AI-Powered Innovation: Driving the Next Wave of Semiconductor Breakthroughs
07:30 – 08:15
Registration
08:15 – 08:25
Understand the Present; Predict the Future
In this presentation, Mr. Sherman will present examples from the ISIG Chips & Wafers data reports that demonstrate the depth and scope of the information we provide to our customers.
Whether you are a Fabless company, an equipment manufacturer or an OSAT our reports provide the timely data you need to make better decisions.
Simi Sherman
VP of Research
International Semiconductor Industry Group (I.S.I.G.)
Simi Sherman is Co-Founder and CEO of Chips & Wafers, a semiconductor data and research platform, and VP of Research with ISIG.
After six years at a Buy-Side global equities Hedge Fund, where he was a Partner and led semiconductor research, Simi Co-founded Chips & Wafers. Working together with ISIG, Chips & Wafers provides semiconductor companies and investors with timely and actionable data they utilize in making more informed decisions.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Scaling AI Performance & Chiplet Architectures
08:30 – 08:50
Keynote
AI use cases in semiconductor data analytics and quality management
AI agents are already making waves by improving known applications that long been used by engineers, developers and every day ordinary users. Semiconductor manufacturing alike has been impacted in the areas of data analytics , traceability, commonality study , corner case identification and more. this presentation will go over some of those AI use cases.
Bizhan Delgoshaei
Head of Custom Silicon Engineering Operation
Bizhan Delgoshaei leads custom silicon engineering operation at google in charge of Tensor manufacturing, test and quality. His career spans over two decades ramping leading edge semiconductor products (FPGA, Memory and Storage, SoC and PMIC, Security Chips and more) from new product introduction to high volume manufacturing. Bizhan has led product engineering , supplier quality engineering and engineering operation organizations in Fabless Semiconductor companies such as Altera, Apple and Google. He holds a masters degree in VLSI from University of Southern California and BS in Electrical Engineering from Sharif University of Technology, Tehran Iran.
Company Profile
A problem isn’t truly solved until it’s solved for all. Googlers build products that help create opportunities for everyone, whether down the street or across the globe. Bring your insight, imagination and a healthy disregard for the impossible. Bring everything that makes you unique. Together, we can build for everyone.
08:55 – 09:15
Future of AI Hardware Enabled by Advanced Packaging
Chiplet architectures are fundamental to the continued economic viable growth of power efficiency of AI hardware and edge computing. The slowing of Moore’s law has also placed advanced packaging at the critical juncture of technology-architecture intersection driving unique product capabilities. New heterogeneous architectures like 2.5D architectures and 3D Hybrid bonded architectures driving AMD’s industry leading advanced technology roadmap to enable power, performance, area, and cost (PPAC) will be discussed. Other topics including Chiplets for AI, challenges and solutions for large chiplet modules etc. will also be discussed.
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD
Dr. Raja Swaminathan is the Corporate Vice President of Packaging at AMD, spearheading the development of AMD’s advanced packaging and heterogeneous integration roadmap. With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan’s expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple’s Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators. Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to their name, Dr. Swaminathan was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
09:20 – 09:40
Future Packaging/System Challenges for AI Data Centers
Artificial Intelligence is the largest technology transformation since Internet revolutionized communication and business. This transformation has required advancement in Si, Memory, Packaging, and System technologies. In this talk, the packaging and system technology challenges will be presented.
Babak Sabi, Ph.D.
VP of Technology
AWS Annapurna Labs
Dr. Babak Sabi is VP of Technology at AWS/Annapurna Lab. Babak joined AWS in 2024 after 40 years in Intel. Babak was Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development. During Babak’s tenure in ATTD 2.5D and 3D Advanced Packages were developed and ramp to high Volume Manufacturing. Additionally ATTD team made many advancement in Substrate and Test Technology.
Prior to leading ATTD, Babak oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.
Babak joined Intel in 1984 after receiving Babak his Ph.D. in solid state electronics from Ohio State University in 1984.
Company Profile
Launched in 2006, Amazon Web Services (AWS) began exposing key infrastructure services to businesses in the form of web services — now widely known as cloud computing. The ultimate benefit of cloud computing, and AWS, is the ability to leverage a new business model and turn capital infrastructure expenses into variable costs. Businesses no longer need to plan and procure servers and other IT resources weeks or months in advance. Using AWS, businesses can take advantage of Amazon’s expertise and economies of scale to access resources when their business needs them, delivering results faster and at a lower cost.
Today, Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. With data center locations in the U.S., Europe, Singapore, and Japan, customers across all industries are taking advantage of our low cost, elastic, open and flexible, secure platform.
09:45 – 10:45
Networking Break and Business Meetings
Coffee & Tea Break Sponsored by:
Airspace
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.
With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert team that understands the specific needs of shipments such as those in the semiconductor business.
From NFO, to OBC, dedicated drives, charters and more, the Airspace technology will calculate the best routing for you, taking your specific requirements into consideration as well as automating the process to save your team valuable time.
Your supply chain is complicated — we make it easy for you.
10:50 – 11:00
Open Innovation Strategy of Resonac, Co-Creative Chemical Company
The cutting-edge semiconductors necessary for the evolution of AI are supported by advances in material and equipment technology. The emergence of chiplet package structures has led to increased complexity in packaging, making collaboration between materials and equipment manufacturers more critical than ever.
Resonac, a co-creative chemical company that provides a variety of semiconductor materials such as CMP slurry, etching gas, materials for HBM, epoxy molding compounds, substrate core materials, and more, is advancing materials technology development through open innovation activities. Resonac has started a Packaging Solution Center to propose one-stop solutions for customers and has established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment, and substrates for 2.xD and 3D packages. Additionally, we will soon start an open innovation activity in Silicon Valley called “US-JOINT.” In this presentation, we will describe our co-creation strategy.
Hidenori Abe
CTO for semiconductor materials, Resonac Holdings Corporation & Executive director, Electronics Business Headquarters, Resonac Corporation
Resonac Corporation
Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.
