スピーカー

Kinya Ichikawa

Technical Director

2日目 – 12月3日 / 09:40 - 10:00

パネルディスカッション：Advanced Packaging

2日目 – 12月3日 / 11:35 - 12:15

 

 

3DIC Research Lab LLC is a specialized consulting firm dedicated to advancing semiconductor packaging technologies with a focus on 3D integration. Founded by experts with decades of experience in wafer-level packaging, TSV, hybrid bonding, and advanced substrate technologies, the company provides deep technical insights and strategic guidance to semiconductor manufacturers, material suppliers, and equipment vendors. 3DIC Research Lab operates as a bridge between cutting-edge academic research and industrial applications, helping partners accelerate innovation, reduce risks, and optimize manufacturing processes. With strong expertise in areas such as HBM integration, fan-out packaging, and chiplet-based architectures, the company supports its clients in addressing key challenges in power, performance, thermal management, and reliability. By combining technical consulting with market perspectives, 3DIC Research Lab contributes to the realization of next-generation semiconductor solutions for AI, HPC, and consumer electronics.

3DIC Research Lab LLC offers a comprehensive range of consulting services tailored to the semiconductor packaging ecosystem. Its core services include technology evaluation, material selection support, process integration strategies, and roadmap development for advanced packaging solutions. The company provides in-depth technical analysis on critical areas such as wafer thinning, TSV formation, RDL scaling, underfill materials, and thermal interface solutions. Additionally, 3DIC Research Lab delivers customized training programs, workshops, and technical seminars to support knowledge transfer and skill development within client organizations. By leveraging a strong global network and hands-on expertise, the firm helps clients benchmark emerging technologies, assess competitive landscapes, and establish collaborations across the supply chain. Whether guiding material suppliers to meet stringent reliability requirements or advising device makers on cost-performance trade-offs, 3DIC Research Lab ensures that its partners are equipped to navigate the complexities of heterogeneous integration and advanced packaging.

スピーカー

Gaurang Shah

Vice President, Power Product Group

2日目 – 12月3日 / 15:55 - 16:15

Gaurang Shah, Renesas’ Vice President of Power Product Group, comes to the company with over 30 years of experience in operational and technology management at Infineon, Fairchild, Texas Instruments, and Maxim. Most recently, he was the Chief Product Officer at GaN Systems which was acquired by Infineon Technologies. Before that, he co-founded and was CEO of Nebula Microsystems, which focused on delivering high-performance Power products for a broad range of markets.

Gaurang was a C-Suite leader at Fairchild Semiconductor where he was responsible for all of Power IC products, growing the business by over 50% during his tenure. Before that, he had a successful career at Texas Instruments where he led the Battery Management business on a path to $1B, incubated GaN that led to the foundation for the Wide-Bandgap High Voltage Power business. Additionally, he has worked in various design management roles at Maxim Integrated, Cypress, and Sun Microsystems. Gaurang received his BSEE from Michigan Technological University and his MSEE degree in electrical engineering from Cornell University.

Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.

A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.

スピーカー

Yasushi Araki

Corporate Officer Research & Development Division

2日目 – 12月3日 / 09:20 - 09:40

Graduated from Applied Chemistry, Nagoya University in 1989.
1989-2000: Joined Fujitsu Ltd. Engaged in IC assembly technology.
2000-2021: Joined Shinko Electric Industries Co., Ltd. Engaged in IC Assembly technology.
From 2021: Engaged in Research and Development in the R&D Div.

SHINKO is a worldwide semiconductor packaging supplier with diverse technology driven initiatives and industry leading manufacturing capabilities.

スピーカー

Lam Research ラムリサーチ合同会社

Session info not yet published

Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com

We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.

スピーカー

Tomoshige Nambu

Director for IT Industry Division

開会の挨拶

1日目 – 12月2日 / 09:00 - 09:20

Mr. Tomoshige NAMBU has served as the Director for IT Industry Division at the Ministry of Economy, Trade, and Industry (METI) in Japan since July 2025. He leads METI’s AI and semiconductor strategy.

Prior to his current position, he spent 3.5 years in NYC and Washington D.C. from December 2021 to June 2025, serving as Special Advisor for METI at the New York Office of the Japan External Trade Organization (JETRO). He was a senior METI representative in the US, covering trade and economic security policies.

