Dae-Woo Kim, Ph.D.
Biography
Dae-Woo Kim, Corporate VP at Samsung Electronics for 7 years with advanced package technology and product development. In his current position, Dae-Woo is leading the system package lab for product & technology development including 2.xD, 3D, FOWLP and FOPLP technology.
Prior to joining Samsung Electronics, he was a TD Engineering manager at Intel ATTD, Chandler Arizona. During 14 years of experience at Intel, he worked on CPI area, assembly test chip design, Si bridge design and package process & design integration for CPU flip chip package, EMIB, and Foveros technology.
Dr. Kim received a Ph. D., Master and bachelor degree in Material Science Engineering from Yonsei University, Seoul, S. Korea, Country and he was a research faculty in III-V semiconductor field for 3 years at Arizona State University, Tempe, AZ.
Company Profile
Samsung Electronics
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.