nepes
ISES Member
Company Profile
nepes Corporation, founded in 1990 and headquartered in Cheongju-si, South Korea, is a provider for semiconductor assembly & test, chemical products and energy solutions.
Product & Services
nepes provides turnkey solutions for various semiconductor packaging technologies, including flip-chip bumping, wafer-level packaging, and fan-out wafer and panel level packaging. nepes Corporation is specialized company of advanced semiconductor packaging and testing, particularly with its Fan-Out technology, such as FO-SiP, FO-EDP, FO-PoP and 2.5D.