During a more than 20-year career at METI, Mr. Nambu has held responsibilities across a diverse range of public policy areas. He was involved in the formulation of Japan’s economic policy in 2018-2021 as the Director for Macroeconomic Policy at METI. He also assumed the duty of Cabinet Counselor, drafting policy proposals on economic growth strategy under the direction of the Prime Minister’s office.

He was stationed in Washington D.C. as the Trade Attaché at the Embassy of Japan in the U.S. from 2012 to 2015 and worked on several bilateral trade issues such as TPP and energy exports from the U.S.

He joined METI in 2002 after receiving a Bachelor of Law from the University of Tokyo. He also holds an L.L.M from Harvard Law School. He served as the Asia Program Fellow at the Rajawali Foundation Institute for Asia in Harvard Kennedy School in 2009-2010. He currently lives in Tokyo with his wife.

METI has been transforming itself to respond to the needs of the times.
METI has a history of responding to the changing needs of society. Therefore, its history is the history of Japan’s progress.

In 1949, the Ministry of Commerce and Industry was reorganized and the Ministry of International Trade and Industry was established. Its internal subdivisions consisted of eight bureaus: Minister’s Secretariat, Trade Bureau, Trade Promotion Bureau, Enterprise Trade Bureau, Textile Trade Bureau, General Merchandise Trade Bureau, Machinery Trade Bureau, Chemical Trade Bureau, and Iron and Steel Trade Bureau.
In addition, four agencies, the Resources Agency, Small and Medium Enterprise Agency, Industrial Technology Agency, and Patent Office; eight regional trade and industry bureaus; and four regional coal bureaus were established as external subdivisions.

スピーカー

Holger H. Kuehnlein, P.h.D.

Senior Vice President, Technology & Innovation

2日目 – 12月3日 / 11:10 - 11:20

Holger H. Kuehnlein’s scientific career began in 1999 at the Technical University of Dresden, a key institution within the Silicon Saxony high-tech cluster. His early industrial experience at KSW MicroTec GmbH involved Electrochemical Deposition (ECD) for flip-chip bumps and packaging. His university research until 2004 focused on enhancing mass transfer and metal deposition in microstructures using pulse plating and magnetic fields.

His PhD. at ATOTECH Germany GmbH Berlin, on electrodeposited Cu2ZnSn for CZTS compound semiconductors, led him to RENA Technologies in 2007. He was instrumental in RENA’s success story in PV, driving advancements in wet chemical cleaning, etching, and plating for PERC, TOPCON, and IBC cell technologies. Since 2015, as head of Technology & Innovation at RENA, he’s significantly contributed to the SEMI industry. While specializing in wet chemical processes, he diversified RENA into mobile device glass components, semiconductor wafering, and plating. His development efforts since then have also encompassed new wet chemical processes for Lithium-ion batteries.

His current work is particularly focused on wet chemical Through-Glass Via (TGV) etching and metallization of Glass Core Panel Substrates for advanced packaging in high-performance computing and AI applications, involving close collaboration with key players in glass, material and packaging industries. His team also leverages electrochemical methods for polishing, porosification, and deposition for critical materials like Silicon Carbide (SiC) and Silicon (Si) in areas like epitaxial-wafering, with recent investigations extending to Gallium Nitride (GaN) and Gallium Oxide (GaO) for next generation power applications.

Founded in 1993, RENA Technologies has established itself as a global leader in mechanical and process engineering, for a diverse range of industries. We specialize in providing cutting-edge wet processing solutions for the semiconductor, solar, additive manufacturing, glass, and medtech industries.
A key area of expertise is wet chemical immersion, spray and single wafer processes for the manufacturing of semiconductors. With over 1,100 systems installed worldwide, our technology is trusted by manufacturers around the globe to enhance efficiency and production quality.
RENA Technologies employs approximately 1,000 professionals worldwide, all dedicated to innovation and excellence in our field. Headquartered in Gütenbach, Germany, and manufacturing sites in Albany, OR and Wykroty, Poland, we continue to drive advancements in process engineering, ensuring our customers receive the highest quality solutions for their manufacturing needs.
On top we provide worldwide onsite service support with over 150 Experts in 20 locations globally to ensure flawless installation and operation of our tools.

RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes like etching, stripping, cleaning or drying. RENA offers proven standard machines as well as customer-specific solutions and process support.

