27-28 August 2025
Suwon
DIS Tech is a business branch of Technoprobe S.p.A. aimed at strengthening company’s competencies in the PCBs and high-performance interfaces market consolidating the full vertical integration of its business model.
Testing of a chip occurs both at wafer level and package level. These different phases require different types of device interface boards: a Probe Card (PC) with an integrated probe head and needles that contact the wafer before packaging, and the Final Test (FT) board that includes sockets specific to the packaged integrated circuits shape and size. DIS Tech provides the expertise to design, manufacture, and assemble these types of boards, as well as Prober Interface Boards (PIBs).