Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.

Saeed is a seasoned investor and executive with over 30 years of experience growing businesses in numerous industries, including real estate, bottled water, packaging, and technology investing. Following the early success of his various businesses, The Amidi Group initially purchased a building in Palo Alto and decided to rent the extra office spaces to startups.

As the CEO and founder of Plug and Play, Saeed applies his passion for the tech industry daily by working with forward-thinking partners and the best global startups to facilitate positive change worldwide. Since Plug and Play’s launch in 2006, the company has worked with over 90,000 startups, made over 2,000 investments, and boasts over 30 unicorns including Dropbox, PayPal, Lending Club, N26, and Honey. Similar to his unexpected success with the “Lucky Building,” Saeed considered himself lucky overall when he moved to Silicon Valley in the late 70s, where he was then unaware of the ecosystem it would become.

Simi Sherman is Co-Founder and CEO of Chips & Wafers, a semiconductor data and research platform, and VP of Research with ISIG.

After six years at a Buy-Side global equities Hedge Fund, where he was a Partner and led semiconductor research, Simi Co-founded Chips & Wafers. Working together with ISIG, Chips & Wafers provides semiconductor companies and investors with timely and actionable data they utilize in making more informed decisions.

Kevin O’Buckley is senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet standards and software, as well as U.S.- and Europe-based capacity.

Prior to joining Intel, O’Buckley was senior vice president of Marvell’s Compute and Custom Solutions Engineering teams, developing advanced technology chips for infrastructure applications including artificial intelligence and machine learning, 5G wireless, and data center compute and networking. While at Marvell he also served as senior vice president and general manager of the company’s ASIC business, and he was a member of the board of directors at Marvell Government Solutions, developing semiconductor solutions for aerospace and defense customers.

O’Buckley joined Marvell as part of its 2019 acquisition of Avera Semiconductor, where he served as chief executive. He has also held various executive engineering and business leadership roles at Global Foundries and at IBM, where he served for more than 17 years leading technology development and manufacturing organizations.

Dr. Jaesik Lee is Vice President of Package Engineering at SK hynix America. In this role, Jaesik is responsible for the research and development of advanced packaging for next generation High Bandwidth Memory (HBM) and pathfinding initiatives which enrich SK hynix’s innovations. He also focuses on the collaborations with customers to overcome HBM challenges associated with System in Packages (SIPs).

Prior to joining SK hynix America, Jaesik has held various key technical positions through Meta, Google, Nvidia, and Qualcomm where he drove advanced packaging technology developments, Packaging and System Co-optimization, and Manufacturing in Mobile, AI, and HPC applications. He received a PhD in mechanical engineering from University of Waterloo.

Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He leads a global team that is responsible for delivering advanced memory packaging solutions for HBM, high performance compute and AI/ML applications. Dr. Singh joined Micron in 2006 as an interposer materials engineer and since then has held number of positions of increasing responsibility in packaging design, integration and technology development. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA.

Dr. Singh has authored several keynote publications and patents and has served as an invited panel speaker at several conferences. Dr. Singh holds master’s and doctorate degrees in mechanical engineering from Louisiana State University, bachelor’s degree in mechanical engineering from Maharaja Sayajirao University and is a graduate of the Stanford Graduate School of Business Executive Program.

Education:

• Stanford Graduate School of Business Executive Program, Stanford University
• PhD and MS, Mechanical Engineering, Louisiana State University
• BE, Mechanical Engineering, Maharaja Sayajirao University

Madhavan Swaminathan is the Department Head of Electrical Engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center chimes.psu.edu. Prior to joining Penn State, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC) – a graduated NSF-Engineering Research Center (ERC), Georgia Tech (GT). Prior to GT, he was with IBM working on packaging for supercomputers. Prof. Swaminathan’s interdisciplinary research on semiconductor packaging and systems integration over the years have resulted in 650+ technical publications, 200+ invited presentations (seminars, keynotes, panels), 3 books, 5 book chapters, 31 patents, 33 best paper and student paper awards, 5 GT awards, 2 start-ups, and several international recognitions with the recent one being the 2024 IEEE Rao R. Tummala Electronics Packaging Award (technical field award) for “contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems”. He is also the founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is a Fellow of IEEE, Fellow of the National Academy of Inventors (NAI), Fellow of Asia-Pacific Artificial Intelligence Association (AAIA), and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. He received his MS and PhD degrees in Electrical Engineering from Syracuse University, USA.

Roger has more than 30 years of experience in the semiconductor industry and became part of Amkor in 2003. During his tenure at Amkor, he has taken on various leadership positions, and he currently oversees the Chiplet /FCBGA/fcCSP business unit, along with its associated packaging technologies. Prior to joining Amkor, Roger worked at Digital Equipment Corporation and Microchip Technology. He earned a Bachelor of Science in Electrical Engineering from the University of Massachusetts and a Master of Science in Materials Science from Stanford University. Additionally, Roger is an inventor on more than 70 patents related to semiconductor processing, packaging, and applications.

Monita Pau is currently Strategic Marketing Director for Advanced Packaging at Onto Innovation. She works with business leaders and executives to drive strategic planning and leads the development of collaborative initiatives to drive growth and innovation. With over 15 years of experience, her expertise spans across frontend and backend of line process control solutions as well as specialty materials for advanced packaging and assembly. Prior to joining Onto, she held various positions in applications engineering, marketing and strategic business development at DuPont and KLA. Monita holds a Ph.D. degree in Chemistry from Stanford University.