Company Profile
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Co Package Optics Session
11:05 – 11:25
M. Ashkan Seyedi, Ph.D.
Director, LinkX Products
NVIDIA
Ashkan Seyedi received a dual bachelor’s in electrical and computer engineering from the University of Missouri-Columbia and a Ph.D. from University of Southern California working on photonic crystal devices, high-speed nanowire photodetectors, efficient white LEDs, and solar cells. With a decade of industry experience at Intel, Hewlett Packard Enterprise and now NVidia, Dr. Seyedi has been working on developing high-bandwidth, efficient optical interconnects for exascale, and high-performance computing applications.
Company Profile
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.
11:30 – 11:50
Optical I/O at Copper Scale and Cost
The scalability of new AI models is increasingly constrained by current architectures, particularly the limitations imposed by the number of GPUs that can fit inside a single rack. Moving optical attach directly to the GPU enables scale-up domains of more than 512, overcoming these bottlenecks and providing a path for the next generation of foundation models. Over the past five years, Broadcom’s significant investment over the past five years in Co-Packaged Optics (CPO), is paving the way for optical I/O from the GPUs at cost parity to traditional copper interconnects. The presentation will highlight the benefits of Broadcom’s development strategy, focusing on key decisions such as edge coupling and external lasers, core technology innovations such as a detachable fiber connector, and large-scale manufacturing through automated assembly and test.
Near Margalit, Ph.D.
VP & GM
Broadcom
Dr. Near Margalit has held several executive positions in the optical connectivety industry. He founded Zaffire Inc., a metro DWDM Optical Networking company before moving on to lead Source Photonics as CEO from 2002-2013, growing the company to one of the premier optical transceiver vendors. He was the CTO and Head of Product Development for Intel’s Silicon Photonics for the commercial introduction of Silicon Photonics in 2015-2016. From 2018 to present he has been with the Optical Systems Division of Broadcom where he is currently the VP and General Manager of the division. He holds a Ph.D in Optoelectronics from UC Santa Barbara and a B.S. in Applied Physics from CalTech.
Company Profile
Broadcom Inc. designs, develops, and markets digital and analog semiconductors. The Company offers wireless RF components, storage adapters, controllers, networking processors, switches, fiber optic modules, motion control encoders, and optical sensors. Broadcom markets its products worldwide.
11:55 – 13:00
Buffet Lunch
13:05 – 14:00
Panel Session: How Silicon Photonics is set to transform interconnect architecture for AI
Moderator
Kevin Soukup
SVP/GM Silicon Photonics
GlobalFoundries
Kevin Soukup is Senior Vice President of Silicon Photonics Product Line at GF, a position he was appointed to in 2024. In this role, Mr. Soukup leads the company’s Silicon Photonics business that enables customers to transport enormous volumes of data through high-speed, power efficient electro-optical systems.
Prior to his current role, he served as Chief Strategy Officer developing the company’s integrated strategy and ensuring that GF has the management systems in place to deliver. Mr. Soukup joined GF in 2011 and held positions of increasing responsibility in technology development and manufacturing operations for the next seven years. In 2018, Kevin transitioned to VP of Business Transformation and helped prepare GF for IPO in 2021.
Before his career with GF, Mr. Soukup spent eleven years with Samsung Electronics’ semiconductor unit in engineering and operations management positions.
Mr. Soukup holds a Bachelor of Science in Chemical Engineering from the University of Florida. He currently serves as a member of the board of directors of VueReal.
Company Profile
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.
Panelist
Near Margalit, Ph.D.
VP & GM
Broadcom
Dr. Near Margalit has held several executive positions in the optical connectivety industry. He founded Zaffire Inc., a metro DWDM Optical Networking company before moving on to lead Source Photonics as CEO from 2002-2013, growing the company to one of the premier optical transceiver vendors. He was the CTO and Head of Product Development for Intel’s Silicon Photonics for the commercial introduction of Silicon Photonics in 2015-2016. From 2018 to present he has been with the Optical Systems Division of Broadcom where he is currently the VP and General Manager of the division. He holds a Ph.D in Optoelectronics from UC Santa Barbara and a B.S. in Applied Physics from CalTech.
Company Profile
Broadcom Inc. designs, develops, and markets digital and analog semiconductors. The Company offers wireless RF components, storage adapters, controllers, networking processors, switches, fiber optic modules, motion control encoders, and optical sensors. Broadcom markets its products worldwide.
Panelist
M. Ashkan Seyedi, Ph.D.
Director, LinkX Products
NVIDIA
Ashkan Seyedi received a dual bachelor’s in electrical and computer engineering from the University of Missouri-Columbia and a Ph.D. from University of Southern California working on photonic crystal devices, high-speed nanowire photodetectors, efficient white LEDs, and solar cells. With a decade of industry experience at Intel, Hewlett Packard Enterprise and now NVidia, Dr. Seyedi has been working on developing high-bandwidth, efficient optical interconnects for exascale, and high-performance computing applications.
Company Profile
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.
Panelist
Mark Wade, Ph.D.
CEO
Ayar Labs
Mark is Chief Executive Officer and Co-Founder of Ayar Labs. His prior roles at Ayar Labs include Chief Technology Officer and Senior Vice President of Engineering. He is recognized as a pioneer in photonics technologies and, prior to founding the company, led the team that designed the optics in the world’s first processor to communicate using light. He and his co-founders invented breakthrough technology at MIT and UC Berkeley from 2010-2015 which led to the formation of Ayar Labs. He holds a PhD from University of Colorado.
Company Profile
Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a 1000x improvement in interconnect bandwidth density at 10x lower power. Ayar Labs’ patented approach uses industry standard cost-effective silicon processing techniques to develop high speed, high density, low power optical based interconnect “chiplets” and lasers to replace traditional electrical based I/O. The company was founded in 2015 and is funded by a number of domestic and international venture capital firms as well as strategic investors. For more information, visit www.ayarlabs.com.
Address: 695 River Oaks Parkway, San Jose, CA 95134
Phone: 650-963-7200
Email: info@ayarlabs.com
Panelist
Philippe Absil Ph.D.
