Corning Incorporated

ISES Member

Company Profile

Solving the World’s Toughest Optical Challenges with Innovation, Collaboration, and Precision.

Corning’s diverse Advanced Optics portfolio reflects our deep understanding of the properties of light, its interaction with matter, and the instruments used to detect it. For decades, we have been a trusted optics collaborator with leaders in a wide range of markets, including aerospace and defense, semiconductor materials and optics, telecommunications, and glass ceramics. We offer a diverse set of optics technologies providing solutions to full complex systems. Customer collaboration is the hallmark of our operations.

The Semiconductor Technologies & Solutions business is growing its investments to deliver an innovative and diverse set of glass and crystal components, and advanced optical sub-assemblies for modern lithography scanners, optical inspection systems, and advanced packaging substrates.

Learn more:

Semiconductors: Corning doesn’t just chip in; we help lead the way

Corning’s glass innovations help artificial intelligence enhance the way we work, learn, and live. 

About Corning Incorporated

Corning is vital to progress – in the industries we shape and in the world we share. We invent life-changing technologies using materials science. Our scientific and manufacturing expertise, boundless curiosity, and commitment to purposeful invention place us at the center of the way the world interacts, works, learns, and lives. Our sustained investment in research, development, and invention means we’re always ready to solve the toughest challenges alongside our customers.

Product & Services

  • Optical glass and crystalline materials for lithography tools (Deep-UV lenses and Extreme-UV mirrors and photomask blanks)
  • Optical assemblies (modules, objectives) for Deep-UV, UV, Vis optical inspection tools
  • Glass substrates for advanced packaging:
    • Glass wafer temporary carriers for 2.5D, 3D packaging, Fan-Out, Si/SiC wafer thinning
    • Glass panel for panel-level Fan-Out, glass core substrates