Demonstrating the Impact of MEMS and Sensors and Strategic Collaboration & Investments Needed for Further Adoption

07:30 – 08:30

Registration

08:30 – 08:50

M.S.W.S., I.S.I.G. and P&P Welcome

Salah Nasri

CEO and Co-Founder

International Semiconductor Industry Group (I.S.I.G.)

Saeed Amidi

Founder & CEO

Plug and Play Tech Center

Rouzbeh Borhani

Head of Semiconductors

Plug and Play Tech Center

Rouzbeh Borhani

Head of Semiconductors

Plug and Play Tech Center

The Future of MEMS and Sensors in a Connected World

08:55 – 09:15

Keynote

Sensing Hope at the Edge

Machine Learning at THE EDGE. Nearly every company, investor, product launch, and presentation these days is about “ML at The Edge” as the next, great technology wave. And where there is a wave, there are riders, hoping to cash in. For me, sensors are clearly the edge, breaking the boundary between the physical and digital worlds. Driven by cost, size, power constraints, MEMS is the technology sensing the edge. And with so much data being collected, doing the analysis at the edge with ML decreases latency and saves power on data transmission. But where is the money? I’ll talk about the forces at play, large and small, and offer some experiences from MEMS at the edge. And also share my hope that beyond the hype, there is good to be done. That new understanding from all the data and algorithms will help us to leave the planet better than we found it.

Peter Hartwell, Ph.D.

VP, Engineering

TDK InvenSense

09:20 – 09:40

Keynote

Sensors and Systems in an AI first world

It seems that everything today is an AI first device, but what does this mean? In this talk I will discuss some of the ways that AI is impacting how Google thinks about our hardware devices and the components within. I will talk through some of the growing systems level considerations for number of sensors, quality and precision of measurements as well as how compute is distributed to handle the various AI models that exist. The goal will be to give the audience an overview of what exists today as well as some possibilities of how they can help shape devices of tomorrow.

Michael Pate, Ph.D.

Director of Audio Technology Development

Google

09:45 – 10:45

Networking Break and Business Meetings

MEMS and Sensors Advancing AI

10:50 – 11:10

Enhancing human perception – sensors of the future as extensions of our five senses

Sensors have always enabled new ways of interacting with the world that surrounds us. By enhancing our natural abilities to see, hear, taste, smell and touch, they are a natural extension of our 5 senses. Thanks to the rapid advances of AI, we will soon be able to experience a new level of personalization, assistance and support through sensor-enabled devices, touching all aspects of our lives.
Developing and producing high-performance sensors which are secure, sustainable, affordable and easy to use is our mission at ST. Aligned with our mission, the speech will showcase examples of sensor-driven innovation in several applications like wearables, vital sign monitoring, mobility and robotics.

Anton Hofmeister

APMS Group Vice President & General Manager R&D and Strategy for the Analog and Mems Sub Groups

STMicroelectronics

11:15 – 11:35

Understanding “who spoke when?”: High SNR MEMS Microphones and the Evolution of AI Understanding

Better audio input is essential for making AI suitable for everyday use. In noisy environments, AI can more easily recognize different speakers in a conversation if audio is recorded with high SNR (Signal-to-Noise Ratio) MEMS microphones. Improving audio input reduces misunderstandings and enhances the quality of translations. AI applications using high SNR MEMS microphones revolutionize how devices interact with the world by enabling advanced environment recognition, speaker recognition and sound classification.

Roberto Condorelli

Director of Marketing

Infineon Technologies AG

MEMS Sensors Manufacturing and Solving Problems for Emerging Applications

11:40 – 12:00

Monolithic CMOS-MEMS Foundry Convergence: Unlocking the Future of Piezoelectric Sensors and Emerging Technologies

The convergence of monolithic CMOS and MEMS foundries is paving the way for the next generation of sensor technologies, particularly in the realm of piezoelectric devices. This integration allows for the seamless coupling of advanced semiconductor fabrication with MEMS structures, enabling ultra-compact, high-performance piezoelectric sensors. The emergence of chiplet-based architectures further enhances design flexibility, reducing costs, and accelerating time-to-market. This presentation will explore how this convergence supports the development of cutting-edge technologies, ranging from advanced wearables to medical devices, and its implications for the future of sensor-driven applications across industries.

