MIT Semiconductor (Tianjin) Co., Ltd.

MIT Semiconductor (Tianjin) Co., Ltd. is a leading manufacturer of semiconductor packaging and testing equipment in China. The company focuses on the core process equipment and software services of advanced packaging and testing of integrated circuits, and its core products include: various types of bare die sorting and inspection machines, various types of high-precision die bonder (flip/non-flip) machines, 3D visual inspection equipment, laser marking machines, various digital/analog ATE, and AI solutions for packaging production line. Products are widely used in packaging and testing of consumer electronics, high-performance computing, storage, automotive electronics, camera modules etc., supporting processes such as WLCSP, FCQFN, FCBGA, Fan-Out, SiP, 2.5D/3D, etc. We serve customers all over the world, including leading IDM companies, packaging and testing foundries and design companies in various segments.

砺铸智能设备（天津）有限公司是国内领先的半导体封装测试设备制造厂商。公司聚焦于集成电路先进封测的核心工艺设备及软件服务，核心产品包括：各类裸晶分选检测机、各类高精度倒装/正装贴片机、三维视觉检测设备、激光打标机、各类数字/模拟测试机、以及封装产线AI解决方案等。产品广泛应用于消费电子、高性能计算、存储、汽车电子、摄像头模组等领域的半导体先进封测制程，如WLCSP，FCQFN，FCBGA，Fan-Out，SiP，2.5D/3D等。服务的客户遍布全球，包含各细分领域领先的IDM公司、封测代工厂和设计公司。