E&R Engineering Corp.
ISES Member
Company Profile
Advanced Laser & Plasma Innovation Provider
Established in 1994 and headquartered in Taiwan, E&R Engineering Corp.(OTC: 8027) has been delivering advanced laser and plasma solutions to the semiconductor industry for 30 years. Evolving from a tool provider to a solutions leader, we focus on TGV, FOPLP, FCBGA, FCCSP, ABF micromachining, and advanced materials like glass, SiC, and GaN, as well as 2.5D/3D Advanced Packaging.
Our strengths include flexibility, customized solutions, and robust global support. With 10+ service bases and 50+ field service engineers across Taiwan, China, Southeast Asia, the US,and Europe, we provide swift support and continuous process optimization.
Product & Services
TGV, FOPLP, FOWLP, FCBGA, FCCSP, Fan-Out, and Fan-In (Wafer Level Packaging),Laser Marking, Laser Cutting, Laser Drilling, Laser Scribing, Laser Grooving, Laser Beveling, Laser Debonding, Laser Ablation,
Plasma Dicing, Plasma Etching and Thinning, Plasma Descum, Plasma Clean, AOI, ABF Drilling, Dry Ice Cleaning, Carrier Tape