27-28 August 2025
Suwon
08:00 – 08:55
Registration & Welcome Coffee
08:56 –
Opening Ceremony Overview of the Southeast Asian Semiconductor Industry Landscape Strategic Focus: Aligning with Malaysia’s Investment Strategy
Ellen Wendelin-Loh
I.S.E.S.
Ellen Wendelin is the General Manager of the International Semiconductor Executive Summit Southeast Asia (I.S.E.S. SEA), a role in which she excels at bringing together industry leaders to foster collaboration within the semiconductor sector. With a passion for orchestrating high-profile summits that merge innovation, strategy, and growth, Ellen is known for her expertise in event management, business development, and networking. She has successfully led initiatives that connect semiconductor executives globally, creating strategic partnerships and opportunities that drive the future of the industry. Her work is centered on delivering exceptional event experiences and fostering meaningful dialogue among stakeholders.
Company Profile
Established in 2010, the International Semiconductor Industry Group (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today!
09:20 – 09:45
Opening Speeches
Overview of the Southeast Asian Semiconductor Industry Landscape
Strategic Focus: Aligning with Malaysia’s Investment Strategy
Zalina Zainol
MIDA
Puan Zalina Zainol is the Deputy Chief Executive Officer of Investment Development at the Malaysian Investment Development Authority (MIDA), the country’s premier agency that creates new pathways for growth and development in the manufacturing and services sectors.
With a career spanning almost three decades at MIDA, she has held various senior positions, including Executive Director of Corporate Management Services, Executive Director of Strategic Planning (Services), and Director of the Corporate Communications Division.
Puan Zalina’s extensive experience also includes international postings, which have further enhanced her global perspective and understanding of investment trends. She served in MIDA’s New York and Boston offices, where she played a crucial role in attracting foreign direct investment to Malaysia.
As MIDA’s Deputy Chief Executive Officer for Investment Development, she continues to spearhead initiatives that support the country’s economic transformation and foster a vibrant and sustainable business environment.
Company Profile
MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 21 overseas offices. MIDA continues to be the strategic partner to businesses in seizing the opportunities arising from the technology revolution of this era.
Yb Jagdeep Singh Deo A/L Karpal Singh
Penang State Government
He holds a Degree in Law from University of Warwick, United Kingdom and admitted as an Advocate and Solicitor of the High Court in Malaya, practicing criminal law at Karpal Singh & Co. in Penang.
Presently, YB Tuan Jagdeep was the Deputy Chief Minister II of Penang and oversees the portfolio of Human Capital Development, Science, and Technology in the State after elected as the member of State Assemblyman of Penang (ADUN) in August 2023. He joined Democratic Action Party (DAP) in 1994 and started his journey as an elected representative of the people since 2008. In 2008 and 2013, he was elected as ADUN in Penang and, he was appointed as Penang State Executive Councillor (Exco) for Housing and Town and Country Planning in 2013. In 2018, he was re-appointed Exco for Local Government, Housing and Town & Country Planning with the added responsibility of heading the onerous Local Government portfolio in overseeing both Penang City Councils – Majlis Bandaraya Pulau Pinang and Majlis Bandaraya Seberang Perai.
09:50 – 10:00
Special Recognition Ceremony
• Key Trends: Vertical Integration, Industry 4.0 & 5.0 Technologies, Advanced Packaging
Kok Tiong Ng
Infineon Technologies AG
Mr. Ng Kok Tiong: A Visionary Leader in the Semiconductor industry as the Senior Vice President and Managing Director of Infineon Technologies (Kulim) Sdn. Bhd, Mr. Ng Kok Tiong has been instrumental in spearheading Infineon’s first and only wafer fabrication plant in Asia, as well as the world’s largest 200mm Silicon Carbide Power Fab. Under his leadership, the Kulim site has transformed into a world-class wafer fab facility, employing over 4,000 people and driving growth, efficiency and excellence in the region.With an illustrious career spanning over 35 years in the semiconductor industry, Mr. Ng has accumulated extensive expertise in both front-end and back-end operations. He is an active contributor to the industry, serving in various associations such as the Semiconductor Fabrication Association Malaysia (SFAM) and the Malaysia Semiconductor Industry Association (MSIA). His thought leadership has earned him a platform to share his insights at numerous industry forums in Malaysia and the region.Beyond his industry accomplishments, Mr. Ng is committed to nation-building. Infineon Kulim has been appointed as the Mission Based Project (MBP 1.2) Champion for NIMP 2030, an initiative by Malaysian government aimed at attracting more wafer fab investments to Malaysia.A graduate of the National University of Singapore, Mr. Ng holds a bachelor’s degree in electrical and Electronic Engineering (1989). He is married with three daughters. Born in Malaysia, he is fluent in English and Malay, and conversational in Mandarin and German.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
10:40 – 11:10
Keynote
Digital: The New Key Strategy of Advanced Manufacturing
The keynote “Digital: The New Key Strategy of Advanced Manufacturing” by Yvonne Keil, Senior Director GlobalFoundries Manufacturing Malaysia/India, highlights the evolving role of digital and remote manufacturing in enhancing the next generation production of semiconductors. The presentation emphasizes the positioning of digital and remote manufacturing as a critical solution to the increasing complexity of chip design, environmental challenges, and the rising cost of fabs. It also discusses the global manufacturing footprint of GlobalFoundries and its differentiation through innovations such as AI-powered analytics, smart manufacturing, and Manufacturing hubs in Penang, Malaysia and Bangalore, India. In the keynote, the importance of the right change management will be examined in more detail. Continued innovation and industry collaboration are key factors to meet future demands.