VP imec.IC-link / imec silicon solutions
imec
Philippe Absil received his Ph.D. degree from the Department of Electrical Engineering, University of Maryland, College Park, MD, USA, in 2000. His doctoral work contributed to the early demonstrations of optical semiconductor microring resonators. In the early 2000s, he developed the passive photonics platform technology for Little Optics, Inc., Annapolis Junction, MD USA. From 2013 till 2024 he was VP R&D and the head of the 3-D and Optical I/O Technologies Department at imec and has been responsible for the silicon photonics technology platform development since 2010. Before that he spent seven years managing the advanced CMOS scaling program at imec.Now, Philippe is Vice President of imec.IC-link, Silicon Solutions, that offers unique technology services, leveraging imec’s state-of-the-art semiconductor fabrication infrastructure.
Company Profile
Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2021, imec’s revenue (P&L) totaled 732 million euro.
Further information on imec can be found at www.imec-int.com.
Panelist
Matt Traverso
Distinguished Engineer
Marvell Technology
Matt Traverso is a Distinguished Engineer for Marvell Technology with a focus on next generation optical interconnect solutions based on silicon photonics. He has led the development of multiple high volume optical module products at 100Gbps and beyond. Matt has been active in the development and definition of optical communications standards and optical form factors since 2000 including as the original editor of the CFP MSA (Multi-Source Agreement). He has dozens of journal publications and has over 30 patents awarded and pending. He graduated from Stanford University in Materials Science & Engineering.
Company Profile
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.
Panelist
David Lazovsky
Co-founder and CEO
Celestial AI
Dave Lazovsky is the Co-founder and CEO of Celestial AI, the creators of the Photonic FabricTM. Celestial AI, founded in April 2020, has developed the optical interconnectivity technology platform for AI computing.
Prior to founding Celestial AI, Mr. Lazovsky was a Venture Partner at Khosla Ventures. He has 30 years of experience in the semiconductor industry and over two decades of experience building andleading successful start-ups.
In 2004 Mr. Lazovsky founded Intermolecular, a semiconductor and clean energy R&D and Intellectual Property licensing company. He served as the company’s Chief Executive Officer,President and as a member of the board of directors from September 2004 through October 2014. As President and CEO, Mr. Lazovsky led all aspects of the business through its lifecycle from early-stage start-up to public company. Intermolecular (IMI) went public on the NASDAQ in 2011.
He currently has over 80 issued and pending U.S. patents.
Company Profile
AI is touching our lives and driving breakthroughs in healthcare, finance, autonomous systems, and countless other domains. Its ability to process vast data, derive insights, and automate complex tasks unlocks new levels of efficiency and innovation. However, the exponential growth of AI workloads demands greater computational power and more efficient data movement. Traditional electronic interconnects are struggling to keep up, necessitating a paradigm shift in AI infrastructure.
The answer is like night and day.
Celestial AI’s Photonic Fabric is a revolutionary technology that scales AI compute within package and package-to-package across multiple racks. It forms the foundation for an optical scale-up network, overcoming the physical limitations of electronic interconnects. Offering terabytes of low-latency bandwidth, in-network computing, and high-performance memory, Photonic Fabric heralds a new dawn in AI infrastructure.
Switching to optical interconnects enables larger multi-die packages and bigger scale-up domains, creating a leap into the next decade. Photonic Fabric-based products transform AI data centers, scaling thousands of XPUs across racks, enabling larger models, better reasoning, and more efficient inference. By reducing total cost of ownership, this innovation unlocks new use cases and more profitable GenAI business models.
With an aggressive roadmap, a robust ecosystem of partners, and a tier-one supply chain, Celestial AI isn’t just reimagining AI data centers, it’s delivering an AI-driven, sustainable future. At its core, AI isn’t just about algorithms or hardware, it’s about people. Unlocking creativity, solving humanity’s biggest challenges, and making the impossible possible. The future of AI is here. Intelligence, illuminated.
Market Research & Outlook
14:05 – 14:15
Disruption of the semiconductor industry
Based on AlixPartners’ Disruption Index survey of over 3,000 executives globally, several striking trends emerged that show how the semiconductor industry’s resilience is being tested amid geopolitical pressures and the transformative impact of AI. I will discuss the industry leaders’ outlook into the future, how market leaders are navigating geopolitical tensions, tariffs, and supply chain disruptions as well as implementing AI role in driving growth and evolving workforce needs. The survey shows that forward-looking leaders are optimistic about AI’s potential to enhance revenues and manufacturing capabilities and proactively change business and operating models to be the drivers of disruptions.
Markus Bolte, Ph.D.
Partner
AlixPartners
Markus co-leads AlixPartners’ global semiconductor practice. With 20 years of global business experience, he serves clients on their business and operating model transformation and change journeys. He is driven by a passion for measurable impact and the desire to help the semiconductors industry navigate through the disruptions of our age. Before joining Alixpartners, Markus led the strategy at a global technology leader. He started his consulting career at two leading European management consultancy firms. Before joining the consulting world, Markus led a research group for supercomputing and nanophysics research utilizing Nvidia’s CUDA to accelerate complex nanophysics simulations and collaborating with institutions globally. Markus holds a PhD and Masters in Physics and Computer Science.
Company Profile
AlixPartners is a results-driven global consulting firm that specializes in helping businesses respond quickly and decisively to their most critical challenges—from urgent performance improvement to complex restructuring, from risk mitigation to accelerated transformation. These are the moments when everything is on the line—a sudden shift in the market, an unexpected performance decline, a time-sensitive deal, a fork-in-the-road decision. We stand shoulder to shoulder with our clients until the job is done, and only measure our success in terms of the results we deliver.
Company Products & Services
Clients call us when they need pragmatism and cut-through to solve their most complex challenges arising from a continually disrupted world. Our services cover Artificial Intelligence, Corporate Strategy & Transformation, Data Governance, ESG, Growth, Investigations, Disputes & Advisory Services, Mergers & Acquisitions, Organizational Transformation, Supply-Chain Management & Operations, Technology, Transformative Leadership and Turnaround and Restructuring.
