We develop our businesses in two key areas: semiconductor manufacturing equipment and precision measuring systems.
Our philosophy is to generate long-term growth through the creation of “WIN-WIN,” or mutually beneficial, relationships, with all our stakeholders – customers, business partners, shareholders and lnvestors and employees.

Products & Services

Dicing machine cut wafers into individual semiconductor chips with blades.
ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
The polish grinder is a single machine that can both slice various device wafers and remove damage, which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.
High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
Edge Grinding Machines, The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC. As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years. We make proposals that achieve the improvement of quality, CoO and yield with our machine.

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Actions Technology Co., Ltd.

Actions focuses on designing high volume integrated chips for mass market wireless audio, intelligent wear, intelligent interaction and intelligent Internet of things applications.

End to End Fabless Designer of Intelligent Audio SoC chips. Including IC Development, Marketing, and Sales.

Actions Technology produces SoCs which power Bluetooth audio, portable multimedia, and intelligent voice interaction applications.

Actions Technology devotes its resources to developing SoCs for low power wireless communication, multimedia processing and other IoT technology. Over the years Actions’ has developed a portfolio of IP involving Bluetooth communication, ADC/DAC, power consumption management, high-speed analog interface, and audio processing. Customers can leverage Actions’ IP with complete hardware and firmware engineering tools to accelerate the development of end products using Actions IC chips.

专注于中高端智能音频 SoC 的研发、设计及销售


承继与发扬近20年的研发沉淀和经验,炬芯科技擅长在低功耗的前提下提供高音质及低延迟的无线音频体验。公司深耕以高性能音频ADC/DAC、语音前处理、音频编解码、音频后处理为核心的高音质音频全信号链技术;以及以蓝牙射频、基带和协议栈技术为核心的低延迟无线连接技术。专精将射频通信、电源管理、模数混合音频、CPU、DSP 以及存储单元等模块高集成于一颗单芯片 SoC 上。公司积累了较完备、较先进的自主知识产权,通过融合软件开发包和核心算法提升 SoC 的价值,帮助客户降低基于芯片开发量产的门槛,让终端产品可以快速推向市场。

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AlixPartners is a results-driven global consulting firm that specializes in helping businesses respond quickly and decisively to their most critical challenges—from urgent performance improvement to complex restructuring, from risk mitigation to accelerated transformation. These are the moments when everything is on the line—a sudden shift in the market, an unexpected performance decline, a time-sensitive deal, a fork-in-the-road decision. We stand shoulder to shoulder with our clients until the job is done, and only measure our success in terms of the results we deliver.

Products & Services

Clients call us when they need pragmatism and cut-through to solve their most complex challenges arising from a continually disrupted world. Our services cover Artificial Intelligence, Corporate Strategy & Transformation, Data Governance, ESG, Growth, Investigations, Disputes & Advisory Services, Mergers & Acquisitions, Organizational Transformation, Supply-Chain Management & Operations, Technology, Transformative Leadership and Turnaround and Restructuring.

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Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)

YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.

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Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.

ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.

Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.

Fore more information, please visit and

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ATX Semiconductor (Suzhou) Co., Ltd.

ATX Group, a worldwide well-known company to provide service of IC assembly and test, offering a full range of turnkey services that include package design, front-end engineering test, wafer test, package assembly and final test. Besides, ATX Group maintains a highly experienced and skilled engineering team dedicated to the research and development of the latest assembly technologies. ATX also invests the latest equipments and state-of-art facilities, making us a true extension of our customers’ manufacturing operations. Has a professional laboratory, with most advanced equipments and rich experience in semiconductor assembly and test, to provide customers with comprehensive solutions.

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Ayar Labs

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a 1000x improvement in interconnect bandwidth density at 10x lower power. Ayar Labs’ patented approach uses industry standard cost-effective silicon processing techniques to develop high speed, high density, low power optical based interconnect “chiplets” and lasers to replace traditional electrical based I/O. The company was founded in 2015 and is funded by a number of domestic and international venture capital firms as well as strategic investors. For more information, visit

Address: 695 River Oaks Parkway, San Jose, CA 95134
Phone: 650-963-7200

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Bechtel Manufacturing & Technology, Inc.