Dr. Nokibul Islam is the Sr. Director of STATS ChipPAC Business Unit, where he leads product business development and advanced technology promotion. With over 21 years of experience in semiconductor product management, business development, and advanced packaging, he previously played a key role in Amkor Technology’s R&D team, focusing on product development, simulation, characterization, and process improvement. He is actively involved in leading industry conferences such as IMAPS, ECTC, InterPack, and Chiplet Summit and has contributed extensively to international publications.

Dr. Chet Lenox is a KLA Fellow and the leader of the Industry and Customer Collaboration Team at KLA, which engages broadly with the semiconductor ecosystem across all of the domains in front-end, packaging, PCB, and Specialty Semi that KLA serves. Previous to KLA, Chet held varies process development and integration roles at Intel, National Semiconductor, and Texas Instruments.

Greg Clemons is a seasoned professional with over 27 years in the semiconductor industry. He currently serves as the Senior Business Development Manager at ASMPT SEMI Solutions in the USA, driving business growth and innovation in advanced packaging. His expertise spans silicon wafer fabrication, advanced packaging, and semiconductor equipment. Greg has held key roles throughout his career, starting as a wet etch process engineer at Intel corporation and progressing from wafer fabrication to facilities construction to advanced packaging R&D where he delivered the 1st HVM TCB process for Intel products. He holds seven advanced packaging patents and continues to innovate in fluxless processing development, and has co-authored many technical papers, including a recent publication in enabling HBM 16H stacks with ASMPT Fluxless AOR technology. Greg holds a Bachelor of Science in Mechanical Engineering and a Master of Science in Materials Engineering from the University of Dayton, Ohio while working at the WPAFB Materials Directorate Labs. His leadership and innovation continue to drive advancements in the semiconductor industry.

Roland Rettenmeier is a seasoned Sales and Business Development expert in Advanced Packaging with 25+ years of experience across PCB, IC substrates, Wafer-Level, and Panel-Level packaging.

After qualifying as a Mechanical Engineer in 1997, he started his career at AT&S AG, where he worked in various departments. In 2005, he completed his MBA in Vienna and continued expanding his expertise through programs like Six Sigma (AT&S, Nokia) and executive education at Stanford University.

Over his 25-year career, Roland built a solid track record in leading high-performance teams and delivering consistent revenue growth in the Advanced Packaging Industry.

In March 2025, Roland joined SCHMID Group as CSO and works with the global sales organization on current and future opportunities.

Roland also plays a key role in the industry as Committee Member and Session Chair of the SEMI Advanced Packaging Conference in Europe and Advisory Board Member of the International Semiconductor Industry Group.

With his deep industry knowledge and global network, Roland remains at the forefront of semiconductor packaging innovation.

Amy has 26+ years of semiconductor experience in P&L management, product development, global sales and marketing, mergers and acquisitions. Prior to joining AEM, she held various senior leadership positions in California US with FormFactor, including Chief Commercial Officer, General Manager, and Chief Marketing Officer.   Amy has been serving as an advisory board member of International Semiconductor Executive Summits (ISES) since 2016, and Singapore Semiconductor Industry Association (SSIA) since 2024.

Amy received a Master of Science degree in materials science and engineering from Stanford University and a Bachelor of Science degree in chemical engineering from the University of California at Berkeley.

Christine Dunbar formerly Head of Strategic Business Development at Natcast, the non-profit entity designated by the U.S. Department of Commerce to operate the National Semiconductor Technology Center (NSTC). In this role, she leads strategic initiatives to advance the U.S. semiconductor ecosystem, fostering collaboration between industry, government, and academia.

Before joining Natcast in March 2025, Christine served as Senior Vice President of Global Sales at IQE, a leading provider of compound semiconductor wafer products and advanced materials solutions. Prior to joining IQE in 2022, she held key executive roles at GlobalFoundries and IBM’s Microelectronics Division.

A Cornell University graduate with a bachelor’s degree in Materials Science and Engineering, Christine has dedicated her entire career to advancing the global semiconductor industry. In recognition of her leadership, she was nominated for the Global Semiconductor Association’s inaugural “Rising Woman of Influence” award in 2018.

Beyond her executive roles, Christine is a recognized thought leader and sought-after speaker on the critical issues shaping the future of the semiconductor industry. She is frequently called upon to present at global industry forums, where she has provided insights on technology innovation, supply chain resilience, workforce development, and global policy. A longtime advocate for diversity in tech, she is also deeply committed to mentoring and inspiring the next generation of leaders, helping to shape a more inclusive and dynamic semiconductor ecosystem.

Ben Rathsack is Vice President of 2 US Business Units within Tokyo Electron America (TEA). He is responsible for the US business management (P/L) of the lithography track/ cleaning system BU (CTSPS) and assembly (3DI)/ test systems BU (ATS) including sales, marketing and service within the US. These business units drive advanced FEOL scaling and BEOL advanced packaging equipment sales. He has worked at TEA for 17 years in various roles including VP of Product and Technology Development (R&D), marketing, new product introduction and process development. He has 23 years of semiconductor experience at Tokyo Electron and Texas Instruments (50 publications/ 30 patents). He received his BS in Chemical Engineering from the University of Illinois/UC and his MS/PhD at the University of Texas/Austin.