Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.

Dr. Lee has been one of critical leaders who are leading the era of 3D TSV stack memory such as HBM (High Bandwidth Memory) in semiconductor industry.

He has contributed broadly to, and led teams in, 3D integration/packaging R&D including core technology/product development/reliability study and mass production for HBM over 27 years.

Dr. Lee received the Ph.D. degree in machine intelligence and systems engineering from Tohoku University, Japan, in 2000. During his doctoral research at Tohoku University,Dr. Lee proposed a new 3D-IC integration technology to achieve 3D devices with high performance and multi-functionality, leading this field in the world.

From 2001 to 2002, he was a Postdoctoral Researcher with the Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA.

He worked with Memory Division, Samsung Electronics Ltd., Korea, as a Principal Engineer from 2002 to 2008.

From 2008 to 2016, he worked with the New Industry Creation Hatchery Center (NICHe), Tohoku University, Japan, as a Professor.

From 2017 to 2018, he worked with R&D center, Amkor Technology Korea, as a VP.

He joined SK hynix 2018 and currently Senior VP, Head of PKG Development at SK Hynix, Korea.

Dr. Lee has led many interdisciplinary R&D programs on 3D integration, including integration of various materials and devices to achieve 3D devices/systems with high performance and new functionality, 3D-IC reliability research to investigate the impacts of 3D integration on the device performance and reliability, unique hybrid integration of nano-materials with Si, and product development of 3D stack DRAM such as high-bandwidth memory (HBM). For over 27 years at universities and industries in Japan, US, and Korea, Dr. Lee has made exceptional technical contributions to and lasting impacts on 3D integration technology and 3D product development in broad fields, such as material science, materials characterization/analysis, semiconductor device/process, electrical packaging, and Si micro-machining.

Dr. Lee has authored more than 230 scientific publications (peered journals, international conferences), co-edited 4 books, and given 43 tutorial/invited/keynote talks in international conferences including IEEE IEDM, IEEE IRPS, VLSI Symposium, plus 23 US patent publications.

He has served as a frequent reviewer for a number of journals, including IEEE EDL, IEEE T- ED, IEEE CPMT, and technical program committees of international conferences, including IEEE ECTC, IEEE IRPS, IEEE EDTM, IEEE 3D SIC.

He is a Senior Member of IEEE.

Dae-Woo Kim, Corporate VP at Samsung Electronics for 7 years with advanced package technology and product development. In his current position, Dae-Woo is leading the system package lab for product & technology development including 2.xD, 3D, FOWLP and FOPLP technology.

Prior to joining Samsung Electronics, he was a TD Engineering manager at Intel ATTD, Chandler Arizona. During 14 years of experience at Intel, he worked on CPI area, assembly test chip design, Si bridge design and package process & design integration for CPU flip chip package, EMIB, and Foveros technology.

Dr. Kim received a Ph. D., Master and bachelor degree in Material Science Engineering from Yonsei University, Seoul, S. Korea, Country and he was a research faculty in III-V semiconductor field for 3 years at Arizona State University, Tempe, AZ.

Dr. Liron Gantz has led Nvidia’s Electro-Optics group (NVEO) for the past six years, driving advancements in silicon photonics for Co-Packaged Optics products. He completed his Ph.D. in 2017. In 2016 he joined Mellanox, where he established the electro-optics lab for device characterization. He quickly transitioned into leadership roles, specializing in the design, characterization, and modeling of silicon photonic technologies. Dr. Gantz and his team have been instrumental in the Nvidia CPO project, from its inception to chip development and system bring-up. Dr. Gantz is now a Principal Research Scientist in Nvidia’s research organization. With a strong foundation in Quantum Mechanics, Nanotechnology, and Optics, he has published in leading journals such as Science and Physical Review Letters, highlighting his contributions to the semiconductor industry.

Dr. Kim is the CTO of Absolics, a spun-off semiconductor packaging business from SK Group in the USA. With 31 years of experience in the semiconductor and microelectronic packaging industry, Dr. Kim leads new technology and business development for advanced semiconductor packaging solutions at Absolics. Prior to Absolics, he held executive positions in various companies and countries, including SKC, Georgia Institute of Technology, Foxconn Advanced Technology, Daeduck Electronics, UTAC, and Amkor Technology. Throughout his career, Dr. Kim managed package engineering, substrate manufacturing, and embedding component microelectronic package engineering. He has over 200 US patents and holds a doctorate in electrical engineering from the Technical University of Dresden, Germany.

Hyungmook Choi is a seasoned semiconductor expert with over 30 years of experience in the power semiconductor industry. He holds B.S. and M.S. degrees in Electrical Engineering from Seoul National University. Starting at Samsung Semiconductor, he advanced through leadership roles at VISHAY SILICONIX and UTAC, where he pioneered QFN copper clip technology and expanded into WBG markets. Under his guidance, UTAC shipped over 3 billion QFNs with copper clips by 2024. Mr. Choi is a respected keynote speaker and is currently focused on AI power QFN and SiP development to meet future industry needs

LIM Choon Khoon (CK) is a Senior Vice President and Chief Executive Officer of Semiconductor Solutions Advanced Packaging (AP).

CK’s career spans key engineering, manufacturing, and regional functional and global general management roles with several global semiconductor companies. As Chief Executive Officer of the Segment’s AP Business Group, he helps provide the industry’s leading first-level interconnect technologies covering leading AP First Level Interconnect (FLI) technologies for logic, HBM, Si Photonics & Co-Packaged Optics, wafer die singulation solution for advanced fabricated wafers and Panel ECD for fine Line/Space organic and glass substrate & Wafer PVD, that are well-positioned to serve and to scale with the most demanding AP needs.