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Be a leading automotive qualified open foundry in the Wide Band Gap ecosystem.

Enabling our customers to develop and manufacture unique solutions for a sustainable electrified future.

Creating value through our employees’ enthusiasm, talents and commitment.

BelGaN, as a WBG foundry in Europe, enables and services a rapidly expanding GaN-ecosystem in Europe (‘GaN-Valley’) and beyond with innovative and high-quality WBG semiconductor technologies and a highly efficient value-add 6 and 8 inch manufacturing facility. BelGaN adds unique services such as customer-driven Technology-as-a-Service (customized processes), Manufacturing-as-a-Service, and Quality-as-a-Service to the traditional foundry business model whereas we cooperate with suppliers and customers to deliver automotive quality products to the market. BelGaN develops and bring-to-market a rich roadmap of GaN & SiC platforms, driven by our customers’ needs and our core strengths and vision. We partner with leading universities and RTO’s in an Open Innovation model to prepare our innovation roadmap and bring differentiating innovations to our customers.

Manufacturing Facility: Wafer fab with over 4500 m2 of clean room space, located on a 44.000 m2campus.

Fab: 6 & 8 inch (planned).

Production: GaN Technologies & 0.35 µm to 2 µm Low, Medium, and High Voltage Analog CMOS and BCD Technologies.

Westerring 15
9700 Oudenaarde

+32 55 332211

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The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). The company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in some 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. With its more than 400 locations worldwide, the Bosch Group has been carbon neutral since the first quarter of 2020. The basis for the company’s future growth is its innovative strength. At 128 locations across the globe, Bosch employs some 76,100 associates in research and development, of which more than 38,000 are software engineers.

The company was set up in Stuttgart in 1886 by Robert Bosch (1861–1942) as “Workshop for Precision Mechanics and Electrical Engineering.” The special ownership structure of Robert Bosch GmbH guarantees the entrepreneurial freedom of the Bosch Group, making it possible for the company to plan

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Cambridge GaN Devices

A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.

Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.

In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.

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Chain-Logic International Corp.

Chain Logic International Corp. (CLIC) was established in 1994, located in Hsinchu Taiwan, and our parent company is MPI Corporation/ www.mpi- (IPO in 2003, TWSE: 6223)

CLIC is a professional agent in Taiwan, providing technical support and service for the manufacturing of high-tech industries such as Semiconductor, Optical devices, PCB, discrete devices, etc.

CLIC strives to continually deliver world-class service to our customers to assist them to optimize their production utilization.

Tel:+886-3-552 7788 Fax: +886-3-551 9899



Products & Services

We provide:

Advance Testing Solution (Modeling, Failure Analysis, RF, Low noise, High Power Applications)
Thermal Test (wafer level/package level)
Optical Devices Testing Solution (Micro LED, Lasers)
IC Package Process/Material
AOI/AVI Applications (Wafer level/ Package Level/PCB)

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City of Peoria


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Deca Technologies

Deca is the semiconductor industry’s leading independent development, implementation and licensing provider of advanced packaging technology offering M-Series, the #1 volume fan-out technology and Adaptive Patterning, empowering designers with breakthrough ultra-high-density interconnect capability.

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DuPont Electronics & Industrial

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Ernst and Young

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Escola Politécnica da USP

The University of São Paulo (USP) is a Brazilian public institution, established in 1934, maintained by the State of São Paulo. This means that no student pays fees to study at the university, which is fully maintained by state taxes. In Brazilian system, free public education is the one that maintains the highest quality in teaching, research and extension, the tripod that supports the Brazilian public university system. That is why USP grows each year in international rankings and is always in first place not only in Brazil but throughout Latin America. The university has the best researchers in the country on its staff, which reflects on the quality of teaching at undergraduate and postgraduate level.