スピーカー

Kazuoki Matsugatani, P.h.D.

Senior Director, R&D Center

2日目 – 12月3日 / 14:15 - 14:35

Dr. Kazuoki Matsugatani joined DENSO CORPORATION in 1989, and has over 25 years of R&D experience in electronics, including compound semiconductors, microwave and millimeter-wave circuits, wireless communication systems, and ADAS. He has held key leadership roles such as Director of R&D Division 3, Director of ADAS Business and Technology Development. In 2017, he became Executive Director and Head of Engineering in Europe, and in 2019, Executive Officer and Head of Engineering in North America. After returning to Japan, he was appointed Senior Director at DENSO CORPORATION in 2021, and joined MIRISE Technologies as a Member of the Board in 2022.

DENSO is a €44.1 billion ($47.9 billion) global mobility supplier that develops advanced technology and components for nearly every vehicle make and model on the road today. With manufacturing at its core, DENSO invests in its around 200 facilities to produce electrification, powertrain, thermal, mobility electronics, advanced devices to create jobs that directly change how the world moves. The company’s around 158,000 employees are paving the way to a mobility future that improves lives, eliminates traffic accidents, and preserves the environment. Globally headquartered in Kariya, Japan, DENSO spent nearly 10 percent of its global consolidated sales on research and development in the fiscal year ending March 31, 2025.

In Europe, DENSO regional headquarters is located in Amsterdam, the Netherlands. DENSO has 36 official group companies located in 15 European countries and employs more than 13,000 people across its European organization. DENSO Europe’s consolidated revenue was €3.9 billion ($4.3 billion) for the fiscal year ending March 31, 2025.

スピーカー

村田大介　氏

代表取締役社長

Exploring the Present and Future of AMHS in Semiconductor Fabs

2日目 – 12月3日 / 13:55 - 14:15

Automated transportation in semiconductor fabs began with front-end processes in 1980s. It has grown in scale and expanded to advanced back-end operations. Recently we are also receiving requests to handle materials and tools. Beyond wafer transportation, by “Full Fab Automation”, where we fully automate the movement of goods throughout the entire factory, we aim to contribute to the ever-growing semiconductor industry.

Daisuke Murata has served as President and CEO of Murata Machinery, since September 2003. He has held a variety of ascending leadership positions at Murata Machinery since 1987.

He also now serves as Chairman of the Japan Textile Machinery Association, as Chairman of the Japan Institute of Material Handling, and Superintendent of the Japan Business Machine and Information System Industries Association. In July 2017, he became the SEMI International Board member.

He graduated with a Bachelor of Economics from Hitotsubashi University in 1984 and obtained MBA from the Graduate School of Business at Stanford University in 1990.

Murata Machinery (Muratec) is a worldwide leader and solution provider for automated material handling systems in semiconductor manufacturing and other manufacturing or distribution industries. Muratec also manufactures machinery and equipment such as Textile Machinery, Machine Tools, Sheet Metal Machinery, and Communication Equipment.
This year marks 90 years since its founding in 1935. Under the slogan “Innovation. Mark the turning point”, Muratec aims to create technologies that bring innovation to the market and society.

・Logistics & Automation Division
Logistics Center, Automated Storage & Retrieval Systems (AS/RS), Transportation Systems, Picking Systems, Sorting Systems, Data Management system
・Clean FA Division
Transport Systems & Storage Systems For Semiconductor fab.
・Machine Tools Division
CNC Twin-spindle Chucker, CNC Twin-spindle Turning Center, CNC Opposed Twin-spindle, FMC and FMS
CNC Turret Punch Press, CNC laser punch press,
Press Brake, Automatic CAD/CAM system for sheet metal working, FMC and FMS
・Textile Machinery Division
VORTEX Spinning Machines, Automatic Winders
・Communication Equipment Division
Digital Multifunctional Product, Laser Xerographic Printer Facsimile, LED Linear Array Optical Facsimile, Thermal Transfer Facsimile,
Document & IP Solutions