CK holds a Bachelor of Science (Honours) in Production Engineering and Production Management degree from the University of Nottingham, United Kingdom

Maksym Plakhotnyuk is the CEO and founder of ATLANT 3D, a pioneering deep-tech company at the forefront of innovation, developing the world’s most advanced atomic-scale manufacturing platform. Maksym is the inventor of the first-ever atomic layer advanced manufacturing technology, enabling atomic-precision development of materials, devices, and microsystems. A scientist with a Ph.D. in Nanotechnology and Photovoltaics, he has deep expertise in nanotechnologies, renewable and exponential technologies, semiconductor processing, photovoltaics, solid-state physics, and material science. A Fulbright scholar, Hello Tomorrow Grand Winner, and proud Ukrainian, Maksym has earned global recognition for his work. With 15+ years of experience and numerous patents, he leads ATLANT 3D’s mission to redefine nanofabrication.

BY Park is a seasoned leader in semiconductor engineering with over 25 years of experience. His career spans key roles at Fairchild and currently as Senior Director at onsemi. He specializes in SiC, IGBT, MOSFET, and analog IC technologies, and has consistently driven innovation in these power semiconductor areas. With deep expertise in power technology and product engineering, he has led strategic development initiatives across both mature and emerging technology nodes. His leadership encompasses everything from hands-on device engineering to division-level strategy. From practical engineering to strategic leadership, he has played a pivotal role in driving innovation across global teams and advancing cutting-edge technologies.

Dr. Achim Strass is a visionary leader in semiconductor technology, with a career spanning global giants like Siemens, Qimonda, Infineon, Huawei, and Nexperia. From pioneering copper wire integration in automotive semiconductors to founding competence centers across the globe, his expertise has shaped the industry. With a PhD in Silicon Process Technology and a passion for innovation, he has led groundbreaking projects in yield management, electrification, and advanced power electronics. Now, as Head of Worldwide Technology Scouting at Nexperia and an active member of multiple boards, he connects global semiconductor ecosystems, driving collaboration and progress. His leadership continues to influence cutting-edge developments in semiconductor technology.

Maarten Willems received the M.S. Degree in Electrotechnical Engineering in 1993 and subsequently the M.S. Degree in Artificial Intelligence in 1994 and an MBA, from the K.U.Leuven.

After a career as a solution design engineer at Alcatel Bell, director of engineering at Keyware Technologies, and VP Professional services at GlobalSign, he co-founded Hypertrust in 2000, internet service company.

In 2005, Maarten joined imec as Market Intelligence group leader and also received a candidate degree in Law from VUB. Since 2008, he held the position as Business Director in the Smart Systems segments focusing on business development and sales of new sensor technology development and product marketing in the domains of imaging, wireless, healthcare, wearables and power electronics solutions. Since 2019, Maarten became Vice-President for imec business development.

Dr. Ankur Aggarwal is Vice President of Advanced Packaging & Supply Chain at Celestial AI, the creators of the Photonic Fabric™— optical scale-up networks for accelerated computing. Since joining Celestial in 2022 in its early stages, Dr. Aggarwal has been instrumental in pioneering Celestial AI’s breakthrough in Photonic Fabric™ architecture—driving innovations such as optically accessible 2.5D and 3D packages and photonically bridged packages that are redefining the limits of compute scaling, performance, bandwidth, and power efficiency in AI systems.

Prior to Celestial AI, Dr. Aggarwal held senior engineering and strategic leadership roles at Intel, Finisar, and II-VI Incorporated, where he shaped the development and scaling of advanced semiconductor and photonics platforms. At II-VI, he led global procurement efforts, architecting one of the industry’s most sophisticated and far-reaching photonics supply chains, aligning operational execution with long-term strategic goals across diverse technology ecosystems. Dr. Aggarwal holds a Ph.D. in Materials Science and Engineering from the Georgia Institute of Technology and a Bachelors in Engineering from IIT Varanasi.

Ritesh Jain is Senior Vice President, Engineering & Operations at Lightmatter leading cross-functional engineering organizations responsible for driving innovation and delivering products. Previously as VP at Intel, Ritesh led hardware development for data centers. He holds a master’s in semiconductor packaging and during the two plus decades of experience in the semiconductor industry, he drove several generations of data center products into high volume deployments while driving major technology transitions and leading global engineering teams.

Simon Duval is the co-founder and CTO of Femtum, leading R&D and engineering activities. During its PhD and post-doctoral fellowship, he developped the first mid-IR femtosecond fiber laser and received the maiman award for the best paper at Photonics West. He is the inventor of 6 patents in laser and laser processing development that are extensively used at Femtum. Simon is also a board member and treasurer of Optonique, the Quebec Photonics Cluster.

Emilie Jolivet is Director of Computing & Software Memory Activities at Yole Group.
Based on her valuable experience in the semiconductor industry, Emilie manages the expansion of the technical and market expertise of the memory, computing & software team.
In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside Yole Group.
Prior to Yole Group, after an internship in failure analysis at Freescale (France), she was an R&D engineer for seven years in the photovoltaic business where she co-authored several scientific articles. Then, Emilie worked at EV Group (Austria) as a business development manager in 3D & Advanced Packaging.
Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France). She also graduated with an MBA from IAE Lyon.