Bassam Ziadeh photo

Bassam Ziadeh

Global Technical Specialist – IC Packaging, Assembly & Test
General Motors


Bassam is a Global Technical Specialist at General Motors, where he is responsible for defining a strategic roadmap for advanced automotive semiconductor packaging—essential for achieving GM’s role in Autonomous Driving and Software Defined Vehicle compute. Bassam’s expertise lies in Advanced Packaging, Chip and Product Architecture, OSAT and Industry Engagement, and successful product ramps. He is actively involved with IMEC and the UCIe for commercialization of these ventures. Previously, as a Senior Technologist of Advanced Packaging at Intel for 12 years, Bassam pioneered key technologies and process steps for 2.5D and 3D products for data center and client applications such as EMiB and Foveros. He holds degrees in Mechatronics and Mechanical Engineering and has contributed extensively to the field through numerous publications, patents, and conference proceedings on advanced packaging and automotive compute.

Company Profile

General Motors

General Motors is a global company focused on advancing an all-electric future that is inclusive and accessible to all. At the heart of this strategy is the Ultium battery platform, which powers everything from mass-market to high-performance vehicles. General Motors, its subsidiaries and its joint venture entities sell vehicles under the Chevrolet, Buick, GMC, Cadillac, Baojun and Wuling brands. More information on the company and its subsidiaries, including OnStar, a global leader in safety services and connected vehicle technology, can be found at