November 5 | Day 1: Innovations and Trends in Advanced Manufacturing

08:00 – 08:55

Registration & Welcome Coffee

08:56 –

Opening Ceremony Overview of the Southeast Asian Semiconductor Industry Landscape Strategic Focus: Aligning with Malaysia’s Investment Strategy

09:00 – 09:15

Welcome Address

Ellen Wendelin-Loh photo

Ellen Wendelin-Loh

GM Southeast Asia

I.S.E.S.

09:20 – 09:45

Opening Speeches

Overview of the Southeast Asian Semiconductor Industry Landscape
Strategic Focus: Aligning with Malaysia’s Investment Strategy

Zalina Zainol

Deputy Chief Executive Officer (Investment Development)

MIDA

Yb Jagdeep Singh Deo A/L Karpal Singh

Deputy Chief Minister II of Penang

Penang State Government

09:50 – 10:00

Special Recognition Ceremony

Keynote Session: “The Future of Advanced Semiconductor Manufacturing”

• Key Trends: Vertical Integration, Industry 4.0 & 5.0 Technologies, Advanced Packaging

10:05 – 10:35

Keynote

The Future of Advanced Semiconductor Manufacturing

Kok Tiong Ng

SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd

Infineon Technologies AG

10:40 – 11:10

Keynote

Digital: The New Key Strategy of Advanced Manufacturing

The keynote “Digital: The New Key Strategy of Advanced Manufacturing” by Yvonne Keil, Senior Director GlobalFoundries Manufacturing Malaysia/India, highlights the evolving role of digital and remote manufacturing in enhancing the next generation production of semiconductors. The presentation emphasizes the positioning of digital and remote manufacturing as a critical solution to the increasing complexity of chip design, environmental challenges, and the rising cost of fabs. It also discusses the global manufacturing footprint of GlobalFoundries and its differentiation through innovations such as AI-powered analytics, smart manufacturing, and Manufacturing hubs in Penang, Malaysia and Bangalore, India. In the keynote, the importance of the right change management will be examined in more detail. Continued innovation and industry collaboration are key factors to meet future demands.

Yvonne Keil

Senior Director GF Operations India/Malaysia

GlobalFoundries

11:15 – 11:30

Networking Break

11:35 – 12:30

Panel Discussion: “Building a Robust Manufacturing Ecosystem”

Topics: Integrating Supply Chain & Manufacturing, Collaboration Across the Ecosystem, Supply Chain Resilience, Geopolitical Impacts, Diversification Strategies

Noorazidi Che Azib photo

Moderator

Noorazidi Che Azib

Deputy Vice President

Inari Technology Sdn. Bhd. (a wholly-owned subsidiary of Inari Amertron Berhad)

Wee Seng Ang photo

Panelist

Wee Seng Ang

Executive Director

Singapore Semiconductor Industry Association (SSIA)

Panelist

Dato’ Seri Siew Hai Wong

President

Malaysia Semiconductor Industry Association (MSIA)

Panelist

Kam Ai Mei

Vice President and Chief Finance Office, Infineon Kulim

Infineon Technologies AG

12:35 – 12:40

InvestPenang

12:40 – 13:40

Networking Lunch

Sponsored by: 

InvestPenang

InvestPenang is the Penang State Government’s principal agency for promotion of investment. Its objectives are to develop and sustain Penang’s economy by enhancing and continuously supporting business activities in the state through foreign and local investments, including spawning viable new growth centers. To realize its objectives, InvestPenang also runs initiatives like the SMART Penang Center (providing assistance to SMEs) and Penang CAT Center (for talent attraction and retention).

For more information, please visit https://investpenang.gov.my/
Do follow us on InvestPenang’s social media channels: Facebook ; LinkedIn

Presentation Session: “Advanced Packaging Technologies and Applications”

Topics: Latest Advancements, Practical Applications, Case Studies, Emerging Technologies, from HPC to Power, Impact on the Industry, Materials Advancements,

13:45 – 14:10

Impact of Generative AI in Advanced Packaging

Advanced packaging has experienced significant growth in recent years, fueled by the rising demand for high-performance computing, artificial intelligence, and autonomous driving. The semiconductor industry is increasingly embracing advanced packaging as a “more-than-Moore” solution to enhance system performance, which ultimately leads to improved device performance, greater bandwidth, reduced latency, and lower power consumption. This discussion will explore the outlook for the advanced packaging market and examine emerging technology trends, with a particular focus on the impact of generative AI and the demand for high-performance packaging solutions. Specifically, it will address the growing adoption of 2.5D and 3D packaging, as well as glass core substrates, as strategies to navigate the associated challenges and seize emerging opportunities.