Eloi Marigo, Ph.D.

Senior Manager

SilTerra

12:05 – 13:05

Buffet Lunch

13:10 – 13:30

From an Idea to a Sensor Product: Micro Needle Case Study

What all is needed to fabricate a new sensor component, using microneedles as a case study. Raw concept idea, expected specifications, defining the uncertainties, when to include the foundry. Collaboration is vital to identify the unknowns in function and fabrication and to prepare needed design variants to derisk the prototypes and achieve informative results as early as possible. And with first results come specification refinement, what should the end function really be? Learning through a biomedical micro needle implant project.

Jared Crawford

Senior Integration Engineer

Teledyne MEMS

13:35 – 13:55

Advancements in Silicon Photonics Through Heterogeneous Integration

Heterogeneous Integration (HI) is critical to silicon photonics as new materials improve specifications. HI supports advances in , telecom, quantum computing, AI, AR/VR and biomedical sensors. X-FAB will act as an open foundry offering a modular integration architecture for lasers, modulators and photodetectors using its 200mm MEMS toolset.

Stefan Ernst, Ph.D.

Director Business & Strategy Microsystems

X-FAB

14:00 – 14:10

The Future of Atomic Layer Advanced Manufacturing

ATLANT 3D is pioneering a new era of atomic-scale manufacturing, enabling the creation of materials and devices with unprecedented precision. Our patented Direct Atomic Layer Processing (DALP®) technology redefines microfabrication, bridging the gap from lab to fab. With our NANOFABRICATOR™ platform, research teams and industries can develop next-generation  quantum, semiconductor, advanced packaging, MEMS/sensors and space technologies faster and more efficiently. By replacing complex, resource-intensive processes with precise atomic-scale fabrication, we empower innovators to build the technologies of tomorrow while driving sustainability. Join us to explore how atomic control is unlocking new possibilities for advanced manufacturing and scientific breakthroughs.

Bonnie Tsim, Ph.D.

Head of Strategic Initiatives and Growth

ATLANT 3D

Research Enabling Advanced MEMS and Sensors

14:15 – 14:25

MEMS at the crossroads of innovation – Converging with emerging technologies

What if the smallest microsystem could unlock the biggest technological breakthroughs?! MEMS have already revolutionized countless sectors, but their true potential is only beginning to unfold. At Silicon Austria Labs (SAL), we are looking at MEMS converging with photonics, magnetics, AI and even quantum technologies—pushing the boundaries of precision, speed, and intelligence. The future of transduction isn’t just about miniaturization – it’s about pioneering intelligent, hyper-connected ecosystems that will transform industries in ways we never imagined. Join us for a glimpse into SAL unfolding the future!

Dr. Mohssen Moridi photo

Mohssen Moridi, Ph.D.

Senior Executive Director & Head of the Microsystems Research Division

Silicon Austria Labs (SAL)

14:30 – 14:50

APECS Research Pilot Line for advanced heterointegration innovations in the MEMS Industry

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS), funded by the EU Chips Act, advances Europe’s semiconductor manufacturing and chiplet innovation. With €730 million over 4.5 years, it enhances EU technological resilience by bridging application-oriented research with innovative chiplet technologies. APECS focuses on chiplet system design for computing, AI, and MEMS sensors/actuators, using 3D stacking, 2.5D wafer-level integration, and quasi-monolithic integration. It aims to be Europe’s hub for advanced packaging, fostering collaboration among RTOs, industry, and academia to accelerate progress from research to scalable manufacturing.

Jörg Amelung photo

Jörg Amelung

Deputy Institute Director Division, Director Engineering, Manufacturing & Test

Fraunhofer Institute for Photonic Microsystems

14:55 – 15:25

Networking Break

Innovations from Start Ups

15:30 – 15:50

Unlocking the Unseen: Polarization Image Sensing for Consumer Electronics

A single metasurface, made of subwavelength nanostructures, can perform optical functions that traditionally require multiple refractive or diffractive optics. In addition to the cost, size, and complexity improvements they offer to existing sensing systems, their unique ability to capture polarized light information enables new sensing capabilities at unprecedented form factors. Metalenz is bringing never-before-accessed information to machine vision with Polar ID, the first complete system solution built around metasurface optics. It is a new way of image sensing for mobile and beyond, enabling new insights and use cases for machine vision systems and consumers.