Yvonne Keil
GlobalFoundries
Yvonne Keil is Senior Director of GF Operations Malaysia & India, leading all Manufacturing Hubs of Globalfoundries, the world’s largest US based semiconductor foundry with manufacturing sites in Singapore, Europe and US. She is located in Penang.
With her roots in Europe Yvonne joined the board of the German high-tech-cluster Silicon Saxony beginning 2021 and was part of the advisory board of SEMI Europe from 2021-2024.
Yvonne brings over 20 years of semiconductor experience in Manufacturing, Automation, Global Supply Chain and Procurement.
The graduate engineer studied electrical engineering at the TU Dresden and the KTH Stockholm with a focus on automation technology, machine learning and artificial intelligence. She has worked at AMD since 2005 and joined GlobalFoundries 2012.
Company Profile
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.
11:15 – 11:30
Networking Break
11:35 – 12:30
Panel Discussion: “Building a Robust Manufacturing Ecosystem”
Topics: Integrating Supply Chain & Manufacturing, Collaboration Across the Ecosystem, Supply Chain Resilience, Geopolitical Impacts, Diversification Strategies
Moderator
Noorazidi Che Azib
Inari Technology Sdn. Bhd. (a wholly-owned subsidiary of Inari Amertron Berhad)
Noorazidi is currently attached to Inari Technology Sdn. Bhd. (a wholly owned subsidiary of Inari Amertron Berhad) as Deputy Vice President for OTSP (Operation Technology and Strategic Programs) and EHS (Environment, Health and Safety). Possessing a Mechanical Engineering degree from University Of Nevada, Reno, USA, Azidi started his career in the semiconductor related high-volume manufacturing, process engineering, automation system design, Industry 4.0 and environment sectors for the past 30 years with experience working with multinational companies like AMD, Hewlett Packard, Agilent and Avago. Beside transforming Inari into digitalization and cyber-physical-system adoption, Azidi has strong relationship with local academia (secondary and tertiary levels) for the work on developing new industrial-ready talents in the preparedness, exposure and pre-experience prior to joining the industry. Established strong collaborations with government agencies such as MPC, MIMOS, MIDA and MITI for the internal adoptions of advanced technology development and supporting local SME productivity and business developments.
Company Profile
Inari Amertron Berhad is an investment holding company with wholly-owned subsidiaries involved in the Outsourced Semiconductor Assembly and Test (OSAT) & electronics manufacturing (EMS) industries. Products manufactured involved the RF filters module in mobile communications, optoelectronic products segment, sensors and indicators in automotive segment and others. Manufacturing capability includes prost wafer processing operations, surface mount technology, package assembly and full RF and electrical test capabilities.
Panelist
Wee Seng Ang
Singapore Semiconductor Industry Association (SSIA)
With over two decades of experience in the semiconductor industry—ranging from fab start-ups and technology development to manufacturing and executive leadership—Wee Seng now helms the Singapore Semiconductor Industry Association (SSIA), where he drives talent development, business growth, and sustainable practices. He also serves on multiple advisory committees, including Singapore Polytechnic’s School of Electrical and Electronic Engineering, NTU’s School of Materials Science and Engineering, Industrial Transformation Asia-Pacific (ITAP), and Enterprise Singapore’s Smart Manufacturing and Environment & Resources Standards Technical Committees. Beyond the industry, Wee Seng is deeply committed to community outreach as a District Councillor with North East CDC. He holds a Bachelor’s degree in Electrical and Electronics Engineering from Nanyang Technological University and a Master of Science in Management of Technology from the National University of Singapore.