スピーカー

古屋 明彦 氏

執行役員　 エレクトロニクス事業本部 半導体事業部長

1日目 – 12月2日 / 16:40 - 16:50

Graduated From Nagasaki University Master’s Degree

(Appointed Dates)
April 1993 　       Joined Toppan Printing Co.,Ltd., Electronics Division
April 1996 　       TOPPAN Kumamoto Technical Research Institute.
April 2002 　       TOPPAN (Corporate) Technical Research Institute
April 2010 　       General Manager, FC-BGA Engineering Department, Toyama Plant
April 2014 　       General Manager, FC-BGA Engineering Department, Niigata Plant
April 2018 　       Head of Technical Development Headquarters Ⅱ, Electronics Division
April 2022 　      Head of Semiconductor Business, Electronics Division
April 2023 　      Executive Officer, Head of Semiconductor Business, Electronics Division
October 2023      TOPPAN Inc. Executive Officer, Head of Semiconductor Business, Electronics Division
April 2025　      TOPPAN Inc. Executive Officer, Head of Semiconductor Subdivision, Electronics Division

TOPPAN Inc. has grown beyond its traditional printing business and now offers a broad range of products and services with printing technologies at their core in the Information & Communication, Living & Industry, and Electronics segments.

Turning printing technologies into leading edge electronics products
Semiconductor-Related(FC-BGA Substrates, Color Filter Arrays, Etched Products, Photomasks/Nanoimprint Molds, LSI Design/LSI Turnkey Service)
Display-Related(Color Filters, TFT LCDs, Surface Treatment Films, Light Control Film)

スピーカー

小倉　崇浩　氏

President of AI Computing Division

1日目 – 12月2日 / 14:30 - 14:50

Takahiro Ogura is a seasoned leader in high-performance computing with over 20 years of experience. He currently heads the AI Computing Division at Preferred Networks (PFN), overseeing the company’s critical computing infrastructure technologies including the MN-Core™ series of AI semiconductors and in-house supercomputers. Prior to joining PFN, he served as the after-sales service manager for domestic high-performance computing clients at Fujitsu, where he began his career as a systems engineer working on supercomputer systems projects. A notable career highlight was his instrumental role in the design and development of the Fugaku (Post-K) supercomputer at Japan’s national research and development agency RIKEN. Ogura received a Master’s degree from Tsukuba University’s Systems and Engineering program in 2005.

Preferred Networks (PFN) is a leading Japanese AI technology company known for its vertically integrated development of cutting-edge technologies—from custom AI chips, generative AI foundation models to real-world AI solutions and products. PFN plays a key role in advancing Japan’s AI sovereignty and has earned a strong domestic reputation. PFN’s AI solutions span across diverse industries including manufacturing, materials, energy, pharmaceuticals, healthcare, finance, retail, and entertainment. The company is currently developing a novel AI inference chip, leveraging its highly energy-efficient MN-Core™ logic and a new memory technology, with a release targeted for early 2027.

Preferred Networks (PFN) develops cutting-edge technologies across the AI value chain from semiconductors, supercomputers, generative AI foundation models to AI solutions and products:
MN-Core™ — a series of highly energy-efficient AI chips, which made a debut topping the Green500 list of the world’s most energy-efficient supercomputers three times in 2020/21. PFN is currently developing a new line of MN-Core chips focused on AI inference, set for release in early 2027.
Preferred Computing Platform™ (PFCP™︎) — a cloud-based service that provides users with access to the computing power of MN-Core 2. PFN has also announced a joint venture with Mitsubishi Corporation and IIJ aiming to launch an MN-Core™-based IaaS commercial service in 2026.
PLaMo™ — a series of Large Language Models developed fully from scratch by PFN, delivering top-tier performance in Japanese-language capabilities. These models power a wide range of AI applications in sectors such as finance, healthcare, and the public sector.
Matlantis™ — a cloud-based, high-speed universal atomistic simulator. Powered by a machine learning interatomic potential (MLIP), Matlantis significantly accelerates the simulation workflow in new materials discovery across industries such as semiconductor, automotive, and energy, by bypassing traditional heavy electronic state calculations.

基調講演

清水 照士 氏

Director and Chairman

Imaging & sensing technologies to create emotion

1日目 – 12月2日 / 09:20 - 09:40

Will introduce the latest initiatives of process and device technologies that enhance Sony’s image sensors to create “Emotion.”

