Micro-Tech, Mega Impact: MEMS Shaping the Future of Experience

Venue: IME A-STAR 

08:15 – 08:55

Registration

09:00 – 09:20

Keynote

Anton Hofmeister

Group Vice President, General Manager, Central R&D, Analog, Power & Discrete, MEMS & Sensors Group

STMicroelectronics

09:25 – 09:45

The Future of MEMS – Pathways for Innovation and Collaboration

MEMS technology provides miniaturization, precision, and scalability, while quantum technologies introduce superposition, entanglement, and unprecedented sensitivity. The convergence of these fields enables hybrid quantum–MEMS systems with transformative potential. European quantum pilot lines offer fertile ground for accelerating such innovation, but strong cooperation across disciplines will be essential to fully realize their promise. Early demonstrations, such as quantum sensing for next-generation GPS and pathways toward chip-scale entanglement, highlight how these technologies can unlock novel device functionalities. Exploring this synergy will define new frontiers for MEMS and shape the future of quantum-enabled applications.

Christina Hirschl, Ph.D.

CEO

Silicon Austria Labs (SAL)

09:50 – 10:10

Building a MEMS and Optoelectronics Platform to Enable Technological and Industrial Innovation

Wei Wang, Ph.D.

Senior Director

Shanghai Industrial Technology Research Institute (SITRI)

10:15 – 10:35

A new MEMS manufacturing paradigm – democratized fabrication

Accelerating innovation in MEMS devices requires the establishment of a new manufacturing paradigm that democratizes access to microfabrication. In an ever-more interconnected world powered by IoT sensors and actuators, new application-specific technologies are rapidly emerging with unique fabrication requirements. Traditional manufacturing approaches create significant barriers to entry, limiting innovation to well-funded organizations. InchFab has developed a modular fabrication platform that breaks down these barriers, enabling rapid prototyping and production of custom MEMS devices. This democratized approach to MEMS fabrication accelerates device development cycles and empowers a broader community of innovators to bring their microscale ideas to life, ushering in a new era of accessible microfabrication innovation.

Mitchell Hsing, Ph.D.

CEO

InchFab

10:40 – 11:00

MEMS-CMOS Integration: Process Innovation Enabling the Future Experiences

This talk highlights Silterra’s CMOS-MEMS integration platforms and scalable manufacturing driving the next generation of intelligent microsystems. Material breakthroughs like Aluminum Scandium Nitride (AlScN) enable high-performance piezoelectric MEMS for CMOS-PMUT integrated devices, while Silterra’s MOEMS integrated platform pushes boundaries by seamlessly combining mechanical, optical, and electronic components into manufacturable systems, including micromirrors and other MEMS solutions. Application examples, such as ultrasound imaging in healthcare and smart headlamps (ADB) in automotive, show how these advances move from research to real-world applications, paving the way for smarter, safer, and more connected user experiences.

Timothy Lee

Senior Director, Business Development

SilTerra

11:05 – 11:25

TSRI – Speaker TBA 

11:25 – 11:50

Networking Coffee & Tea Break

New Applications & Use Cases Driving Technology

11:55 – 12:15

Zhu Yao, Ph.D.

Head of Department, MEMS Program

IME A*Star

12:20 – 12:40

New Generation AI glasses and Micro Cooling Technology

Joseph Jiang

CEO & Co-Founder

xMEMS Labs, Inc.

12:45 – 13:05

Jan Mehner

CEO

i-ROM GmbH

13:10 – 14:10

Networking Lunch

Research & Academia

14:15 – 14:35

Ming Wu, Ph.D.

Professor

UC Berkeley/Neye

14:40 – 15:00

David Horsley, Ph.D.

Professor

NanoSI- Northeastern University

Startup Session

15:05 – 15:25

Intelligent Gas Sensing at Scale: From Electrified Mobility to Smart Energy

Gas sensing is emerging as a cornerstone for safety and intelligence in next-generation mobility and energy systems. However, today’s solutions remain critically limited in performance, scalability, and reliability for applications such as EV battery prognostics and smart energy networks. Serinus Labs addresses this gap with ultra-low power, application-specific sensors designed for mass manufacturability — enabling safer battery systems, smarter energy networks, and frontier energy exploration.

Hossain Fahad, Ph.D.

Chief Executive Officer

Serinus Labs, Inc.

15:30 – 15:50

Unprecedented Cost Effective Thermal Imaging Sensor fabricated solely in CMOS Fab for AI Applications

As AI technology accelerates, the demand for low-cost, mass-producible thermal imagers is growing—driven by the need for high-quality data to train AI models and enable intelligent applications across industries such as smart appliances, automotive, IoT, healthcare, and security. Meridian Innovation’s SenXor™ platform addresses this need with thermal imaging sensors built on a scalable, hybrid silicon CMOS structure. This design supports compact, cost-effective manufacturing and is backed by a robust and efficient supply chain.

Piotr Kropelnicki, Ph.D.

VP of Engineering & Co-Founder

Meridian Innovation Pte Ltd

15:55 – 16:15

Lennon Lee, Ph.D.

CEO

Paeonia Innovations Pte. Ltd.

16:20 – 16:40

Zepsor: Sensing Without Power — Enabling the Next Wave of Human–Machine Interfaces

Edge AI is only as useful as its ability to know when a human is there. Zepsor’s zero-power infrared MEMS sensors provide that missing link by operating in an off-but-alert state—harvesting ambient IR to mechanically trigger a microswitch and wake systems only on a target event. This event-driven architecture eliminates standby drain and enables truly always-ready human–machine interfaces across wearables and smart glasses, AR/VR, smart buildings, automotive cabins, healthcare/public touchless systems, and security.

In this talk, I’ll unpack what zero-power sensing means for scaling edge AI sustainably and show how our patented device physics translates into instant presence/gesture detection with near-zero standby power. I’ll also preview customer traction and the multi-segment market opportunity for low-power HMIs, and detail our lab-to-fab transition—including initial prototypes from a commercial foundry featuring wafer-level vacuum-sealed devices. To close, I’ll present a video demonstration of instant detection in action and discuss how “off-but-alert” sensing unlocks responsive, human-centric AI at massive scale.

Matteo Rinaldi

Co-founder & CEO

Zepsor Technologies, Inc.

16:45 – 17:15

Networking Coffee Break

17:20 – 17:40

Project-based Talent Development for MEMS Industry – a case study

In this talk, we present the R&D projects, emploment placement, and scientific publication outcomes of MEMS talent development under a joint scheme amongst Melon Tech, Shanghai University and the National Innovation Center par Excellence. With this joint scheme, graduate students from Shanghai University engage in industrial R&D projects identified by Melon Tech, a Hi-Tech MEMS startup company, with partial Scholarship earmarked to.encourage project-based learning. The results suggest that the scheme is much welcome by the students, the collaboration industrial partner, as well as the broad MEMS industry in China.

Yuandong Gu, Ph.D.

Vice President

National Innovation Center par Excellence

17:45 – 18:05

Michelle Kiang

Founder 

MTM Venture Partners

18:30 – 21:00

Dinner Offsite

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