CuNex

CuNex offers copper sinter pastes and preforms for high-power electronics packaging (die attach, substrate attach, die topside attach). Our copper-based interconnect materials follow a low pressure and rapid sintering approach ensuring improved reliability and performance at a substantial cost advantage over silver sintering.

After 7 years of extensive research, CuNex launched the Cuprum series of sinter pastes and CuForm sinter preforms. The copper pastes and preforms are suitable for Si, SiC and GaN devices as well as high power LEDs.

Specialized engineering solutions also allow for sinter lamination of substrates and die attach supporting embedded chip technologies.

The product development and volume manufacturing are driven by SCHLENK with a history of 150 years in copper and copper alloys.

The Cuprum pastes and CuForm preforms have class leading features:

– Low cost
– Fast drying in air
– Low sintering temperature and pressure
– Rapid sintering process
– High thermal conductivity
– Flexibility on die size and standard metallizations
– No nanoparticles
– Storage at room temperature for up to 6 months