Yield Engineering Systems (YES)
ISES Member
Company Profile
YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company’s products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via and Cavity Etch and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit YES.tech.
Product & Services
Yield Engineering Systems, (YES), manufactures precision cleaning, coating, curing, and wet process equipment for innovative leaders in the life sciences, emerging technologies, and advanced semiconductor packaging.
YES-VertaCure XP G2 is a production-proven automated vacuum cure system, equipped with 5-zone uniform temperature control and laminar gas flow. This system provides excellent film performance, much higher throughput and lower CoO than atmospheric curing.
The semiconductor industry is ramping up the development of panel-level packaging (PLP). As Heterogeneous Integration becomes mainstream, PLP can also pave a path for larger size, multi-die, chiplet-based solutions for applications such as AI and HPC. YES offers tools to create Through Glass Vias for PLP.
YES’s Fluxless Formic Acid Reflow System, VeroTherm™ FAR offers:
Industry’s best reflow performance extendable to sub-55µm (down to 12µm) bump pitch, multi-substrate, die stacks
Low vacuum technology enables wicking-free reflow for high aspect ratio bumps across wafer and die locations
Designed to minimize formic acid usage per wafer