Day 1 Afternoon Session Moderator
Yu-Hua Chen, Ph.D.
Unimicron Technology Corp
Education:
- Ph.D. Chemistry, 2001, National Taiwan University
Experience:
- 2012~2021, Vice President, Unimicron Technology Corp.
- Advanced substrate, panel level RDL and glass substrate Technology
- 2001~2012, Deputy R&D Director. ITRI/EOSL
- 3DIC, wafer level stacked & 8” and 12” CIS TSV package technology
- Chip embedded in rigid and flexible substrate technology
- Flexible LED lighting package technology
Unimicron Technology Corp
Company Profile
Founded in 1990, Unimicron is a world leading company of printed circuit board (PCB) and IC carrier (substrate) manufacturing. Major products include PCBs, high density interconnection (HDI) boards, flexible PCBs, rigid flex PCBs, and IC substrates. Product applications include AI, HPC data center infrastructure (server, networking), smartphones, PC/NB, optical modules, automotive and more. Unimicron’s global footprint encompass manufacturing sites and/or service centers in Taiwan, China, Germany, Japan and Thailand, delivering high value-added, high quality and high productivity innovation and services to our global customers.
Company Products & Services
Unimicron’s high-end substrate solutions, FCBGA and FCCSP, provide our valued customers the technologies crucial in meeting today’s fast-growing development of AI, HPC applications. Our customer-oriented service, high quality standards, and innovative breakthroughs have helped Unimicron achieve the honor of No.1 ranking among the global substrate suppliers by market share for the 9th consecutive year since Y2016.