There are 249 undergraduate programs offered and the number of students enrolled is approximately 58,000. It also has 239 graduate programs, with around 28,000 students. Until early 2013, more than 100,000 doctoral theses and Master dissertations have been defended. In addition, the University also has a social responsibility obligation represented by the extension area. There are 993 different courses involving specialization, improvement, updating and diffusion, with over 29,000 students.

USP has the objective of developing a lively teaching, following the transformation of knowledge and keeping in constant dialogue with society in a productive integration of education, research and extension. There are 6,000 professors, 98% of them with doctorates and exclusive dedication, 16,800 administrative staff and an annually budget of about $ 2.5 billion for 2013.

The USP campus in Ribeirão Preto is widely recognized for both its beautiful park-like setting and its academic excellence. Originally laid out in the 1950s as a health sciences campus (medical and nursing sciences, pharmaceutical sciences, dentistry), several academic specialties were gradually added, such as physics and mathematics, information technology, chemistry, biology, psychology and education. More recent foundations are a School of Economics, Business Administration and Accounting, a Law School, a School of Physical Education, and an undergraduate program in Music. Thus, the Campus of Ribeirão Preto now is not only the second largest USP campus in terms of academic specialties, but also in scientific production.

So as to best receive visiting scientists and students from abroad, the Campus has an International Office that works integrated with the International Offices of each Faculty, and helps visitors in getting settled and to feel the hospitality of the Interior. Being an administrative, business and cultural center in the interior of São Paulo, the city is thriving with an active cultural and student life.

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Etron Technology Inc.

Etron Technology Inc. (TPEx: 5351.TW) is a world renowned fabless IC design and product company founded by Dr. Nicky Lu in the Hsinchu Science Park (February 1991). The company specializes in the production and research of buffer memory, logic chip designs, electronic applications, and system-on-chips.

Products & Services

Commercial DRAM, Industrial DRAM, Automotive DRAM, Known Good Die,Innovative DRAM,Flash, USB, 3D Sensing Chips

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Eurocomp Elektronik

EUROCOMP supports Microchip Technology. Broadest Portfolio of SiC Products and Solutions

Microchip Silicon Carbide (SiC) power solutions provide the lowest system cost, fastest time to market and lowest risk. Microchip solutions include the industry’s broadest and most flexible portfolio of SiC diodes, MOSFETs and gate drivers in bare die, discrete, module and customizable power module forms. With over 20 years of experience in the development, design and support of SiC devices and power solutions, Microchip can help you adopt SiC with ease, speed and confidence.



Microchip SiC MOSFETs feature best-in-class avalanche ruggedness, short circuit capability and oxide lifetime.


SiC Diodes

Microchip SiC Schottky Barrier Diodes (SBDs) offer the widest range of solutions in the market.


SiC Bare Die

Microchip SiC bare die MOSFETs and SBDs are excellent options for advanced power circuits and provide significantly higher power density and efficiency.

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Exiger is revolutionizing the way corporations, government agencies and banks navigate risk and compliance in their third-parties, supply chains and customers through its software and tech-enabled solutions. Exiger’s mission is to make the world a safer and more transparent place to succeed. Empowering over 550 customers across the globe, including 150 in the Fortune 500 and over 50 government agencies, with award-winning AI technology, Exiger leads the way in ESG, cyber, financial crime, third-party and supply chain management. Its work has been recognized by 40+ AI, RegTech and Supply Chain partner awards. Learn more at and follow Exiger on LinkedIn.

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Fast SiC Semiconductor Inc.

Fast SiC Semiconductor is a SiC power devices supplier. We supply high performance 650V~1700V SiC MOSFETs and Schottky Barrier Diodes discrete devices and bare chips with our own proprietary designs, for leading customers in applications including PV inverters, EV charging piles, energy storage system, BMS, ATE, motor drive, SMPS for datacenter, OBC and DC/DC for EV, as well as manufacturers of industrial and EV power modules.