Supply Chain Management
14:20 – 14:30
The Emergence of 5PL: Enabling Revenue Growth & Structural Affordability via High Velocity Supply Chain Adaptability
Supply Chains are evolving beyond traditional models. Long-term growth and profitability demands that companies transcend market fluctuations, navigate geopolitical shifts, and leverage technological advancements. Future success necessitates a robust ability to not only withstand and adapt to constant change, but to leverage resiliency as a competitive advantage, thus, ensuring businesses remain prominent even amid uncertainty. As we approach tomorrow’s markets, organizations must integrate advanced technologies like Big Data, AI, machine learning, E2E system transparency, and even autonomous drones to differentiate themselves from competitors. Key considerations include shifting from legacy solutions to future needs, examining cases like global substrate challenges during COVID-19 and the impact of geopolitical tensions on High Bandwidth Memory supply chains. Emerging trends in digital transformation—such as intelligent operational systems, end-to-end visibility, and dynamic sourcing strategies—are essential for tomorrow’s Best-in-Class supply chains. The ability to pivot quickly and recognize unforeseen opportunities is critical. True agility involves not only adapting to known demands but proactively seizing new, unanticipated opportunities, ultimately driving faster growth, stronger collaboration, and higher resilience.
Stuart Love
Director, Global Supply Chain
DSV Inventory Management Solutions
Stuart Love recently joined DSV Inventory Management Solutions (IMS) in Q4 2024 as the Director of Special Projects. He brings a wealth of knowledge and experience from his 19-year career at Intel Corporation. During his tenure at Intel, Stuart held various leadership roles throughout the Global Supply Chain, ranging from Global Planning of Assembly Materials, Assembly Equipment Sourcing leadership, Business Intelligence Systems development, Global Sourcing, Inventory optimization / procurement and most recently as the Director of Memory Sourcing & Strategy for Intel. Stuart’s broad experience and depth of knowledge within Supply Chain and Semiconductor is paired with collaborations with ASU & APICS. He holds degrees in both Marketing and Production Operations Management from University of New Mexico.
Company Profile
For over 20 years and a global network of 4,000+ suppliers, DSV Inventory Management Solutions have helped companies turn their supply chains into a competitive differentiator. By integrating our inventory management operations and supply chain finance program with automation, AI, and data analytics, we streamline processes, boost efficiency, and improve visibility throughout your supply chain — delivering uninterrupted revenue operations and maximizing working capital efficiency.
With the success of our solution, we were recently recognized by Intel as a 2024 Intel EPIC Distinguished Supplier
“As one of the 27 Distinguished Supplier Award recipients in 2024, DSV stands out among suppliers in Intel’s trusted supply chain,” said Keyvan Esfarjani, chief global operations officer at Intel. “Through their relentless drive to improve, they have achieved a level of performance that consistently exceeds Intel’s expectations and serves as a benchmark across the ecosystem.”
The Intel EPIC Distinguished Supplier Award recognizes a consistent level of strong performance across all performance criteria. Of the thousands of Intel suppliers around the world, only a few hundred qualify to participate in the EPIC Supplier Program. The EPIC Distinguished Award is the second-highest honor a supplier can achieve. In 2024, only 27 suppliers in the Intel supply chain network earned this award.
14:35 – 14:45
AI Sustainability Challenges & Solutions
AI deployment brings its own challenges to the data center market, but arguably, the biggest challenge with AI is the availability of power. In a world that is becoming more digital and electric, power and power availability are already at a premium. If we’re going to see all this AI investment, how are we going to power the infrastructure required to do so?
More AI initially means more energy consumption, especially for large language models (LLMs). However, AI also drives more efficiency in machines and increases productivity, which should reduce overall energy usage. The excitement around AI stems from its potential to create a more efficient world in the future. When applied correctly, AI can drive significant energy efficiency.
While digitization is emerging as a pivotal force in fostering sustainability, it also creates an escalating demand for energy. In the new energy landscape, we’re witnessing a shift where leading tech companies are embracing the decarbonization of their energy models. This transformation is empowering data centers to evolve from energy consumers to proactive prosumers, effectively supporting both the demand and supply of energy. Increased automation and AI in the generation and distribution of energy will have long-lasting benefits for our planet.
Currently, it is estimated that 60% of the energy we produce is either lost or wasted due to system inefficiencies, manual practices, or human behavior. In a world that is more digital, more automated, and more AI-led, imagine how much we could reduce energy loss.
Mark Bidinger
C&I Segment President
Schneider Electric
Mark is a forward-thinking leader passionate about the rapid evolution of digital transformation and its impact on businesses. In his current role at Schneider Electric, he is responsible for shaping the vision and strategy that guides customers through their digitization journeys. Collaborating with cross-functional teams, Mark strives to deliver comprehensive solutions tailored to address specific customer challenges. Previously, as Segment President for Cloud & Service Providers, he led Schneider Electric’s global data center operations, growing it into the company’s largest and fastest-growing segment from 2015 to 2022. His ultimate goal is to ensure businesses are resilient, connected, and prepared for the future.
Company Profile
Schneider Electric is the global industrial technology leader, driving sustainable impact.
We are a powerhouse of electrification, automation, and digitization. The unique combination of our electrical and automation technologies intersect with our leadership in software, services and sustainability to rapidly accelerate sustainable impact.
Schneider’s purpose is to create Impact by empowering all to make the most of our energy and resources, bridging progress and sustainability for all. At Schneider we call this Life Is On.
Our mission is to be the trusted partner in Sustainability and Efficiency.
Company Products & Services
Energy management, Industrial Automation, Sustainability and Consulting Services, Industrial Software.
14:50 – 15:50
Networking Break & Business Meetings
Coffee & Tea Break Sponsored by:
Airspace
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.
With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert team that understands the specific needs of shipments such as those in the semiconductor business.
From NFO, to OBC, dedicated drives, charters and more, the Airspace technology will calculate the best routing for you, taking your specific requirements into consideration as well as automating the process to save your team valuable time.
Your supply chain is complicated — we make it easy for you.
Velocity Supply Chain Adaptability
15:55 – 16:35
Panel Session : Optimizing Semiconductor Supply Chain: Tackling Challenges in Advanced Process Management for a Sustainable Future
Moderator
Ilya Zabelinsky
Co-Founder
International SubFAB Research Labs Initiative (ISRL)
Ilya Zabelinsky is a globally recognized technical leader with nearly 30 years of experience in vacuum and gas abatement applications for semiconductor manufacturing. Ilya joined Intel in 1996, contributing to the startup and commissioning of Israel’s first 200mm FAB. He emerged as an operational and technical leader across Intel SubFABs worldwide.
