Jim Lin, Ph.D.
Biography
Dr. Jim Lin is Vice President of Advanced Technology & Wafer Level Package Operation. He is in charged of advanced packaging R&D, Business and Operation in PTI. Prior to BU head, Dr. Lin was AVP of Memory Packaging Research & Development. Dr. Lin joined PTI in 2006, led the development of memory packaging technology. Developed technologies including 8 to 32 chips memory stacking package, system integrated package of SSD, Package on Package(PoP), Heterogeneous multi-chip package(MCP), 3D TSV interconnection High Bandwidth Memory(HBM) and Fan-out Panel Level Package (FOPLP). Dr. Lin received his M.S. and Ph.D. degree both from National Tsing Hua University in Power Mechanical Engineering.
Company Profile
Powertech Technology Inc.
Powertech Technology Inc. (PTI), the world’s leading OSAT, was founded in 1997. We serve the international customers with services including chip bumping, chip probing, IC assembly, final testing, burn in, and system level assembly. In 2017 PTI expanded the production base to Japan to serve the local automotive electronics and IoT market. And in 2018, PTI began the construction of the newest Fan Out Panel Level Package manufacturing facility in Hsinchu Science Park.
PTI has over 18,000 employees world wide, and manufacturing facility located in Taiwan, China and Japan. PTI dedicates her efforts in developing advanced technologies, while carrying on as the world’s leading memory packaging and testing solution provider. Through strategic alliances and resource integration, PTI group relentlessly marches onward in the semiconductor packaging and testing field.
We drive our future growth with outstanding quality, cost, and delivery. Promise, Technology, and Integration represents our core values. With our ideaology, strategy, and core values, PTI stands as the world class OSAT.