In April 1980, he joined Sony Corporation (renamed Sony Group Corporation in April 2021), where he served as an engineer in the semiconductor business.
From 1991, he moved to the U.S. to be engaged in planning and control of semiconductor business at Sony Electronics’ Fab.
After returning to Japan, from 1999, he was assigned to Sony Computer Entertainment Inc. as the General Manager of the planning and control department, where he was responsible for the start-up of semiconductors for PlayStation.
In 2016, he was appointed Representative Director and President of Sony Semiconductor Solutions Corporation.
From 2020 to March 31, 2025, he was Representative Director, President and CEO of the company.
From 2021 to March 31, 2025, he was Senior EVP, Officer in charge of Imaging & Sensing Solutions Business, Sony Group Corporation.
He was appointed to Director and Chairman of Sony Semiconductor Solutions Corporation as of April 1, 2025.

Sony Semiconductor Solutions Corporation is a wholly owned subsidiary of Sony Group Corporation and the global leader in image sensors. We strive to provide advanced imaging technologies that bring greater convenience and joy to people’s lives. In addition, we also work to develop and bring to market new kinds of sensing technologies with the aim of offering various solutions that will take the visual and recognition capabilities of both human and machines to greater heights.

基調講演

森本 典繁 氏

Vice President and Chief Technology Officer

1日目 – 12月2日 / 09:40 - 10:00

Norishige Morimoto is Vice President and CTO of IBM Japan, and a Board Member since 2024. He joined IBM in 1987 as a hardware engineer and earned his Master’s in EE&CS from MIT in 1995. He has held global leadership roles including Director of IBM Research-Tokyo, CTO of IBM Asia Pacific, and VP of R&D Japan. He formerly chaired the Information Processing Society of Japan and served on boards of Temple University Japan and SMBC Group. He advises METI’s semiconductor strategy panel and is a member of JAOTEX, promoting innovation and leadership in Japan’s tech ecosystem.

IBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. IBM’s breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients.

Visit www.ibm.com for more information.

基調講演

岩坪 浩 氏

CTO and Executive Deputy President

Power Challenges for Next-Generation Vehicles and Murata’s Pursuit of Technological Innovation

2日目 – 12月3日 / 13:35 - 13:55

Vehicle architecture is undergoing rapid transformation driven by autonomous driving, IoT integration, AI implementation, and the shift toward Software-Defined Vehicles (SDVs). The overall power consumption of vehicles is increasing due to the rise in electronic control units and the adoption of high-performance processors. While low-power design, wide bandgap semiconductors, and thermal management technologies are being developed, efforts are also underway to develop in-motion charging and transition to 48V architectures.

Requirements for electronic devices in new architectures and Murata’s initiatives will be reported.

1985.Mar Hiroshi Iwatsubo graduated from Kyoto University, Department of Technology. He joined Murata Manufacturing Co., Ltd. in Kyoto, Japan in 1985. After engaging in the development of ceramic materials for four years, he was transferred to Murata Europe GmbH in 1989 until his return to Murata Japan in 1993.

In 2012, he was appointed to Vice President, Head of Global Sales & Marketing

In 2015, he was appointed to Senior Executive Vice President (Board Member) Corporate Technology & Business Development Unit, In 2020, Senior Executive Vice President .

Since 2024, Hiroshi Iwatsubo currently serves as CTO and Executive Deputy President.

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata’s website at www.murata.com.

www.murata.com/en-global

Research, Production and Sales of Electronic Devices made from fine ceramics

Panel Moderator

ｻﾗ・ﾅｽﾘ

CEO and Co-Founder

歓迎スピーチ

1日目 – 12月2日 / 08:40 - 09:00

Panel Discussion: Workforce of the Future: Building, Training, and Inspiring Semiconductor Talent for Long-Term Competitiveness for Japan

2日目 – 12月3日 / 16:25 - 16:55

Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.

Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.

At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.

Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.

スピーカー

須原忠浩

CEO

歓迎スピーチ

1日目 – 12月2日 / 08:40 - 09:00

閉会の挨拶

2日目 – 12月3日 / 16:55 - 17:00

Education:

・Bachelor, Economics, Doshisha University, Japan, 1983

Experience:

・TSSC, CEO, 2023/5～

・JSR Corporation, Managing Officer, 2019～2023

・Screen Semiconductor Solutions , CEO, 2014～2019

・Dainippon Screen Manufacturing , 1983～2014

TSSC is a consulting company to support Semiconductor and Semiconductor Supply Chain for enabling continuous Semiconductor industry’s growth.

Panelist

Tetsuo Endoh, Ph.D.