Dr. Yik Yee Tan photo

Yik Yee Tan, PhD

Senior Technology & Market Analyst, Semiconductor Packaging

Yole Group

14:15 – 14:40

Semiconductor Packaging Technologies in the AI Era

This presentation explores the pivotal role of semiconductor packaging technologies in driving innovation within the AI era. Key market trends and growth drivers such as 5G, edge AI, and automotive advancements are discussed. The talk delves into the evolution of semiconductor technologies, highlighting the shift towards compute-centric and AI-driven applications. Emphasis is placed on advanced packaging solutions like chiplets, heterogeneous integration, and co-packaged optics, which are essential for meeting the demands of AI data centers and edge computing. The session concludes with insights into the technical challenges and future directions for semiconductor packaging in AI applications.

Dr. JinYoung Khim photo

Dr. JinYoung Khim

14:45 – 15:10

LOW COST, SCALABLE and FLEXIBLE line for different types of IC Packaging (LGA, BGA, QFN, SiP, AiP, DrMOS, Power Invertor)

Jimmy Chew

Chief Executive

PEP Innovation

15:15 – 15:40

How Semiconductors Drive Sustainable Innovation

The demand for electric energy is growing, and finding renewable sources is crucial. Solar and wind energy are leading this change. It’s not just about sourcing energy but also using it smartly. Join Mr. Muggeri as he explores ST’s dedication to sustainability. Learn how our innovative power solutions drive and empower sustainable innovation. We’ll show you how we’re leading the way in renewable energy production and cutting-edge power efficiency solutions. Plus, we’ll give you a sneak peek into our pioneering Energy and Power Conversion applications with examples like DC Microgrid, enabling Microgrid with PV, Energy Storage System and Electric Vehicle charging function, KNX energy management system etc.. And that’s not all! We’ll also introduce you to our innovative Wide bandgap technologies like Silicon Carbide (SiC) and Gallium Nitride (GaN), which are revolutionizing energy usage and paving the way for a greener future.

Francesco Muggeri

VP Marketing & Applications, Power Discrete & Analog, China, STMicroelectronics

STMicroelectronics

15:45 – 16:00

Networking Break

16:05 – 16:20

Harnessing the Benefit of Precious Metals Deposition While Managing Total Cost of Ownership

This presentation will explore the material benefits of precious metals in the wafer fabrication process and important total cost of ownership considerations for the fab. The high cost and market volatility of precious metals create obstacles for high-volume manufacturing. However, in today’s fab, efficient power management requires thin-film performance only possible through the use of gold, silver, platinum and palladium. Materion offers unique insights on how best to manage precious metals inside and outside of fab environments. This presentation will provide an overview of considerations when integrating precious metals into the fab supply chain

Richard Oliveri

VP, General Manager

Materion

16:25 – 16:40

The necessity to have the right logistics partner in South East Asia to support the Global Supply Chain

In an increasingly interconnected world, the success of global supply chains hinges on robust logistics partnerships, especially in dynamic regions like South East Asia. This session will explore the critical role of selecting the right logistics partner to navigate the complexities of regional markets, regulatory landscapes, and cultural nuances. Attendees will gain insights into key criteria for evaluation, the impact of effective logistics on operational efficiency, and strategies for fostering collaborative relationships that drive resilience and innovation in global supply chains. Join us to discover how the right logistics partner can be a game changer in achieving your supply chain goals.

Brandon Kennedy

Global Managing Director, High-Tech & Industrials

Airspace

16:45 – 17:10

Keynote

Naveed Sherwani

Chairman

National Semiconductor Hub Saudi Arabia

17:15 – 18:15

Cocktail Reception

18:30 –

Gala Dinner

18:30-Late

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