Actions Technology Co., Ltd.

Actions focuses on designing high volume integrated chips for mass market wireless audio, intelligent wear, intelligent interaction and intelligent Internet of things applications.

End to End Fabless Designer of Intelligent Audio SoC chips. Including IC Development, Marketing, and Sales.

Actions Technology produces SoCs which power Bluetooth audio, portable multimedia, and intelligent voice interaction applications.

Actions Technology devotes its resources to developing SoCs for low power wireless communication, multimedia processing and other IoT technology. Over the years Actions’ has developed a portfolio of IP involving Bluetooth communication, ADC/DAC, power consumption management, high-speed analog interface, and audio processing. Customers can leverage Actions’ IP with complete hardware and firmware engineering tools to accelerate the development of end products using Actions IC chips.

专注于中高端智能音频 SoC 的研发、设计及销售


承继与发扬近20年的研发沉淀和经验,炬芯科技擅长在低功耗的前提下提供高音质及低延迟的无线音频体验。公司深耕以高性能音频ADC/DAC、语音前处理、音频编解码、音频后处理为核心的高音质音频全信号链技术;以及以蓝牙射频、基带和协议栈技术为核心的低延迟无线连接技术。专精将射频通信、电源管理、模数混合音频、CPU、DSP 以及存储单元等模块高集成于一颗单芯片 SoC 上。公司积累了较完备、较先进的自主知识产权,通过融合软件开发包和核心算法提升 SoC 的价值,帮助客户降低基于芯片开发量产的门槛,让终端产品可以快速推向市场。

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Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)

YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.

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Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.

ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.

Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.

Fore more information, please visit and

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Ayar Labs

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a 1000x improvement in interconnect bandwidth density at 10x lower power. Ayar Labs’ patented approach uses industry standard cost-effective silicon processing techniques to develop high speed, high density, low power optical based interconnect “chiplets” and lasers to replace traditional electrical based I/O. The company was founded in 2015 and is funded by a number of domestic and international venture capital firms as well as strategic investors. For more information, visit

Address: 3351 Olcott Street, Santa Clara, CA 95054
Phone: 650-963-7200

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Be a leading automotive qualified open foundry in the Wide Band Gap ecosystem.

Enabling our customers to develop and manufacture unique solutions for a sustainable electrified future.

Creating value through our employees’ enthusiasm, talents and commitment.

BelGaN, as a WBG foundry in Europe, enables and services a rapidly expanding GaN-ecosystem in Europe (‘GaN-Valley’) and beyond with innovative and high-quality WBG semiconductor technologies and a highly efficient value-add 6 and 8 inch manufacturing facility. BelGaN adds unique services such as customer-driven Technology-as-a-Service (customized processes), Manufacturing-as-a-Service, and Quality-as-a-Service to the traditional foundry business model whereas we cooperate with suppliers and customers to deliver automotive quality products to the market. BelGaN develops and bring-to-market a rich roadmap of GaN & SiC platforms, driven by our customers’ needs and our core strengths and vision. We partner with leading universities and RTO’s in an Open Innovation model to prepare our innovation roadmap and bring differentiating innovations to our customers.

Manufacturing Facility: Wafer fab with over 4500 m2 of clean room space, located on a 44.000 m2campus.

Fab: 6 & 8 inch (planned).

Production: GaN Technologies & 0.35 µm to 2 µm Low, Medium, and High Voltage Analog CMOS and BCD Technologies.

Westerring 15
9700 Oudenaarde

+32 55 332211

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Bosch Sensortec

Bosch Sensortec GmbH, a fully owned subsidiary of Robert Bosch GmbH, develops and markets a wide portfolio of microelectromechanical systems (MEMS) sensors and solutions tailored for smartphones, tablets, wearables and hearables, AR/VR devices, drones, robots, smart home and IoT (Internet of Things) applications. The product portfolio includes 3-axis accelerometers, gyroscopes and magnetometers, integrated 6- and 9-axis sensors, smart sensors, barometric pressure sensors, humidity sensors, gas sensors, optical microsystems, acoustic microsystems and comprehensive software. Since its foundation in 2005, Bosch Sensortec has emerged as the MEMS technology leader in the markets it addresses. Bosch has been both a pioneer and a global market leader in the MEMS sensor segment since 1995 and has, to date, sold more than 15 billion MEMS sensors.

The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). According to preliminary figures, the company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.

As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. Bosch employs some 76,100 associates in research and development, as well as roughly 38,000 software engineers.

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Cambridge GaN Devices

A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.

Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.

In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.

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Deca Technologies

Deca is the semiconductor industry’s leading independent development, implementation and licensing provider of advanced packaging technology offering M-Series, the #1 volume fan-out technology and Adaptive Patterning, empowering designers with breakthrough ultra-high-density interconnect capability.

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EPC is the leader in enhancement mode gallium nitride (eGaN®) based power management. eGaN FETs and integrated circuits provide performance many times greater than the best silicon power MOSFETs in applications such as DC-DC converters, remote sensing technology (lidar), motor drives for e-mobility, robotics, drones, and low-cost satellites.


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Ernst and Young

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Eurocomp Elektronik

EUROCOMP supports Microchip Technology. Broadest Portfolio of SiC Products and Solutions

Microchip Silicon Carbide (SiC) power solutions provide the lowest system cost, fastest time to market and lowest risk. Microchip solutions include the industry’s broadest and most flexible portfolio of SiC diodes, MOSFETs and gate drivers in bare die, discrete, module and customizable power module forms. With over 20 years of experience in the development, design and support of SiC devices and power solutions, Microchip can help you adopt SiC with ease, speed and confidence.



Microchip SiC MOSFETs feature best-in-class avalanche ruggedness, short circuit capability and oxide lifetime.


SiC Diodes

Microchip SiC Schottky Barrier Diodes (SBDs) offer the widest range of solutions in the market.


SiC Bare Die

Microchip SiC bare die MOSFETs and SBDs are excellent options for advanced power circuits and provide significantly higher power density and efficiency.

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