27-28 August 2025
Suwon
Connecting the Future
“TSE’s 30 years is a history of innovation and challenge.”
Through relentless innovation and challenge, we have become a pioneer in Korea’s semiconductor test industry, and have grown into a visionary creator of cutting-edge technologies that surpass today’s limitations, leading the way to a positive future.
TSE’s 30-year heritage of innovation is built upon diverse customer experiences, proven capabilities, and outstanding performance. We have not simply followed technology; we have set new standards and became an industry leader.
We develop LC components using MEMS technology and provide i3unify, an only integrated interface solution for probe cards, interface boards, and test sockets – the three key test interconnection hardware components for high-performance semiconductor devices. TSE’s continuous innovation and challenge provide unique value that allows us to lead the future together with our customers.
[Probe Card]
Through cutting-edge probe card design and manufacturing technology, TSE provides innovative solutions capable of precisely inspecting the electrical operation of DRAM, NAND, and SoC chips. Our probe cards are equipped with technology that allows for highly accurate probing of all pads on a die fabricated on a wafer.
[Interface Board]
Memory and non-memory test interface boards are crucial interconnection hardware in semiconductor test systems, acting as a medium for transmitting electrical signals between the semiconductor under test (device) and the test equipment. They provide stable test solutions in various test environments to verify the performance of high-speed memory devices such as DDR, LPDDR, and GDDR, as well as non-memory devices like CPUs, GPUs, Chipsets, APs, and Microcontrollers.
[Test Socket]
A test socket is a device used to test the performance of semiconductor chips after the packaging process. As a test interconnection hardware used in the process of screening good and defective packaged products before shipment, it temporarily houses the packaged chip (Device Under Test, DUT) and establishes a mechanical contact, serving as a medium for electrical signal transmission between the DUT and the test equipment.