In 2022, Ilya embarked on a mission to “bring Science to SubFAB” and founded the International SubFAB Research Labs. Ilya holds a B.Sc. in Chemical Engineering and possesses broad knowledge and vast practical experience in semiconductor manufacturing processes, FAB equipment, central facilities, and infrastructure.
Company Profile
International SubFAB Research Labs (ISRL) is a privately owned company founded by highly experienced and skilled team of semiconductor industry veterans.
ISRL’s vision is to fill the immense gap between industry’s desire for sustainable manufacturing and its ability to effectively address fundamental efficiency issues associated with handling, abatement and reclaim of hazardous process material waste streams. In other words – all is SubFAB.
ISRL is a first of kind facility with complete infrastructure required to operate a l fleet of 300mm process tools with versatile setup of deposition and dry etching process chambers, in high volume manufacturing-like conditions, to enable a wide range of sustainability research and development projects.
Company Products & Services
We are ENABLERS.
Our facility will enable OTHERS to help semiconductor operations work more sustainably with sharing of best practices leading to a fast and highly efficient deployment of sustainability improvements with a business model enabling clients to both reduce their costs and amplify sustainability benefits, faster time to market for breakthroughs, innovations and operational excellence in sustainable semiconductor manufacturing.
We are opening new horizons in research by understanding the significant environmental challenges that have been historically overlooked by the commercial pressures of value-generating semiconductors fabrication.
Our facility will offer a unique opportunity for companies looking to validate and qualify their equipment and technologies aimed at environmental sustainability.
We will simulate HVM-like conditions to support R&D for next generation gas abatement, materials recycle/reclaim, energy efficiency and other critical segments to enable sustainable semiconductor manufacturing in decades to come.
Panelist
Shiva Esturi
Vice President of Global Supply Chain Management
Micron Technology, Inc.
Shiva Esturi is the Vice President of Global Supply Chain Management at Micron Technology, Inc. In this role, Shiva is responsible for overseeing the end-to-end orchestration of the supply chain to achieve customer service levels, time-to-market, and cost-to-serve objectives. Throughout his career, Shiva has made significant contributions to the field, authoring several publications and frequently lecturing at universities and conferences. He is also an active member of multiple industry advisory boards, where he shares his expertise and insights to help shape the future of supply chain management.
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
Panelist
Najwa Khazal
Chief Operating Officer
Pfeiffer Vacuum+Fab Solutions
Najwa Khazal is the Chief Operating Officer for Busch Group USA and a global business leader with 20+ years of experience across America, China, EMEA, India, and Mexico. She specializes in supply chain management, program management, and digital transformation for $3B organizations in industries such as aerospace, automotive, energy, medical, and more. Najwa excels in leading complex, multimillion-dollar projects from concept to commercialization, while driving cost optimization and sustainable performance. A passionate educator with 12+ years of teaching international business, she is trilingual and recognized for her exceptional leadership, strategic execution, and commitment to operational excellence across global markets.
Company Profile
Pfeiffer Vacuum+Fab Solutions delivers best-in-class vacuum and semiconductor fabrication solutions for a wide range of industries, including semiconductor manufacturing, analytics, research, and other high-tech applications. We combine advanced vacuum technologies, such as pumps, leak detection systems, and measurement instruments, with specialized fab solutions to support critical processes with maximum precision and reliability.
As part of the Busch Group, one of the world’s largest manufacturers of vacuum pumps, vacuum systems, blowers, compressors, and gas abatement systems, we have access to a global network of expertise and innovation. The Busch Group brings together three industry-leading brands: Busch Vacuum Solutions, Pfeiffer Vacuum+Fab Solutions, and centrotherm clean solutions.
With over 8,000 employees in 44 countries, the Busch Group is committed to delivering superior service and cutting-edge technologies worldwide. The group operates 23 production plants across key regions, including China, Germany, the USA, Vietnam, and others, ensuring global reach with local support.
Panelist
Stuart Love
Director, Global Supply Chain
DSV Inventory Management Solutions
Stuart Love recently joined DSV Inventory Management Solutions (IMS) in Q4 2024 as the Director of Special Projects. He brings a wealth of knowledge and experience from his 19-year career at Intel Corporation. During his tenure at Intel, Stuart held various leadership roles throughout the Global Supply Chain, ranging from Global Planning of Assembly Materials, Assembly Equipment Sourcing leadership, Business Intelligence Systems development, Global Sourcing, Inventory optimization / procurement and most recently as the Director of Memory Sourcing & Strategy for Intel. Stuart’s broad experience and depth of knowledge within Supply Chain and Semiconductor is paired with collaborations with ASU & APICS. He holds degrees in both Marketing and Production Operations Management from University of New Mexico.
Company Profile
For over 20 years and a global network of 4,000+ suppliers, DSV Inventory Management Solutions have helped companies turn their supply chains into a competitive differentiator. By integrating our inventory management operations and supply chain finance program with automation, AI, and data analytics, we streamline processes, boost efficiency, and improve visibility throughout your supply chain — delivering uninterrupted revenue operations and maximizing working capital efficiency.
With the success of our solution, we were recently recognized by Intel as a 2024 Intel EPIC Distinguished Supplier
“As one of the 27 Distinguished Supplier Award recipients in 2024, DSV stands out among suppliers in Intel’s trusted supply chain,” said Keyvan Esfarjani, chief global operations officer at Intel. “Through their relentless drive to improve, they have achieved a level of performance that consistently exceeds Intel’s expectations and serves as a benchmark across the ecosystem.”
The Intel EPIC Distinguished Supplier Award recognizes a consistent level of strong performance across all performance criteria. Of the thousands of Intel suppliers around the world, only a few hundred qualify to participate in the EPIC Supplier Program. The EPIC Distinguished Award is the second-highest honor a supplier can achieve. In 2024, only 27 suppliers in the Intel supply chain network earned this award.
