Lidrotec is a German deep-tech start-up from Bochum in the heart of the German Rust Belt.
We are a solution provider for existing and new challenges in the separation of wafers.
Founded in 2019 by 4 founders, our team of 25 people today combines extensive experience in the fields of laser technology, optics, electronics, software and mechanical engineering.
We have developed a completely new process to dice wafers. The special innovation is a combination of ultrashort laser pulses and a liquid flow.
In the LidroCUT® machine developed and built by us, a liquid flows over the surface of the wafer while the laser cuts out the components.
The liquid binds and washes away any particles, hence removing them. At the same time, the liquid cools the wafer and thus protects the components from thermal damage.
Overall, our process results in high-quality, precise cuts and particle-free components.
Our innovative laser process is free from mechanical stress and our liquid prevents thermal defects – hence, no cracks, microcracks or chipping nor any thermal defects, burr or delamination occur.
The rinsing property of the liquid leads to particle-free surfaces, clean cutting edges and clean cutting flanks – no smearing. We reach the highest precision and repeatability due to positioning and repositioning accuracy of ±1 µm.
In addition, the laser is material independent and enables free form cutting, offering maximum flexibility – grooving, drilling, full cut, rounded die corner and much more.
We are Literally Cutting Edge!