Prof. Qinfen Hao
Professor
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Dr. Qinfen Hao, graduated from the Institute of Computing Technology, Chinese Academy of Sciences (ICT) in 2001 with a Ph.D. in System Architecture. He is currently the director of the Interconnect Technology Laboratory of ICT, a professor at the University of Chinese Academy of Sciences, the secretary-general of the China Computer Interconnect Technology Alliance (CCITA) and the director of the Wuxi Institute of Integrated Circuit Interconnect Technology.
He has successively engaged in the design and research of high-performance computer, high-end SMP server, several important chips in computer such as cache coherence interconnect chip, CPU, etc. He has won the second prize of the Chinese National Science and Technology Progress Award twice, in charge of over three national scientific research projects, served as the chief scientist of the Ministry of Science and Technology’s key research and development program. He published more than 40 scientific papers and applied for more than 30 patents until now.
Company Profile
Hongchao Liu, Ph.D.
SVP/Chief Scientist
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Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.
Company Profile
YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.
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