VC, Investor Network and Start Up Shark Tank Session
16:40 – 17:20
VC, Investor Network and Start Up Shark Tank Session
Moderator
Davis Auksmuksts
VC & Corporate Innovation
Plug and Play Tech Center
At Plug and Play, Davis lead investments in Fintech & Al startups raising early-stage venture rounds. With a Fintech portfolio of over 235 startups including companies BigID, Blockdaemon, Esusu, Flutterwave, Honey, Trulio, Kustomer, N26, and Tractable, we back founders who are challenging the world today and creating technologies of tomorrow.
Company Profile
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
Moderator
Henry Huang
Ph.D. Investment Director
Micron Ventures
Dr. Henry Huang is an investment director with Micron Ventures, the $300 VC arm of the global leader in computer memory and data storage solutions. He focuses on deep-tech startups developing sustainable compute infrastructure and advanced AI/ML software solutions. Prior to Micron, he had led investments in computing and connectivity with TDK Ventures and extensive operational experience with AT&T, NextG Networks (acquired by Crown Castle), Tarana Wireless, and TTS Wireless (acquired by AMDOC). He holds an MBA degree from Wharton School, University of Pennsylvania, a Ph.D. degree from University of Missouri-Columbia and a B.S. degree from University of Science and Technology of China (USTC).
Company Profile
Company ProfileMicron Ventures is a $300M venture capital arm of Micron Technology, a global leader in innovative computer memory and data storage solutions. The fund focuses on early-stage deep tech startups that develop sustainable compute infrastructure and advanced AI, ML, and software solutions.
Moderator
Lam Capital
Company Profile
Lam Capital invests in innovative companies that are addressing some of today’s most challenging, high-impact problems. From semiconductor subsystems to AI chips and Industry 4.0 technologies, we invest in and partner with startups that are disrupting their respective industries.
Moderator
Rajesh Ramanujam
Director
Applied Ventures
With undergraduate (IIT Madras) and graduate (Purdue University) degrees in mechanical engineering, Rajesh Ramanujam is a technologist at heart. He joined Applied Ventures in early 2019 and is focused on investing in a range of verticals including additive manufacturing and semiconductors.His first job out of graduate school was at Applied Materials, within the core products group where he developed temperature measurement hardware and software control technologies for Rapid Thermal Processing of silicon wafers. He has a varied set of experiences in all aspects of technology development and commercialization (product development, program management, product marketing et. al.) through his time in the product groups.He subsequently entered technology investment banking (at Cowen & Company and Barclays Capital) when he was involved in advising private and public companies on capital raising and M&A in semiconductors, software and internet verticals.Prior to rejoining Applied Ventures, Rajesh was an early member of Lam Capital (corporate venture arm of Lam Research Corporation) where he helped to establish the venture investment group and executed Lam’s investments in life science companies and funds.He spends most of his time outside of work with his family and aspires to spend more time enjoying the sun, the snow and the incredible variety of food that Northern California offers.
Company Profile
Company ProfileApplied Ventures, LLC, is the venture capital arm of Applied Materials, Inc., (NASDAQ: AMAT). Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. For more than a decade, Applied Ventures has invested in startups that are pioneering innovations in smartphones, augmented and virtual reality, AI, driverless cars, big data, life sciences, 3D printing, robotics, cleantech, and advanced materials. Applied Ventures is stage agnostic and invests up to $100M per year globally. We have invested in over 90 companies across 18 countries.
Moderator
Daniel Armbrust
Co-Founder, Director
Silicon Catalyst
Daniel Armbrust is a Silicon Catalyst co-founder, member of the Board of Directors and its initial CEO.Daniel serves as an advisor, board member, board chairman and angel investor for many semiconductor startups. Daniel is an affiliate with Lawrence Berkeley National Labs and recently was appointed to the Industrial Advisory Committee, which advises the Department of Commerce on the R&D strategy for the CHIPS Act. He served as President and CEO of the SEMATECH semiconductor consortium and held various positions in semiconductor manufacturing and development over 25 years at IBM.Armbrust earned a bachelor’s degree in ceramic science and engineering from Pennsylvania State University as well as a master’s of science degree in manufacturing systems engineering from Rensselaer Polytechnic Institute.
Company Profile
Company ProfileSilicon Catalyst is the only incubator + accelerator focused on the Global Semiconductor Industry including Chips, Chiplets, Materials, IP and Silicon fabrication-based Photonics, MEMS, Sensors, Life Science and Quantum.More than 1,200 startup companies worldwide have engaged with Silicon Catalyst and the company has admitted over 100 exciting companies. With a world-class network of mentors to advise startups, Silicon Catalyst is helping new semiconductor companies address the challenges in moving from idea to realization.The incubator + accelerator supplies startups with access to design tools, silicon devices, networking, and a path to funding, banking and marketing acumen to successfully launch and grow their company’s novel technology solutions. Over the past nine years, the Silicon Catalyst model has been proven to dramatically accelerate a startup’s trajectory while at the same time de-risking the equation for investors.The Silicon Catalyst Angels was established in July 2019 as a separate organization to provide access to seed and Series A funding for Silicon Catalyst Portfolio Companies.SiliconCatalyst.UK, a subsidiary of Silicon Catalyst, was selected by the UK government to manage ChipStart UK, an early-stage semiconductor incubator funded by the UK government.In February of 2024, Silicon Catalyst Ventures (SCV) was launched to fund early-stage startups accepted into the incubator’s two-year program. SCV has already made eleven investments in Silicon Catalyst Portfolio Companies.More information is available at www.siliconcatalyst.com, www.siliconcatalystangels.com, www.siliconcatalyst.uk, and Silicon Catalyst Ventures www.sicatalystvc.com.
Moderator
Henry Huang, Ph.D.
Investment Director
Micron Ventures
Dr. Henry Huang is an investment director with Micron Ventures, the $300 VC arm of the global leader in computer memory and data storage solutions. He focuses on deep-tech startups developing sustainable compute infrastructure and advanced AI/ML software solutions. Prior to Micron, he had led investments in computing and connectivity with TDK Ventures and extensive operational experience with AT&T, NextG Networks (acquired by Crown Castle), Tarana Wireless, and TTS Wireless (acquired by AMDOC). He holds an MBA degree from Wharton School, University of Pennsylvania, a Ph.D. degree from University of Missouri-Columbia and a B.S. degree from University of Science and Technology of China (USTC).