Company Profile
Singapore Semiconductor Industry Association (SSIA) is the voice of Singapore’s semiconductor industry and is committed to support this important sector in Singapore in order to facilitate substantial growth of the whole semiconductor economy of the country. SSIA brings together industry players, academia, and government agencies. Major activities focus on industry and talent outreach and continuing education, as well as to collectively address industry needs. SSIA is a platform for members to reach out to new business opportunities, industry alliances, and partners. It provides networking and relationship opportunities beyond the boundaries of Singapore. SSIA members today include companies and organizations throughout all parts of the complex and comprehensive value chain – IC design companies, Manufacturers, Fabless companies, Equipment suppliers, Photovoltaic and LED companies, EDA and material suppliers. Training and service providers, IP companies, Research institutes and Academia, as well as individual members.
Panelist
Dato’ Seri Siew Hai Wong
Malaysia Semiconductor Industry Association (MSIA)
Dato’ Seri Wong Siew Hai has 29 years of working experience in the electronics industry. He served Intel for most of his illustrious career and retired from Intel after 27 years of service. His last position with Intel was Vice President of Technology and Manufacturing Group (TMG) and General Manager of Assembly and Test Manufacturing (ATM), responsible for all assembly test factories worldwide. He also served as the Vice President and Managing Director of Dell’s Asia Pacific Customer Centre for approximately 2 years. Currently, Dato’ Seri Wong is involved in the electronics industry as Champion of the E&E Productivity Nexus (EEPN) and President of the newly formed Malaysia Semiconductor Industry Association (MSIA).
Panelist
Kam Ai Mei
Infineon Technologies AG
Mrs. Kam Ai Mei is the Vice President of Finance and Chief Finance Officer of Infineon Technologies (Kulim) Sdn. Bhd. She has over 23 years of experience in the semiconductor industry, starting in 2000 in Singapore with exposure in manufacturing and later in procurement. She joined Infineon in 2006, and over 18 years, she grew her career within Infineon in diverse roles in various functions including leading Operations Planning & Control in Production Support, Productivity Management, Site Program Office, and Finance Operations. Before being appointed Vice President and CFO of Infineon Kulim in May 2020, Mrs. Kam was assigned to Germany for two years and was responsible for Infineon’s global Post-Merger and Integration for Finance Operations. Currently, Mrs. Kam serves as a committee member in the Kulim Industrial Tenants Association (KITA) and Malaysia Semiconductor and Malaysia Semiconductor Industry Association (MSIA), representing Infineon’s voice in the industry and working with various external stakeholders to represent Infineon’s interest. She graduated with a Bachelor’s degree in Engineering from the University Malaya in 2000. She speaks fluent English and Malay and conversational Mandarin.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
12:40 – 13:40
Networking Lunch
Sponsored by:
InvestPenang
InvestPenang is the Penang State Government’s principal agency for promotion of investment. Its objectives are to develop and sustain Penang’s economy by enhancing and continuously supporting business activities in the state through foreign and local investments, including spawning viable new growth centers. To realize its objectives, InvestPenang also runs initiatives like the SMART Penang Center (providing assistance to SMEs) and Penang CAT Center (for talent attraction and retention).
For more information, please visit https://investpenang.gov.my/
Do follow us on InvestPenang’s social media channels: Facebook ; LinkedIn
Topics: Latest Advancements, Practical Applications, Case Studies, Emerging Technologies, from HPC to Power, Impact on the Industry, Materials Advancements,
13:45 – 14:10
Impact of Generative AI in Advanced Packaging
Advanced packaging has experienced significant growth in recent years, fueled by the rising demand for high-performance computing, artificial intelligence, and autonomous driving. The semiconductor industry is increasingly embracing advanced packaging as a “more-than-Moore” solution to enhance system performance, which ultimately leads to improved device performance, greater bandwidth, reduced latency, and lower power consumption. This discussion will explore the outlook for the advanced packaging market and examine emerging technology trends, with a particular focus on the impact of generative AI and the demand for high-performance packaging solutions. Specifically, it will address the growing adoption of 2.5D and 3D packaging, as well as glass core substrates, as strategies to navigate the associated challenges and seize emerging opportunities.
Yik Yee Tan, PhD
Yole Group
Yik Yee Tan, PhD is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).
Company Profile
Yole Group is an international company recognized for its expertise in the analysis of markets, technological developments, and supply chains, as well as the strategy of key players in the semiconductor, photonics, and electronics sectors.
