2-3 December 2025
Tokyo

BOLTCHIP builds Innovation Capability Centers (ICCs) for semiconductor and chip design engineering across Asia, enabling organizations to build and scale world-class talents teams for breakthrough innovation. As organizations accelerate their digital initiatives in semiconductors and AI, many struggle to build sustainable capability at scale through traditional outsourcing or hiring models.
At BOLTCHIP, we engineer high-performance ICCs through our proven BOLT Model-Build, Operate, Learn, Transform & Transfer-a strategic framework that ensures centers evolve with your goals, embedding efficient processes, lean structures, and measurable productivity improvements. Our ICCs are designed to move systematically up the value chain: from building world-class talent teams → to enabling IP-driven innovation.
Through our BOLT Model (Build, Operate, Learn, Transform & Transfer) we deliver a comprehensive ecosystem of services:
Research & Advisory – Location and market trends analysis, talent intelligence, and strategic planning to guide your ICC setup and expansion.
Talent Ecosystem – End-to-end talent sourcing, leadership hiring, and Employer of Record (EOR) services to build your world-class engineering teams.
Workspace Services – Custom-built offices, flexible leasing, hospitality services, and IT infrastructure tailored for semiconductor and AI development environments.
Business Enablement – Finance, tax and regulatory support, IP protection, and HR & legal advisory to ensure compliant and secure operations.
Collaborative Learning – Reskilling and upskilling programs with continuous improvement frameworks to keep your teams at the cutting edge.
Transformation – Agentic AI and innovation capabilities, plus specialized IC design services to drive breakthrough results.
Our asset-lite approach moves you systematically from building world-class talent teams → to enabling IP-driven innovation, empowering you to enter the global semiconductor ecosystem with speed and sustained competitive advantage.