Gary Zhong
Senior Director and Head of Vehicle Motion Segment
No summit linked
Gary Zhong joined Infineon as Head of Vehicle Motion Segment in the Greater China region in October 2020. Gary brings with him over 15 years of professional experiences in top new energy vehicle industry companies and demonstrated his strong technical background and leadership in NEV battery system, traction motor, and vehicle control areas.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Tong Wu, Ph.D.
Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications
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吴桐，安森美（onsemi）中国区汽车市场负责人，上海交通大学半导体物理专业，数学专业辅修本科毕业，美国田纳西大学电气工程博士学位。吴博士在半导体封装，碳化硅设计应用方面拥有 10 余年的研发和工业经验。 目前在安森美负责中国区汽车技术与市场，覆盖产品设计，制造，市场及应用，了解新能源行业的市场、供应链、开发流程以及解决方案。与国内多家车厂、Tier 1 保持着深度合作以及技术支持。曾就职于美国田纳西州橡树岭橡树岭国家实验室（ORNL），以及车厂研发团队，共在国际会议和期刊上发表了 40 多篇论文，同时获得了多项 半导体方面的美国专利。
Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.
Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Dino Costanzo
Application Director and head of Motor Control Competence Center in AP.
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Application Director, has 20 years of experience in application development, in the field of System solutions for Motor Control;
After graduated with a Master’s degree in Electric Engineering from the University of Catania, he joined STMicroelectronics Italy in 2006, where he was appointed Project Leader of STM32 Motor Control Firmware Library (MCSDK), and taking the role of coordination of the joint developments with Universities.
Later on, he moved in 2015 to Shenzhen, where he is now directing the Motor Control Competence Center of China and APeC regions, working on the development of advanced solutions for the industrial market, comprising HVAC, Servo Drives, and Power Tools.
His research interest are in algorithms for three-phase motors, where he is author of 7 US patents and others pending, in the fields of HFI sensorless control, acoustic noise reduction, motor currents reading, multiple Motor Control architectures, digital power etc.
Major customers in Asia have made partnership with his team, and generated successful product lines based on ST products and solutions, for which the Motor Control Competence Center has been awarded consecutively for “best motor control platform” by specialized reviews.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Kevin Shen
Chief Strategy & Business Operation Officer
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Kevin Shen is in charge of Corporate Strategy & Business Operation, CS&BO, which includes defining WeEn’s corporate strategy, driving our KPI tracking, pushing for our process improvements and heading the innovation programs with a focus to establish new platforms and address new market segments. Kevin graduated from Peking University, major in Physics. He has 17 years’ experiences in semiconductors and high tech companies, including NXP Semiconductors, Intel and Accenture. Most recently, he was responsible for China business in Leap Motion, a leading AR/VR technology company based in US.
Company Profile
WeEn Semiconductors Co., Ltd was registered as a company on Aug 5, 2015. WeEn’s global footprint has an operational headquarter in Shanghai and wholly owned subsidiaries and centers in Jilin (North East China, Front-End Fabrication) , Hong Kong, Manchester (Research and Development) , Dongguan (Warehouse and Distribution), and cities throughout the world (Sales Offices and Customer Service Access). In September 2018, WeEn added its new, in-house, reliability and failure analysis laboratory in Nanchang, Jiangxi Province, China. With a heritage of over 50 years in semiconductor development and manufacturing, WeEn as a key player has focused on developing a wide and deep portfolio of industry-leading power products including Silicon Carbide Power Devices, Silicon Controlled Rectifiers and Triacs, standard and fast recovery Power Diodes, TVS and ESD Diodes and IGBT and Modules. All these products are widely used in the markets for telecommunications, computing, consumer electronics, intelligent home appliances, lighting, automotive and power management applications. WeEn seeks to help our customers achieve improved cost and production efficiency and contribute to the development of global intelligent manufacturing.