With Yole Intelligence, Yole SystemPlus and Piséo, the group publishes market, technology, performance, reverse engineering and costing analyses and provides consulting services in strategic marketing and technology analysis. The Yole Group Finance division also offers due diligence assistance and supports companies with mergers and acquisitions.
Yole Group benefits from an international sales network. The company now employs more than 180+ people.
More information on www.yolegroup.com.
Company phone:
+33 472 83 01 80
14:15 – 14:40
Semiconductor Packaging Technologies in the AI Era
This presentation explores the pivotal role of semiconductor packaging technologies in driving innovation within the AI era. Key market trends and growth drivers such as 5G, edge AI, and automotive advancements are discussed. The talk delves into the evolution of semiconductor technologies, highlighting the shift towards compute-centric and AI-driven applications. Emphasis is placed on advanced packaging solutions like chiplets, heterogeneous integration, and co-packaged optics, which are essential for meeting the demands of AI data centers and edge computing. The session concludes with insights into the technical challenges and future directions for semiconductor packaging in AI applications.
Dr. JinYoung Khim
JinYoung, formerly Sr. Vice President, Global R&D Strategy at Amkor Technology. He has more than 23 years’ experience in semiconductor package development and design including Wafer Level, Flip Chip, and MEMS & Sensors. JinYoung has been awarded thirty-five patents and published fifteen papers on advanced packaging technologies at several industry conferences. He holds a Ph.D. in mechanical engineering from Korea Advanced Institute of Science and Technology (KAIST) in Daejeon, Korea.
14:45 – 15:10
LOW COST, SCALABLE and FLEXIBLE line for different types of IC Packaging (LGA, BGA, QFN, SiP, AiP, DrMOS, Power Invertor)
Jimmy Chew
PEP Innovation
Jimmy Chew, the Chief Executive of PEP Innovation, leads the company in developing cutting-edge semiconductor packaging solutions, particularly in panel-level chip-scale packaging. His leadership has driven the company’s mission to create smaller, lighter, and more cost-effective packaging solutions with improved electrical and thermal performance. Jimmy Chew’s innovations aim to revolutionize the semiconductor packaging industry, offering reliable, high-performance packaging technologies designed to meet the growing demands of modern electronics.
Company Profile
PEP Innovation specialises in the technology of panel level packaging. Our business model includes licensing of patents, tech transfer and the marketing of technology to potential product customers and manufacturers.
15:15 – 15:40
How Semiconductors Drive Sustainable Innovation
The demand for electric energy is growing, and finding renewable sources is crucial. Solar and wind energy are leading this change. It’s not just about sourcing energy but also using it smartly. Join Mr. Muggeri as he explores ST’s dedication to sustainability. Learn how our innovative power solutions drive and empower sustainable innovation. We’ll show you how we’re leading the way in renewable energy production and cutting-edge power efficiency solutions. Plus, we’ll give you a sneak peek into our pioneering Energy and Power Conversion applications with examples like DC Microgrid, enabling Microgrid with PV, Energy Storage System and Electric Vehicle charging function, KNX energy management system etc.. And that’s not all! We’ll also introduce you to our innovative Wide bandgap technologies like Silicon Carbide (SiC) and Gallium Nitride (GaN), which are revolutionizing energy usage and paving the way for a greener future.
Francesco Muggeri
STMicroelectronics
Francesco Muggeri is Vice President for Power Discrete and Analog Products, China at STMicroelectronics. In his role, Muggeri leads ST’s Industrial Focused Competence Centers including the Motor Control Competence Center, Power & Energy Competence Center and Automation Competence Center in Asia and is appointed as the Global Leader of ST Industrial Power and Energy Segment in July 2024.
Muggeri joined ST in 1995, as a designer for automotive sensors in Italy. In 2000, he moved to product marketing for power transistors before relocating to Shanghai as marketing manager for transistors in 2002. In 2008, Muggeri moved to Commercial Marketing for STMicroelectronics’ Asia Pacific operations in Hong Kong. He became director for Discrete and Analog Products in 2017 and added Marketing Communications to his mandate in 2018.