General Telephone: +886-3-6590579
General Email:

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Forehope Electronic (Ningbo) Co., Ltd.

Forehope(FHEC) was founded in Nov 2017, devoted to a worldwide and industry-leading high-end IC ,package assembly and testing . The end customer application covered consumer electronics,AI, industry, Automotive, Network,Data center etc. We can deliver package type include WBQFN, WBLGA, WBBGA, FCCSP, Hybrid-BGA, SiP, MEMS.,QFP, FCBGA etc. And also we can provide wafer level package include Bumping, WLCSP. Forehope continue to research & develop advanced wafer level package like as Fan-out, 2.5D/3D , which for chiplet solutions.

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FujiFilm Corporation

FUJIFILM Electronic Materials are a 100% owned subsidiary of FUJIFILM Corporation. Since our founding in 1983, we’ve been providing the global semiconductor industry with high-quality advanced materials and chemicals.

Headquartered in Yokohama, Japan, FUJIFILM Electronic Materials has 18 production and 6 R&D sites globally. As proud members of the FUJIFILM Group, we are one of the leading and most trusted producers of the chemical formulations that enable our customers to manufacture logic, memory and other integrated circuits that power current and next-generation electronic devices. Globally, Fujifilm recognizes its vital role in supporting and advancing many of the changes we see in our everyday lives.

For the detail, please check our website at

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GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.

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Globetronics Technology Berhad provides Design, Development and Outsource Semiconductor Assembly and Test services. Product portfolio include highly miniaturised optoelectronics, sensors, IC devices and timing devices for mobile, networking, automotive and emerging medical segments. The company is collaborating with leading technology partners in the areas of wafer level packaging, silicon photonics and wafer level MEMS.

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Greene Tweed

Greene Tweed designs and manufactures components, materials, and solutions that perform in the harshest environments. We engineer for conditions where equipment failure is not an option. Our products are made for extreme temperatures, pressure, chemical corrosion, and mechanical wear. With over 200 engineers in labs throughout North America, Europe, and Asia serving a variety of industries, we work with you to create a customized solution tailored to your critical operations’ requirements. Greene Tweed technical experts are always innovating, researching, and developing new thermoplastics, composites, and customized components. We are dedicated to expanding our clients’ performance in the world’s harshest environments.

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HCLTech is a global technology company, home to more than 224,000 people across 60 countries, delivering industry-leading capabilities centered around digital, engineering, cloud and AI, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending December 2023 totaled $13.1 billion. To learn how we can supercharge progress for you, visit

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Semiconductor Motor Distributor

Products & Services

Motors and controls

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Heller Industries

Heller Industries was founded in 1960 and pioneered convection reflow soldering in the 1980s. Over the years, Heller has partnered with its customers to continually refine the systems to satisfy advanced applications requirements. By embracing challenge and change, Heller has earned the position of World Leader in Reflow Technology…

Products & Services

Thermal Process Solutions

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Henkel Ltd.

Henkel was found in 1876 by founder Fritz Henkel. With our business units – Adhesive Technologies and Consumer Brands – we hold leading market positions in both the industrial and consumer goods businesses. Henkel adhesive technologies is world No. 1 producer in adhesives, sealants and functional coatings. With trusted brands and high-impact solutions based on an unmatched technology portfolio we are creating value for all our stakeholders. As experts for industrial applications in more than 800 industries, we work closely with our customers and partners. Based on our broad technology portfolio and our strong innovative power, we continuously develop customized solutions. In fiscal 2023, Henkel reported sales of more than 21.5 billion euros and adjusted operating profit of around 2.6 billion euros. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Today employs a diverse team of about 48,000 people worldwide.