Director/Professor

Panel Discussion: Workforce of the Future: Building, Training, and Inspiring Semiconductor Talent for Long-Term Competitiveness for Japan

2日目 – 12月3日 / 16:25 - 16:55

Tetsuo Endoh joined ULSI Research Center Toshiba Co. in 1987 and was engaged in the R&D of NAND Memory. He became a lecturer at the Research Institute of Electrical Communication, Tohoku University in 1995. He is a professor at the Department of Electrical Engineering, the Graduate School of Engineering, Tohoku University and director of the Center for Innovative Integrated Electronic Systems (CIES). His current interests are novel 3D structured device technology, such as Vertical MOSFETs; high-density memory, such as SRAM, DRAM, 3D-NAND memory and STT-MRAM; and beyond-CMOS technology, such as spintronics-based non-volatile Logic for ultralow power systems such as mobile systems, AI systems and IoT systems. He is also interested in power-management technology, such as GaN on Si based power devices and power integrated circuits with low energy loss and low power consumption for automotive applications. He received the 14th Prime Minister’s Award for his Contribution to Industry-Academia-Government Collaboration in 2016.

He received 2017 National Invention Award “the 21st century Encouragement of Invention Prize” on June 12th for his contribution of the invent of 3D-NAND Memory technology. He received a 2020 VLSI Test of Time Award, VLSI Symposium, 2021. He was a Fellow of the IEEE from 2023.

The Center for Innovative Integrated Electronic Systems (CIES) has conducted the CIES consortium consisting of industry-academia joint researches, major national projects, and regional collaboration projects from fields such as materials, equipment, devices, circuits and systems through the cooperation of domestic and foreign companies with support of local government. CIES has expanded its R&D field from spintronics to AI hardware and power electronics, and has promoted to develop core technologies related to integrated electronics. To date, the center has developed various innovative technologies with highest performance in the world, has made progress in developing IoT and AI systems that require ultra-low power consumption. In addition, with the establishment of the startup “Power Spin Inc.” from Tohoku University, we are accelerating the development of the innovative technologies that we are developing into social implementation and the further advancement of industry-academia collaboration. In June 2021, Tohoku University established the Tohoku University Semiconductor Technology Co-creation to contribute to Japan’s semiconductor strategy and the world’s energy-saving society. In addition to this co-creation, CIES is positioned as a spintronics low power logic semiconductor development base in Japan’s semiconductor strategy, and is further strengthening efforts for promotion of industry-academia-government co-creation and social implementation. We will continue to create innovative core technologies and contribute to the industry and the enhancement of global competitiveness by the practical applications, and “new creation and innovation” through global and regional partnership.

スピーカー

Lode Lauwers

Senior Vice President Business Development and Strategy

1日目 – 12月2日 / 13:30 - 13:50

Lode Lauwers is Senior Vice President Business Development and Strategy in IMEC, the nanoelectronics R&D Center in Leuven, Belgium. His current focus is to architect new global R&D collaborations and related business models, in line with semiconductor technology initiatives in various continents currently in conception. In that role he also guides imec’s Corporate Business Development strategies in nanoelectronics. Since he joined IMEC in 2005, he had various leading roles in IMEC’s technology business development and partner relation management. He has been driving over 2 decades the build-out, growth and business foundations of imec’s flagship core program with leading IC manufacturers, foundries, equipment and material suppliers and design and system houses. Earlier, he has been general manager of an ASIC design house, part of a US-based ASSP provider for the telecom industry, and scientific advisor for government funding in local and European cooperative networks in micro-electronics and telecommunications. He has a PhD in Electrical Engineering from KU Leuven.

Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2021, imec’s revenue (P&L) totaled 732 million euro.

Further information on imec can be found at www.imec-int.com.

基調講演

Kazunari Ishimaru, Ph.D.

Senior Managing Executive Officer & CTO, IEEE Fellow

1日目 – 12月2日 / 11:30 - 11:50

Dr. Kazunari Ishimaru, IEEE Fellow, is CTO and Senior Managing Executive Officer at Rapidus - ラピダス株式会社 技術本部長 折井靖光 氏 Corporation. He began his career at Toshiba in 1988, contributing to SRAM and logic development. As VP of R&D at Toshiba America Electronic Components, he led 32nm–20nm CMOS projects with IBM. Returning to Japan, he oversaw logic manufacturing at Toshiba Oita and emerging memory R&D at Kioxia Yokkaichi, later becoming Director of the Institute of Memory Technology R&D. He joined Rapidus - ラピダス株式会社 技術本部長 折井靖光 氏 in 2023 and became CTO in 2025, driving Japan’s advanced semiconductor initiatives, including 2nm logic and the RUMS model for integrated manufacturing innovation.

