronics and Device Packaging and holds a BEng Honours Degree in Electronic, Electrical, and Optoelectronic Engineering from the University of Glasgow.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Electrification Landscape
14:30 – 14:50
Market outlook and technology trends for power devices in xEV and beyond
The global transition toward sustainable transportation is accelerating the adoption of electrified vehicles (xEV), creating significant opportunities in the power electronics sector. Despite challenges such as high vehicle costs, geopolitical dependencies, and charging infrastructure constraints, the xEV market continues to grow, driven by long-term trends in decarbonization and electrification. This presentation will provide an in-depth analysis of the power semiconductor market for xEV applications, with a focus on Silicon, Silicon Carbide (SiC), and emerging Gallium Nitride (GaN) devices. The complex dynamics of IGBT vs. SiC choices in automotive designs will be explored, alongside the implications of cost-performance tradeoffs and supply chain dependencies. Beyond passenger EVs, the electrification of rail transport and electric aircraft also presents promising markets for power devices. Key market figures, technical innovations, and strategic collaborations—including with Chinese players—will be discussed to provide a comprehensive overview of the evolving power electronics landscape in mobility.
Milan Rosina, Ph.D.
Principal Analyst, Power Electronics & Batteries
Yole Group
Dr. Milan Rosina is Principal Analyst, Power Electronics & Battery, at Yole Group (Yole). Dr. Rosina has 20+ years of experience due diligence, technology, and market surveys in the fields of renewable energies, xEV, EV chargers, energy storage, batteries, power electronics, thermal management, and innovative materials and components. Dr. Rosina received his Ph.D. degree from National Polytechnical Institute (Grenoble, France). He previously worked for the Institute of Electrical Engineering in Slovakia; Centrotherm in Germany; Fraunhofer IWS in Germany; CEA LETI in France; and the French utility company ENGIE.
Company Profile
Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.
14:55 – 15:10
Marc Isabelle, Ph.D.
Founder & CEO
european economics
Marc ISABELLE, engineer & PhD in economics, is the Founder & CEO of european economics. In 15 years, Marc helped secure €37 billion of public funding for 220 projects in various industries. During his numerous interactions with the European Commission & national public authorities, Marc has contributed in co-developing the tools & best practices for public funding applications and assessment in Europe. Before starting european economics in 2009, Marc has worked for more than 15 years in economic departments of large businesses and public agencies (Total, CEA, AII, Bpifrance). He has been teaching economics at Paris Dauphine University since 1996 and has published several research papers on the economics of science and innovation. He is reviewer for the European State Aid Law Quarterly.
Company Profile
Founded in 2009, european economics is a recognised pure-player consultancy in public funding. We offer tailor made and high-value-added services across Europe to help our clients design and implement turn-key public funding solutions – State aid & European funding – for their strategic projects:
– 37 B€ public funding secured for 220 projects; of which 7.9 B€ in 2023.
– 100 % success rate for State aid notifications to the European Commission.
Company Products & Services
We support our clients with a turn-key approach at every step of their project’s life-cycle: funding strategy definition, application file preparation (at National & EU level), European Commission validation process, and funding monitoring.
15:15 – 16:00
Panel Session: Strategic Autonomy or Global Integration? Europe’s Semiconductor Future Amid Geopolitics, Supply Chains, and China Collaboration
Panelist
Javier Hernandez, Ph.D.
VP Corporate Strategy
Littelfuse
Dr. Javier Hernandez is the Vice President of Corporate Strategy at Littelfuse Inc. (Nasdaq: LFUS). With over twenty-five years of experience in the semiconductor industry, Dr. Hernandez is pivotal in shaping Littelfuse’s strategic direction and driving business development. Previously, Dr. Hernandez served as Senior Director of Mergers and Acquisitions at Littelfuse, where he led multiple initiatives for sustainable long-term growth. He has also held various positions related to business development within the semiconductor ecosystem.
Dr. Hernandez holds a Ph.D. in Engineering from the University of Navarra, an Executive MBA from IESE Business School, University of Navarra, and has completed an Executive Program on Mergers and Acquisitions (M&A) at Harvard Business School.
Company Profile
Littelfuse is a diversified industrial technology manufacturing company empowering a sustainable, connected, and safer world. Across more than 20 countries, and with approximately 17,000 global associates, we partner with customers to design and deliver innovative, reliable solutions. Serving over 100,000 end customers, our products are found in a variety of industrial, transportation, and electronics end markets—everywhere, every day. Headquartered in Chicago, Illinois, United States, Littelfuse was founded in 1927.
Company Products & Services
We work with our customers and partners to design, manufacture, and deliver innovative solutions for automotive and commercial vehicles, industrial applications,
data and telecommunications, medical devices, consumer electronics, and appliances. Everywhere, every day, our work focuses on safety and connection. We’re passionate about working with our customers and partners to sustainably create products that protect, control, and sense for a safer, greener, and more connected world.
Panelist
Roberto Antonicelli
Senior Director, Automotive BU
JCET
Professional with over 25 years of international experience in the semiconductor and automotive sectors. Currently Senior Director at STATS ChipPAC, part of JCET Group, he has previously held leadership roles at STMicroelectronics and Infineon. He holds a PhD in Microelectronics, with a focus on semiconductor packaging and RF/microwave design. His expertise spans business development, strategic partnerships, and complex program execution, with a strong emphasis on business innovation and collaboration. Married and father of three children, he is recognized for his forward-thinking approach to advancing technology and business solutions.
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Agenda Close
I.S.E.S. EU & M.S.W.S. EU Cocktail Reception
17:00 – 18:30
Stadtforum Dresden City Forum Networking Session
Welcome Address: City of Dresden – Dirk Hilbert, Mayor
End of content
End of content