Products & Services

Henkel is the world’s leading provider of qualified, compatible material sets for semiconductor packaging. We’re your global partner prepared to handle any challenge and develop a solution that is smart and sustainable — together with you.
Henkel’s total solutions approach leverages extensive global resources to deliver superior semiconductor packaging material technologies and cost-competitive performance. From die attach adhesives used in traditional wirebond packaging to advanced underfills and encapsulants for advanced packaging applications, Henkel provides the cutting-edge materials technology and global support top microelectronics companies require.
Henkel’s advanced packaging solution include:
•Anhydride-free, low warpage liquid compression molding underfill (LC-MUF) for fine-gap filling and low wafer-level warpage.
• High fracture toughness, low CTE capillary underfills for faster flow and thorough bump encapsulation on large dies.
• Low-stress, high-elongation lid attach materials for improved warpage control and enhanced reliability performance.

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Heraeus Electronics

Heraeus Electronics is a leader in Advanced packaging and Semiconductor solutions for the electronics industry. For years Heraeus has supported the rapid growth in the semiconductor industry by using technical resources around the world to develop solutions for our customers while keeping price in mind. The ability to keep the pace with the industry has also given our customers the advantages they need to be succesful and profitable in this continuously changing enviroment. Please visit our website to see the latest advancements in Solder paste, Wire, Ribbon, and Thick film solutions for semiconductor packaging.

Products & Services

Materials for the Electronics Packaging and Component Industry

  • Bonding Wires
  • Solder Materials
  • Adhesives
  • Sinter Materials
  • Thick Film Materials
  • Metal Ceramic Substrates
  • Material Systems
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Hermes-Epitek Corp.

Hermes-Epitek was founded in 1977. Our vision is to “be a world-class semiconductor and Opto-Electronic company“ by delivering exceptional products and services, uniting the team with the motto ”service by Hermes-Epitek”. Over the 40 years, Hermes-Epitek has been supporting customers in Asia with our partners, serving more than 200 semiconductor and opto-electronic plants. We have successfully developed E-beam inspection, Ion beam implanter, and MOCVD systems. Our service teams are located in Taiwan, Singapore, Malaysia, and China, with more than 1200 employees worldwide. For more information, please visit Head Office Tel +886-3-579-0022 Fax +886-3-579-0011 Address No.18, Creation Rd., 1, Hsinchu Science Park, Hsinchu 300093, Taiwan

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Hitachi Energy Ltd.

We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.

Hitachi Energy Switzerland Ltd.
Fabrikstrasse 3
CH-5600 Lenzburg, Switzerland

Phone: +41 58 586 14 19
Fax: +41 58 586 13 06

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HOYA Corporation

Founded in 1941 in Tokyo, Japan, Hoya is a global med-tech company, and a leading supplier of innovative high-tech and medical products. Hoya is active in the fields of healthcare and information technology providing eyeglasses, medical endoscopes, intraocular lenses, optical lenses as well as key components for semiconductor devices, LCD panels and HDDs. With about 160 offices and subsidiaries worldwide, Hoya currently employs a multinational workforce of about 36,000 people.

Products & Services

Hoya is active in the fields of healthcare and information technology providing eyeglasses, medical endoscopes, intraocular lenses, optical lenses as well as key components for semiconductor devices, LCD panels and HDDs.

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Hyundai Mobis

As a global auto parts vendor, we focus on autonomous driving, connectivity and electrification to be a leader in the era of smart mobility.

Based on three modular auto components (i.e. chassis, cockpit and front-end), we work to make driving safer and easier and also offer service parts that can best serve the purpose. In addition, we are the first global vendor to adopt a massive flow production line for the key components of hydrogen-fueled vehicles, playing a leading role in the development of the technology towards full production.

Our vision is to be a provider of differentiated mobility solutions that combine software and hardware in the upcoming mobility industry. To make this vision a reality, we have expanded our business areas to include smart mobility, UAM and robotics based on our R&D capability and production capacity.

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Iluvatar CoreX

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Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2021, imec’s revenue (P&L) totaled 732 million euro.

Further information on imec can be found at

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InchFab uses an ultra-low-cost scalable “micro-sized” fab platform. Today InchFab uses this platform to provide highly flexible and cost effective MEMS foundry services to its customers and partners.