Jun Li
General Manager (FAE Head Quarter), Shanghai
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JUNLI joined ROHM in 2003, and have been in charge of ROHM China Technical Center for almost 20 years, including applications and promotions of ROHM semiconductors in consumers, automobile and industry.
Company Profile
ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.
Vishnu Kumaresan, Ph.D
Semiconductor Business Specialist & Segment Leader
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Vishnu Kumaresan as a Segment Leader drives Volvo Group’s Semiconductor strategy. He has a doctorate degree in semiconductor field and has specialized in strategy development. Vishnu has more than 10 years of experience in the semiconductor, software, and display technologies before joining Volvo group.
Company Profile
The Volvo Group is one of the world’s leading manufacturers of trucks, buses, construction equipment and marine and industrial engines. The Group also provides complete solutions for financing and service. The Volvo Group, with its headquarters in Gothenburg, employs about 100,000 people, has production facilities in 18 countries and sells its products in more than 190 markets.
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
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Yik Yee Tan, PhD is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).
Company Profile
Yole Group is an international company recognized for its expertise in the analysis of markets, technological developments, and supply chains, as well as the strategy of key players in the semiconductor, photonics, and electronics sectors.
With Yole Intelligence, Yole SystemPlus and Piséo, the group publishes market, technology, performance, reverse engineering and costing analyses and provides consulting services in strategic marketing and technology analysis. The Yole Group Finance division also offers due diligence assistance and supports companies with mergers and acquisitions.
Yole Group benefits from an international sales network. The company now employs more than 180+ people.
More information on www.yolegroup.com.
Company phone:
+33 472 83 01 80
Angeline Tee
Senior Management | Strategic Planning & Partnership Management
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Angeline Tee brings over 25 years of global expertise in the MEMS and microelectronics industry. She is currently responsible for strategic planning, partnership management, and business development for the Microsystem Division at Silicon Austria Lab (SAL), Villach. In this role, she supports the coordination of various EU-funded collaborative programs, including pilot lines, while also managing partnerships with the diverse stakeholders involved.
Angeline holds an Honor’s degree in Applied Science (Materials Engineering) and a Master of Science in Electrical Engineering from the National University of Singapore (NUS). She also earned an MBA from the University of Birmingham, providing her with a strategic and managerial outlook.With 15 years of technical expertise in MEMS process engineering, Angeline transitioned into business-oriented roles, focusing on strategic marketing and business development. She has since worked with GLOBALFOUNDRIES, XFAB MEMS Foundry, and the Institute of Microelectronics at A*STAR, where she has concentrated on market research, industrial collaboration, and strategic partnerships to drive organizational growth and sustainability.
With her diverse skill set, comprehensive industry experience, and strong academic background, Angeline is committed to advancing technological innovation within the MEMS and microelectronics industry.
Company Profile
Silicon Austria Labs (SAL) has been founded to be a top European research center for electronic-based systems. In the network of science and economy, we carry out research at a global level and create the basis of groundbreaking products and processes.
Maksym Plakhotnyuk, Ph.D.
CEO & Founder
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Dr. Maksym Plakhotnyuk, is the CEO and Founder of ATLANT 3D, a pioneering deep-tech company at the forefront of innovation, developing the world’s most advanced atomic-scale manufacturing platform. Maksym is the inventor of the first-ever atomic layer advanced manufacturing technology, enabling atomic-precision development of materials, devices, and microsystems. A scientist with a Ph.D. in Nanotechnology, he has deep expertise in nanotechnologies, renewable and exponential technologies, semiconductor processing, solid-state physics, and material science. A Fulbright scholar, Hello Tomorrow Grand Winner, and proud Ukrainian, Maksym has earned global recognition for his work.
Company Profile
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Jason Wang
Founder
No summit linked
Hongpeng Wang graduated from the Department of Electronic Engineering of Tsinghua University with Bachelor and Master degree. He has worked in many well-known chip design companies as the head of R&D, and has more than 15 years of technical management experience. He is an expert in IC design and system architecture, and has successfully mass-produced 20+ chips for different applications.
