22-23 October 2025
Singapore
Patrick Schwarz has studied chemistry in Regensburg, Germany where he completed his PhD in inorganic chemistry. He joined Infineon in 2011 as an engineer for reliability and analytics focusing on chip embedding technologies. 2013 he transferred from RnD to production in the area of process integration and transfer management , where he also took his first management role in 2015 as head of process integration and product engineering for laminate based packages. With the start of Infineons first molded power module Hybridpack DSC he took leadership of the ramp up management for the new platform becoming a specialist for critical new product introductions. After shifting to global productivity platform owner for preassembly within Infineon he joined Huawei as Lab Director for Power Packages in 2024.
Founded in 1987, Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We have approximately 208,000 employees and we operate in over 170 countries and regions, serving more than three billion people around the world. We are committed to bringing digital to every person, home and organization for a fully connected, intelligent world.
At Huawei, we have two key drivers of innovation: science and technology, and customer needs. Both commercial value and market demands are driving our innovation and determining how we invest in science and technology. Breakthroughs in technology, in return, stimulate customer needs and allow us to create greater value for customers.
In 2024, our total R&D spending reached CNY179.7 billion, representing 20.8% of our total revenue.
Our total R&D investment over the last decade now exceeds CNY1.249 trillion.
On December 31, 2024, 113,000 employees (about 54.1% of our workforce) worked in R&D.
Through years of sustained innovation in fundamental domains, Huawei has become one of the world’s largest patent holders, currently holding 150,000+.