Company Profile
Micron Ventures is a $300M venture capital arm of Micron Technology, a global leader in innovative computer memory and data storage solutions. The fund focuses on early-stage deep tech startups that develop sustainable compute infrastructure and advanced AI, ML, and software solutions.
Moderator
Yvonne Lutsch, Ph.D.
Investment Director
Lam Capital
Yvonne joined Lam Capital in October 2024 as Investment Director, bringing over 7 years of venture capital experience from Bosch Ventures USA, where she led investments in deep tech fields like AI, quantum computing, semiconductors, sensors, and industrial technology. She also has 13+ years of operational experience at Bosch, having served in leadership roles across technology scouting, business development, engineering, and manufacturing in both mobility as well as consumer electronics. Yvonne holds a PhD in Applied Physics from University of Tuebingen and a Diploma in Experimental Physics from University of Siegen, both Germany.
Company Profile
Lam Capital invests in innovative companies that are addressing some of today’s most challenging, high-impact problems. From semiconductor subsystems to AI chips and Industry 4.0 technologies, we invest in and partner with startups that are disrupting their respective industries.
Moderator
Blair Georgakas
Investment Manager
Applied Ventures
Blair Georgakas joined Applied Ventures in 2019 while pursuing her MBA at UC Berkeley Haas. She has a broad set of interests across deep tech / hardtech verticals and is currently supporting investments in energy storage and additive manufacturing.
Prior to joining Applied Ventures, Blair led the physical product management team for 3D printing start-up, Shapeways, where she led the launch of over 10 new products, managed strategic partnerships with HP, EOS, EnvisionTec, Formlabs, etc, and implemented lean manufacturing methods to reduce cost. Earlier in her career, she also worked for Northrop Grumman as a materials science engineer with responsibilities including R&D of new materials, material characterization, failure analysis, and process optimization.
Blair graduates from UC Berkeley Haas School of Business with an MBA in May 2021. She also holds a master of science degree in engineering and advanced structural materials and a bachelor of science degree in materials science and engineering from UCLA with a technical breadth in mechanical engineering.
Company Profile
Applied Ventures, LLC, is the venture capital arm of Applied Materials, Inc., (NASDAQ: AMAT). Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. For more than a decade, Applied Ventures has invested in startups that are pioneering innovations in smartphones, augmented and virtual reality, AI, driverless cars, big data, life sciences, 3D printing, robotics, cleantech, and advanced materials. Applied Ventures is stage agnostic and invests up to $100M per year globally. We have invested in over 90 companies across 18 countries.
Moderator
Daniel Armbrust
Co-Founder, Director
Silicon Catalyst
Daniel Armbrust is a Silicon Catalyst co-founder, member of the Board of Directors and its initial CEO.
Daniel serves as an advisor, board member, board chairman and angel investor for many semiconductor startups. Daniel is an affiliate with Lawrence Berkeley National Labs and recently was appointed to the Industrial Advisory Committee, which advises the Department of Commerce on the R&D strategy for the CHIPS Act. He served as President and CEO of the SEMATECH semiconductor consortium and held various positions in semiconductor manufacturing and development over 25 years at IBM.
Armbrust earned a bachelor’s degree in ceramic science and engineering from Pennsylvania State University as well as a master’s of science degree in manufacturing systems engineering from Rensselaer Polytechnic Institute.
Company Profile
Silicon Catalyst is the only incubator + accelerator focused on the Global Semiconductor Industry including Chips, Chiplets, Materials, IP and Silicon fabrication-based Photonics, MEMS, Sensors, Life Science and Quantum.
More than 1,200 startup companies worldwide have engaged with Silicon Catalyst and the company has admitted over 100 exciting companies. With a world-class network of mentors to advise startups, Silicon Catalyst is helping new semiconductor companies address the challenges in moving from idea to realization.
The incubator + accelerator supplies startups with access to design tools, silicon devices, networking, and a path to funding, banking and marketing acumen to successfully launch and grow their company’s novel technology solutions. Over the past nine years, the Silicon Catalyst model has been proven to dramatically accelerate a startup’s trajectory while at the same time de-risking the equation for investors.
The Silicon Catalyst Angels was established in July 2019 as a separate organization to provide access to seed and Series A funding for Silicon Catalyst Portfolio Companies.
SiliconCatalyst.UK, a subsidiary of Silicon Catalyst, was selected by the UK government to manage ChipStart UK, an early-stage semiconductor incubator funded by the UK government.
In February of 2024, Silicon Catalyst Ventures (SCV) was launched to fund early-stage startups accepted into the incubator’s two-year program. SCV has already made eleven investments in Silicon Catalyst Portfolio Companies.
More information is available at www.siliconcatalyst.com, www.siliconcatalystangels.com, www.siliconcatalyst.uk, and Silicon Catalyst Ventures www.sicatalystvc.com.
Panelist
Quick Tsai
Executive Director
Amazing Cool Technology Corporation
Quick Tsai (Shiann-Tsong Tsai) received a Bachelor’s degree in Physics in Taiwan and a Master’s degree in Electrical Engineering from Syracuse University in 2001. He began his career at UTAC Taiwan, where he worked for nine years as the R&D and Engineering Department Manager. During this time, he pioneered the pressure oven devoid process in die attachment, which laid the foundation for the widespread application of pressure oven technology in assembly processes today.
In 2011, he joined MediaTek as the Technical Manager for Package Technology, where he worked for thirteen years. He led initiatives in multi-tier Cu wire bonding packaging technology, enhancing the performance, cost reduction, and efficiency of semiconductor devices.
He then moved to Whalechip Technology, serving as a consultant and board member for six years. Whalechip Technology, a TSMC partner, accomplished the world’s first computing device using Wafer on Wafer technology.
Currently, he is the Executive Director at Amazing Cool Technology, where he drives Covetics material innovation and mass production in various areas, including semiconductors. Throughout his career, he has helped companies obtain several patents in numerous area.
Company Profile
ACOOL uses a patented process to produce graphene-modified copper, which is a new material after graphene and copper form a covalent-metallic bond.
Company Products & Services
The world‘s only mass-producible graphene copper material, all properties exceed those of oxygen-free copper, we named ACOOL COPPER, that are transcendent.