In 2021, he founded Join Silicon. Join Silicon is a technology platform company focusing on IC design of advanced process technology, committed to IP independent R&D and service, enabling chip design and SoC customized solutions. Join Silicon provide advanced process IP, one-stop high-end SoC customization, as well as chiplet and advanced 2.5D/3D packaging products for customers in high-performance computing, data center, 5G communications, artificial intelligence, automotive electronics etc..
Company Profile
JoinSilicon is a world class Product Engineering Company that provides custom products and solutions for the semiconductor industry. Our large pool of well-trained engineers can support from Application Software to Transistor Level Layout in advance technology nodes including 6nm. Customers take advantage of our extensive experience in co-developing hardware and software under one roof to translate their ideas into real products. Our turnkey ASIC engagement model allows our customers to rely on warranties provided on work performed. With the experience of shipping millions of production worthy silicon to customers, JoinSilicon, is your trusted partner to deliver designs on time with the quality you expect.
JoinSilicon is a world class Product Engineering Company that provides custom products and solutions for the semiconductor industry. Our large pool of well-trained engineers can support from Application Software to Transistor Level Layout in advance technology nodes including 6nm. Customers take advantage of our extensive experience in co-developing hardware and software under one roof to translate their ideas into real products. Our turnkey ASIC engagement model allows our customers to rely on warranties provided on work performed. With the experience of shipping millions of production worthy silicon to customers, JoinSilicon, is your trusted partner to deliver designs on time with the quality you expect.
Dr. Tim Yeh
Technical Director
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Yeh, Nientze, Ph.D. in Electrical Engineering from National Central University, Taiwan. He has long been engaged in the research and industry of compound semiconductor materials and devices, especially having 25 years of industrial R&D experience in the field of wide band-gap semiconductor materials and devices. Proficient in the design and industrial manufacturing of compound semiconductor devices. Has served as a researcher at the Telecommunication Laboratories of Chunghwa Telecom Co, Ltd. and the technical head of a listed company in Taiwan. The research results have obtained more than 30 patent authorizations in the United States, Japan, the Chinese and Taiwan, and published more than 70 international journal papers. He has also participated as the project or subject leader in several major projects and national key R&D programs.
Currently serves as the technical director of Hunan Sanan Semiconductor Co, Ltd., responsible for the R&D and mass production of compound semiconductor power electronic devices, and successfully built a production line of wide band-gap semiconductor power electronic devices from epitaxy to devices.
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Dr. Richard Feng
Director of power semiconductor and module R&D center
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Dr. Feng is the Director of power semiconductor and module R&D center at Bosch Mobility Electronics (ME) China, where he and his engineering team focus on the design, characterization, testing and application of innovative and cost-effective power semiconductor components and power modules for China and global EV market. The product portfolio includes SiC bare dies, IGBT and SiC power modules.
Dr. Feng boasts 10 years of experience in the application of SiC and GaN device. He has 6 years of experience on Electric Vehicle (EV) traction inverter power module research, development, and power module application in China car OEMs and Tier1suppliers.
Dr. Feng obtained his Ph.D. degree in Power Electronics from Zhejiang University China in 2004.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Wilson Hong
Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering
No summit linked
Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
NIO is a global smart electric vehicle company. Founded in 2014, NIO has been committed to shaping a joyful lifestyle by offering high-performance smart electric vehicles and ultimate experience. NIO is the first car company listed on the NYSE, HKSE and SGX. NIO currently has two major brands under its umbrella: NIO and ONVO. Nine years into establishment, NIO is one of the leading companies in the global premium smart electric vehicle market.