Francesco Muggeri was born in Zambrone, Italy in 1969 and graduated with a Master’s degree in Electronic Engineering from the University of Pisa, Italy. In 2014, he received an EMBA degree from the Global Asia Program, organized by the London Business School of London, Columbia University of New York, and the University of Hong Kong. In recognition of his contribution to the electronics industry, Muggeri was awarded the 2023 Asia Executive of the Year by EETimes and EDN from Aspencore.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
15:45 – 16:00
Networking Break
16:05 – 16:20
Harnessing the Benefit of Precious Metals Deposition While Managing Total Cost of Ownership
This presentation will explore the material benefits of precious metals in the wafer fabrication process and important total cost of ownership considerations for the fab. The high cost and market volatility of precious metals create obstacles for high-volume manufacturing. However, in today’s fab, efficient power management requires thin-film performance only possible through the use of gold, silver, platinum and palladium. Materion offers unique insights on how best to manage precious metals inside and outside of fab environments. This presentation will provide an overview of considerations when integrating precious metals into the fab supply chain
Richard Oliveri
Materion
Rich Oliveri serves as Vice President & General Manager, Premium Targets, for Materion Corporation. He oversees a global business that produces precious and non-precious metal sputtering targets for a range of applications, including power and analog semiconductor, communications, hard disk drive, medical and industrial. He has been with Materion for 17 years in roles ranging from operations and technical sales to product management across the company’s electronic materials portfolio. He holds a bachelor’s degree in biology from the University of New Hampshire.
Company Profile
Materion Electronic Materials is a leading global supplier of thin-film deposition and sputtering target materials for semiconductor applications ranging from data storage, power and communications to optoelectronics, logic and advanced memory. Our services include precious metals recovery and refining, precision parts cleaning and metals management.
Customers choose Materion for a variety of reasons, including:
For more information, visit us at materion.com/electronic-materials
16:25 – 16:40
The necessity to have the right logistics partner in South East Asia to support the Global Supply Chain
In an increasingly interconnected world, the success of global supply chains hinges on robust logistics partnerships, especially in dynamic regions like South East Asia. This session will explore the critical role of selecting the right logistics partner to navigate the complexities of regional markets, regulatory landscapes, and cultural nuances. Attendees will gain insights into key criteria for evaluation, the impact of effective logistics on operational efficiency, and strategies for fostering collaborative relationships that drive resilience and innovation in global supply chains. Join us to discover how the right logistics partner can be a game changer in achieving your supply chain goals.
Brandon Kennedy
Airspace
Brandon Kennedy is the Managing Director of High-Tech & Industrials, responsible for driving our geographical expansion strategy and overseeing revenue growth in NAM, EMEA, and SE Asia. With over a decade of experience in time-critical logistics, he has recently led the sales and operations teams from Airspace’s European HQ in The Netherlands.
Since joining Airspace in 2016, Brandon has taken on various roles, from leading the operations team to crafting Airspace International’s global go-to-market strategy. He has driven sales and operational efforts, securing many of our largest clients and facilitating shipments to over 120 countries.
Company Profile
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.
With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.
Company Products & Services
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert team that understands the specific needs of shipments such as those in the semiconductor business.
From NFO, to OBC, dedicated drives, charters and more, the Airspace technology will calculate the best routing for you, taking your specific requirements into consideration as well as automating the process to save your team valuable time.
Your supply chain is complicated — we make it easy for you.
16:45 – 17:10
Keynote
Naveed Sherwani
National Semiconductor Hub Saudi Arabia
Dr. Naveed Sherwani is a world-renowned semiconductor expert, entrepreneur, and leader in chip design. He holds a PhD in computer engineering from the University of Nebraska-Lincoln, and his career spans academia, industry leadership, and entrepreneurship. Early in his career, he served as a professor at Western Michigan University before joining Intel in 1994, where he focused on design automation for complex chips.
Dr. Sherwani has founded or co-founded numerous influential semiconductor companies, including Open-Silicon, Brite Semiconductor, PeerNova, and Rapid Silicon. His ventures have been instrumental in advancing semiconductor technology, raising over $1 billion in funding across these projects. A key figure in the RISC-V movement, he has led the growth of companies like SiFive and SemiFive, contributing to the global rise of RISC-V technology.
In addition to his leadership roles in the private sector, Dr. Sherwani is the Chairman of the National Semiconductor Hub of the Kingdom, where he works on fostering innovation and semiconductor advancements at a national level. He continues to influence the global semiconductor landscape through his contributions to the RISC-V ecosystem and domain-specific FPGA innovations at Rapid Silicon.
Dr. Sherwani has authored multiple textbooks, including the widely-used “Algorithms for VLSI Physical Design Automation,” and has published over 125 technical papers. His leadership in both academia and the industry has earned him numerous accolades, including the Sitara-e-Quaid-e-Azam awarded by the President of Pakistan in 2019.
17:15 – 18:15
Cocktail Reception
18:30 –
Gala Dinner
18:30-Late
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