Rapidus will contribute to the fulfillment, prosperity, and well-being of people’s lives through semiconductors. We promote fab management with world-class R&D and manufacturing capabilities, collaborate with universities and research institutions to foster talents vital for semiconductor field, and further innovate toward a truly green society. Based on this corporate philosophy, we will establish new business schemes in cooperation with companies　worldwide, develop and provide the world’s best cycle time reduction services, and promote creation of new industries together with our customers.

スピーカー

南川 明 氏

シニア アナリスト

1日目 – 12月2日 / 17:10 - 17:30

南川 明 氏
Born on 6 Dec, 1958
Informa Intelligence LLC
Senior Consulting Director

From Aug ,2019. Senior Consulting Director, Informa Intelligence LLC, UK
Nov, 2010. Consulting Director, IHS Global Inc. U.S.A

Jul, 2004. President and CEO of Data Garage Inc.

From Apr, 2003 to Feb 2004, Technology Head & Senior Analyst, Research Department, Credit Lyonnais Securities Co., Ltd.

From Jun, 2000 to Apr 2003, Director & Senior Analyst, Research Dep,
WestLB Securities Company

From Jan 1996 to May 2005, Director, IDC Japan, Inc.

From Mat 1990, to Dec 2005, Senior Analyst, Dataquest Semiconductor Industry Analysis Department, Gartner Japan, Inc.

From Apr 1982, to May 1990, HongKong Motorola Marketing specialist, Motorola Inc.

He has served as a core analyst for the Global Electronics and Semiconductor Mid- to Long-Term Outlook Committee at JEITA for 20 years. We have strengthened our research and consulting activities in Asia, including regularly delivering presentations at semiconductor symposiums hosted by Taiwan. He is a member of the Japan Patent Office’s technical review committee for automotive patents and semiconductor-related patent review committee. Member of the Research Evaluation Committee for NEDO’s “Development of FeRAM Manufacturing Technology” project. He is also an evaluation committee member for the “Post-5G Information and Communications System Infrastructure Strengthening Research and Development Project” and the “Technology Development Project for Strengthening the Manufacturing Infrastructure for Energy-Saving Electronics.” He is also an advisor to the Tokyo Institute of Technology’s Open Innovation Organization.

Lecture activities & writing activities
He regularly lectures at seminars hosted by JEITA, Electronic Devices News, SEMI Japan, NEDIA, SEAJ, and others. He also actively engages in public relations activities, including writing articles for media outlets and appearing on TV.

Omdia is a leading research and advisory group focused on the technology industry. With clients operating in over 120 countries, Omdia provides market-critical data, analysis, advice, and custom consulting. Information Classification: General Omdia was formed in 2020 following the merger of IHS Markit, Tractica, Ovum and Heavy Reading. Sitting at the heart of the Informa Tech portfolio, Omdia reaches over four million technology decision makers, influencers and practitioners that form part of the wider Informa Tech community and has specialist research practices focusing on Enterprise IT, AI, Internet of Things, Communications Service Providers, Cybersecurity, Components & Devices, Media & Entertainment and Government & Manufacturing.

Panelist

Nahomi Aoto, Ph.D.

Professor by Special Designation

Panel Discussion: Workforce of the Future: Building, Training, and Inspiring Semiconductor Talent for Long-Term Competitiveness for Japan

2日目 – 12月3日 / 16:25 - 16:55

Dr. Nahomi Aoto is working at Hiroshima University as Professor by Special Designation and at Tohoku University as Visiting Professor by Special Designation, from August 2023 after she retired from Micron. She specializes in workforce advancement of university students and younger students, especially women, to attract them to semiconductor technology areas. Before university Dr. Aoto had served semiconductor industry from 1983 to 2023 and contributed to process R&D. She worked for NEC, Elpida Memory, Micron Memory Japan and Micron Technology as a researcher/engineer, manager, Sr. director and officer. In 2019 – 2023, Dr. Aoto focused on building good relationships between students/university and semiconductor industry by giving lectures and speeches, and inspired students to work for semiconductor technology and industry. She had also led women leadership program of Micron until her retirement. Dr. Aoto was chosen as one of four final nominees of 2020 Rising Women of Influence Award of Global Semiconductor Alliance (GSA).