Ding Rongjun
Academician of Chinese Academy of Engineering, Chief Engineer CRRC 丁荣军 院士 / 中车总工程师
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Ding Rongjun, Academician of the Chinese Academy of Engineering, expert in power electronics and control technology, recipient of the State Council Special Allowance; member of the National Industry Foundation Committee, Director of the National Key Laboratory of Power Semiconductors and Integrated Technology, Chairman of the Power Semiconductor Industry Alliance, and Editor-in-Chief of the academic journal Locomotive Electric Drive; representative of the 18th and 19th National Congresses of the Communist Party of China; currently serving as Chief Scientist of CRRC (China Railway Rolling Stock Corporation) and Dean of the School of Mechanical and Vehicle Engineering at Hunan University.
Academician Ding has long been engaged in innovative research and technology transfer in the fields of power electronic devices, traction converters, and AC drive systems. He established a standards system suited to China’s national conditions that aligns with international technical models. His contributions have played a significant role in China’s breakthrough development from conventional rail to heavy-duty rail and from regular-speed to high-speed rail. He has presided over or participated in more than 30 major national, provincial, and ministerial-level research projects, received 1 National Invention Award, 2 Second Prizes for National Scientific and Technological Progress, 3 Special Prizes, 8 First Prizes, and 4 Second Prizes at the provincial and ministerial levels. He has also been honored with the “Ho Leung Ho Lee Science and Technology Award,” “Zhan Tianyou Science and Technology Achievement Award,” “Mao Yisheng Science and Technology Award,” designation as a national-level talent in the “New Century Hundreds-Thousands-Talents Project,” and titles such as “National Model Worker,” “Most Beautiful Railway Technology Worker,” and one of the “50 Honored Figures of China’s Subway Development.”
丁荣军，中国工程院院士，电力电子及控制技术专家，国务院特殊津贴获得者；国家产业基础委员会委员、功率半导体与集成技术全国重点实验室主任、功率半导体行业联盟理事长、学术期刊《机车电传动》主编；中国共产党十八大、十九大代表；现任中国中车首席科学家，湖南大学机械与运载装备学院院长。
丁院士长期从事电力电子器件、牵引变流和交流传动系统的创新研究和成果转化，创建了适合我国国情的标准体系并与国际接轨的技术模式，为中国铁路从普载到重载、从常速到高速的突破发展做出了重大贡献。先后主持、参与国家、省部级重大科研项目30余项，获国家发明奖1项、国家科技进步二等奖2项、省部级特等奖3项、一等奖8项、二等奖4项，获“何梁何利科学技术奖”、“詹天佑科技成就奖”、“茅以升科学技术奖”、“新世纪百千万人才工程国家级人选”、“全国劳动模范”、“最美铁道科技工作者”和”中国地铁50年致敬人物“等荣誉称号。
Company Profile
Jeff Ding
Co-founder & CEO
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Ding Xuanming, born in 1983, graduated with a master’s degree in Electrical Engineering from Shanghai University. In November 2019, he founded Lipus Semiconductor in Wuxi, focusing on the research, production, and sales of IGBT and SiC power semiconductor products. These products are primarily used in applications such as electric vehicles, hydrogen energy, photovoltaics, industrial frequency converters, wind power, smart grids, and medical devices. Currently, he is responsible for the operations of Lipus, including team building, market promotion, financing, and production line construction. The company is in a rapid growth phase, having completed a total financing of 250 million yuan in just three years.
Company Profile
Wuxi Leapers Semiconductor Co., Ltd. brings together experienced professionals at home and abroad, including wafer process and device design, module packaging design, product application, marketing and product operation. Major products include high-reliability SiC and IGBT modules for new energy vehicles and industrial applications. Products are used in new energy vehicles, smart grids, renewable energy, industrial motor drives, medical equipment, power supplies and other scenarios and fields; the company is headquartered in Wuxi, China, and has a research and development center in Japan.We adopts innovative packaging materials and processing technology to provide complete module application solutions for the miniaturization, efficiency and light weight of electric drive systems and inverters for new energy vehicles. Meet the needs of high-performance, high-reliability new energy vehicles and high-end industrial power semiconductor modules.
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