Rob Devlin, Ph.D.

Co-Founder & CEO

Metalenz

15:55 – 16:15

The Seismic Patch for Cardiovascular and Pulmonary Monitoring and Diagnosis

The convergence of precision Micro-Electro-Mechanical Systems (MEMS) sensors and actuators and Artificial Intelligence (AI) is revolutionizing digital health, particularly in cardiopulmonary and vascular care. MEMS-based sensors enable continuous, real-time monitoring of physiological parameters by analyzing heart and lung sounds and vascular dynamics with high precision and minimal invasiveness. When combined with AI-driven analytics, these data streams provide deep insights into cardiovascular and pulmonary health, facilitating early disease detection, personalized interventions, and improved patient outcomes.
This talk introduces the SeismicTM Patch, a smart wearable device empowered by the integration of MEMS, CMOS and AI algorithms in a small size that provides longitudinal monitoring and interpretation of complex cardiovascular and pulmonary acoustic signals, enabling automated diagnostics, predictive modeling for patient-specific risk assessment, and decision support for clinicians.

Farrokh Ayazi, Ph.D.

Founder & CEO

StethX Microsystems

16:20 – 16:30

The path to quantum sensor wafer level manufacturing

Scaling quantum sensors from lab prototypes to high-volume manufacturing requires bridging the gap between precision quantum physics and semiconductor fabrication. At Mesa Quantum, we are developing a wafer-level manufacturing process to enable cost-effective, chip-scale quantum sensors for Position, Navigation, and Timing (PNT) applications. This involves integrating quantum materials with CMOS-compatible techniques, optimizing vacuum packaging, and ensuring reproducibility at scale. Collaborating with MEMS foundries is critical to achieving the precision and scalability needed for commercial deployment. This talk will explore key challenges, process innovations, and the role of foundries in advancing quantum sensor manufacturing for real-world applications.

Sristy Agrawal, Ph.D.

CEO & Co-founder

Mesa Quantum Systems

16:35 – 17:15

Panel Session Fueling Innovation and Overcoming MEMS Adoption Challenges: A Path Forward

Moderator

Britta Aldejohann

Principal R&D/Product Development Engineer

TE Connectivity

Panelist

Alissa M. Fitzgerald, Ph.D.

Founder & CEO

A.M. Fitzgerald & Associates, LLC

Panelist

Marcellino Gemelli

Business Development

Bosch Sensortec

Panelist

Martin Lim

VP MEMS Technology

xMEMS Labs, Inc.

Panelist

Mitchell Hsing, Ph.D.
CEO

InchFab

Panelist

Eric Aguilar

CEO

Omnitron Sensors

17:20 – 18:00

VC Shark Tank: MEMS and Sensors Startups

Moderator

Rouzbeh Borhani

Head of Semiconductors

Plug and Play Tech Center

Moderator

Yvonne Lutsch, Ph.D.

Investment Director

Lam Capital

Moderator

Walter Liu

Investment Director

Applied Ventures

Moderator

Laura Swan

General Partner

Silicon Catalyst Ventures

Panelist

Mahyar Khosravi, P.Eng

Chairman & CEO

Nitride Global

Panelist

Farrokh Ayazi, Ph.D.

Founder & CEO

StethX Microsystems

Panelist

Coralie Gallis Ph.D.

Co-Founder & Chief Technology Officer

SM24

Panelist

Seena Partokia
Founder and CEO

Cenfire Corporation

Panelist

Aftab Farooqi, Ph.D.

Founder & CEO

ChipHub

Panelist

Cris Ugolini, Ph.D.

Founder & CEO

Alithia Power

Panelist

Nilesh Gharia

Founder & CTO

Numem

18:30 – 20:30

Closing Cocktail Reception at Plug & Play TC Terrace

End of content

End of content