Hamid Azimi, Ph.D.

Senior Vice President, Advanced Packaging and Foundry

Formerly CVP of Intel

Dr. Hamid R. Azimi is Senior Vice President of Advanced Packaging and Foundry at Marvell. In this role, he leads the development and deployment of next-generation packaging technologies and foundry strategies to support Marvell’s data infrastructure products.

Prior to joining Marvell, Hamid spent nearly 30 years at Intel, where he most recently served as Corporate Vice President and Director of Substrate Packaging Technology Development. He led global R&D and manufacturing teams and delivered industry-leading innovations including die-embedded panel level fanout, EMIB and glass packaging for AI and high-performance computing.

A recognized pioneer in semiconductor packaging, Hamid holds over 40 U.S. patents, including the patent on first-generation organic flip-chip ABF-based substrate. He has received multiple Intel Achievement Awards and is widely known for building high-performing, inclusive teams and mentoring future industry leaders.

Hamid earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.

We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.

Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Marvin Liao, Ph.D.

Advisory Board Member

Education :

  • Ph.D., Materials Science, University of Texas, USA, 1989
  • Bachelor, Materials Science, Tsing Hua University, Taiwan, 1979

Experience :

  • TSMC, Advanced Packaging Technology and Service, 2011 ~ 2022
  • TSMC, Special Project, 2009 ~ 2010
  • TSMC, Fab 6 Director, 2003 ~ 2009
  • Chartered Semiconductor, 1997 ~ 2002 (Singapore)
  • Applied Materials, 1994 ~ 1997 (USA)
  • SGS Thomson Microelectronics, 1990 ~1994 (USA)

Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.

At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.

Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.

Markus Keil

Sr. VP FeoL Operations

VP Global Operations

Markus holds an advanced degree as Dipl. Ing. in Applied Physics from the FH Wiesbaden. He is serving for the last 30 years in different Operations and technology functions at various multinational Semiconductor Companies.
After 16 years at AMD / Globalfoundries and after that as the President and CEO of HSEB, he was responsible for the global operations footprint of a US-based Semiconductor iDM.
2021 he joined Optotune AG, a swiss SME specialist in optical Microsystems as the VP Global Operations / GM.
Markus has extended experience in high-volume Semiconductor Operations and technology development. He has served as Deputy Chairman of the International Semiconductor Executive Summits part of the ISIG Group for over a decade and as of 2025, EU Advisory Board President.

Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world’s largest manufacturers of discrete semiconductors (diodes, rectifiers, MOSFETs, optoelectronics, and selected ICs) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and “one-stop shop” service have made it a global industry leader.

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