27-28 August 2025
Suwon
Jimmy Chew, the Chief Executive of PEP Innovation, leads the company in developing cutting-edge semiconductor packaging solutions, particularly in panel-level chip-scale packaging. His leadership has driven the company’s mission to create smaller, lighter, and more cost-effective packaging solutions with improved electrical and thermal performance. Jimmy Chew’s innovations aim to revolutionize the semiconductor packaging industry, offering reliable, high-performance packaging technologies designed to meet the growing demands of modern electronics.
PEP Innovation specialises in the technology of panel level packaging. Our business model includes licensing of patents, tech transfer and the marketing of technology to potential product customers and manufacturers.