Winstek Semiconductor Technology Co., Ltd.
ISES Member
Company Profile
Winstek was founded in 2000, and became a subsidiary of Sigurd Group since 2017.
A professional OSAT to support advanced packaging turnkey service with more than 50k pcs/m of 300mm wafer plus 10k pcs/m 200mm bumping capacity, able to support turnkey service of WLCSP, flipchip package more than 120 set of high pin count ATE total solution of BLR, CLR test as well as FA service
Product & Services
1. Advanced wafer level packaging solution, compatible with advanced ( n3/n5 ) & mature wafer node products
2. high pin count/high speed ATE Wafer Probing and Final Test service
3. Advanced packaging solutions including FCBGA/FCCSP/WLCSP/MCM/SiP
3. Lab service for ORT ( on going reliability test ) and Failure Analysis, wafer level FIB