基調講演

ラーフル・マネパリ博士

Intel Fellow, VP, Director of Substrate Packaging Technology Development

2日目 – 12月3日 / 09:00 - 09:20

Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and other substrate technologies. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.

 

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

基調講演

ディーパク・クルカルニ

シニア・フェロー アドバンスド・パッケージング

1日目 – 12月2日 / 11:10 - 11:30

Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

スピーカー

Nelson Fan

APT Business Lead,VP of Business Development APT ASMPT

1日目 – 12月2日 / 16:20 - 16:30

ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

Panelist

Monita Pau, Ph.D.

Strategic Marketing Director, Advanced Packaging

パネルディスカッション：Advanced Packaging

2日目 – 12月3日 / 11:35 - 12:15

 

 

Monita Pau is currently Strategic Marketing Director for Advanced Packaging at Onto Innovation. She works with business leaders and executives to drive strategic planning and leads the development of collaborative initiatives to drive growth and innovation. With over 15 years of experience, her expertise spans across frontend and backend of line process control solutions as well as specialty materials for advanced packaging and assembly. Prior to joining Onto, she held various positions in applications engineering, marketing and strategic business development at DuPont and KLA. Monita holds a Ph.D. degree in Chemistry from Stanford University.

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.

General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com

スピーカー

Maksym Plakhotnyuk, Ph.D.

CEO & Founder

2日目 – 12月3日 / 11:20 - 11:30

Maksym Plakhotnyuk is the CEO and founder of ATLANT 3D, a pioneering deep-tech company at the forefront of innovation, developing the world’s most advanced atomic-scale manufacturing platform. Maksym is the inventor of the first-ever atomic layer advanced manufacturing technology, enabling atomic-precision development of materials, devices, and microsystems. A scientist with a Ph.D. in Nanotechnology and Photovoltaics, he has deep expertise in nanotechnologies, renewable and exponential technologies, semiconductor processing, photovoltaics, solid-state physics, and material science. A Fulbright scholar, Hello Tomorrow Grand Winner, and proud Ukrainian, Maksym has earned global recognition for his work. With 15+ years of experience and numerous patents, he leads ATLANT 3D’s mission to redefine nanofabrication.

ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.

While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.

Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.

ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.

Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.

From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.

スピーカー

Christophe Maleville, Ph.D.

Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation

2日目 – 12月3日 / 14:35 - 14:45

Christophe Maleville has been appointed Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation.

He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer from R&D to production, and managed customer certifications. He also served as vice president, SOI Products Platform at Soitec, working closely with key customers worldwide.

Maleville has authored or co-authored more than 30 papers and also holds some 30 patents. He has a PhD in microelectronics from Grenoble Institute of Technology and obtained an executive MBA from INSEAD.

Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.

In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.

With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.

Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.

For more information visit: www.soitec.com.

スピーカー

Hidenori Abe

Executive director, Electronics Business Headquarters and CTO for semiconductor materials

1日目 – 12月2日 / 16:00 - 16:20

Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.

Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.

We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.

スピーカー

Dimitrios Damianos Ph.D.

Senior Manager for Consulting Services

1日目 – 12月2日 / 16:50 - 17:10

Dimitrios Damianos is a Senior Manager for Consulting Services at Yole Group.

With over 10 years of experience in the fields of nanotechnology, semiconductors, market research and strategy consulting, Dimitrios provides strategic insights and tailored solutions/consulting projects to clients across the whole semiconductor value chain and emerging technologies.

He has successfully managed and authored multiple off-the-shelf market reports, as well as custom projects, including market analysis, competitive intelligence, marketing/go-to-market studies, technology assessments, strategy, Due Diligence and tech M&A for clients ranging from startups and R&D institutes to Fortune 500 companies and governments.

Dimitrios is responsible for commercial relationships with clients, managing internal and external resources, ensuring timely and efficient execution, and delivering comprehensive and actionable reports, as well as presentations for clients or at international conferences & exhibitions.

Dimitrios holds a BSc in Physics and MSc in Photonics, as well as a PhD in optics & microelectronics.

Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.

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