MIT Semiconductor (Tianjin) Co., Ltd.
MIT Semiconductor (Tianjin) Co., Ltd. is a leading manufacturer of semiconductor packaging and testing equipment in China. The company focuses on the core process equipment and software services of advanced packaging and testing of integrated circuits, and its core products include: various types of bare die sorting and inspection machines, various types of high-precision die bonder (flip/non-flip) machines, 3D visual inspection equipment, laser marking machines, various digital/analog ATE, and AI solutions for packaging production line. Products are widely used in packaging and testing of consumer electronics, high-performance computing, storage, automotive electronics, camera modules etc., supporting processes such as WLCSP, FCQFN, FCBGA, Fan-Out, SiP, 2.5D/3D, etc. We serve customers all over the world, including leading IDM companies, packaging and testing foundries and design companies in various segments.