It is formed by graphene and copper. It has dozens of excellent characteristics such as improved mechanical properties, electrical conductivity, thermal conductivity, corrosion resistance, oxidation resistance, EMI resistance, bending resistance, fusible current resistance, high voltage and low leakage, and low temperature coefficient.
Panelist
Hamid Sadjadpour Ph.D.
Founder
Practical OTP Encryption
Hamid Sadjadpour received the Ph.D. degree from University of Southern California. In 1995, he joined the AT&T Shannon Research Laboratory, as a Technical Staff Member and later as a Principal Member of Technical Staff. In 2001, he joined the University of California at Santa Cruz where he is currently a Professor. He has over 240 publications and 25 patents. He is a co-recipient of the best paper awards at the 2007 International Symposium on Performance Evaluation of Computer and Telecommunication Systems, 2008 Military Communications conference, 2010 European Wireless Conference, and 2017 Conference on Cloud and Big Data Computing.
Company Profile
Practical OTP Encryption Inc. was founded by Professor Hamid Sadjadpour from the University of California, Santa Cruz (UCSC). The company’s innovative encryption technology stems from extensive research conducted at UCSC with support from the Army Research Office. Practical OTP Encryption specializes in advanced information-theoretic solutions designed to provide corporations, financial institutions, and government organizations with unmatched, unconditional data security. Its mission is to safeguard sensitive information stored in public clouds or transmitted over networks against state adversaries and cybercriminals, even those with unlimited computational resources. Unlike conventional encryption methods, Practical OTP Encryption ensures immunity from future scientific breakthroughs, offering protection against harvest-now-decrypt-later attacks. Its unique solution is highly adaptable, seamlessly integrating with devices of any size, making it an ideal choice for addressing the dynamic challenges of modern cybersecurity. Practical OTP Encryption is committed to redefining data security with its groundbreaking, future-proof technology.
Panelist
Bonnie Tsim, Ph.D.
Head of Strategic Initiatives and Growth
ATLANT 3D
Dr. Bonnie Tsim is Head of Strategic Initiatives at ATLANT 3D and holds a PhD in Theoretical Physics on the electronic properties of twistronic graphene from the University of Manchester. With expertise across deep-tech strategy, advanced materials, and international ecosystem building, she has led AI strategy and digital transformation at Turner & Townsend and convened global stakeholders in exponential technologies such as quantum and semiconductors at MATTER.
Company Profile
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
Company Products & Services
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Panelist
Masayuki Son
Founder / Managing Director
RESOCHI
Masayuki Son is a seasoned professional in the semiconductor, LED, optics, and photonics industries, with a proven track record of driving business growth and innovation. He has developed relationships with 1,000+ clients globally, including brokers and fabs, while managing operations across Shanghai, Taipei, and Hong Kong.
His efforts helped secure a spot at #312 on Inc. magazine’s 2017 Inc. 500 list, and he was recognized with the Money Mover Award in 2021 for closing the highest number of deals out of a 50-person sales team. Masayuki also successfully established a new entity in Shanghai, further expanding the company’s international footprint.
Currently, Masayuki is leading the way in AI-powered automation and global marketplace development to revolutionize how used equipment transactions are managed. He is excited to share insights on leveraging AI to optimize deal flow, inventory management, and customer outreach.
Company Profile
Revolutionizing the Global Used Semiconductor Equipment Marketplace with AI-Powered Automation
RESOCHI is building a cutting-edge AI-powered platform designed to streamline the buying and selling of used semiconductor and lab equipment on a global scale. Our mission is to eliminate inefficiencies in the market by automating workflows for brokers, refurbishers, and fabs, creating a more transparent and faster transaction environment.
Company Products & Services
Key Platform Features:
✅ AI-Driven Matching System: Our proprietary PITARI Matching System leverages advanced algorithms to connect buyers and sellers with high precision, reducing deal cycles by up to 50%.
✅ Workflow Automation for Brokers and Refurbishers: Similar to Zapier and Make (Integromat), our platform automates repetitive tasks across email, CRM, LinkedIn, and messaging platforms—boosting efficiency and reducing manual errors.
✅ Predictive Analytics for Market Insights: We utilize historical data and trend analysis to empower buyers and sellers with real-time market intelligence, enabling data-driven decision-making.
✅ Smart Listing Optimization: AI optimizes equipment listings by recommending ideal titles, descriptions, and pricing based on market trends and buyer behavior.
✅ Negotiation Assistance: AI-powered chatbots assist users in the negotiation process, providing guidance on fair pricing and terms.
📈 Proven Traction & Growth:
•Closed 41 transactions in 2024, generating nearly $5M in revenue with close to $1M in gross profit.
•Established a trusted network of fabs, refurbishers, and brokers worldwide.
•Developed and deployed proprietary AI CRM and PITARI Matching System.
🛠️ Resochi Services: Enhancing the Ecosystem
In addition to our marketplace, Resochi Services offers parts, labor, repair, and refurbishment solutions to extend the lifecycle of semiconductor equipment, providing added value to our clients.
📊 2025–2026 Roadmap & Expansion Plans:
•Phase 1 (2025): Expand the team and enhance AI automation, with a focus on workflow automation for brokers and refurbishers.
•Phase 2 (2025–2026): Launch SaaS solutions tailored for global brokers and manufacturers, integrating advanced AI features to drive operational efficiency.
•Phase 3 (2026+): Establish warehouse/logistics operations to enable end-to-end services, positioning Resochi as a complete ecosystem solution.
Panelist
Catherine Liu
Co-Founder
Kelvin Cooling
Catherine is the Co-Founder of Kelvin Cooling, which builds high-efficiency nano-film evaporation cooling solutions for data centers. She has a background in data engineering and product development and is passionate about turning advanced thermal technologies into scalable, real-world solutions. Catherine leads business operations, bridging deep-tech innovation with practical execution. She has had the opportunity to collaborate with researchers at UC Berkeley for further test validations. Catherine is deeply driven by sustainability and the need for energy-efficient cooling in next-gen computing. She also works closely with company partners and advisors to support customer discovery, fundraising, and strategic growth.
17:45 – 19:45
Closing Terrace Networking Reception
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