Achim Kempe
COO
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Achim Kempe is the Chief Operating Officer at Nexperia, bringing over three decades of experience in the semiconductor industry. Based in Hamburg, he has led global operations since 2018, following senior leadership roles at NXP Semiconductors and Philips Semiconductors. His expertise spans wafer fabrication, test engineering, and business group management, with a career grounded in technical excellence and strategic leadership. Achim holds a Master’s degree from the University of Siegen and a Bachelor’s degree from FH Cologne, both in Electrical Engineering. Known for his operational insight and engineering depth, Achim continues to shape the future of semiconductor manufacturing.
Company Profile
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Tim Maloney
Senior Director of Business Development
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Tim Maloney is Senior Director of Business Development at Polar Semiconductor in Bloomington, Minnesota, USA — a newly transformed, majority U.S.-owned pure-play foundry delivering advanced power and sensor devices. With a heritage of high-volume automotive manufacturing and a $525M CHIPS Act-backed expansion underway, Polar is doubling capacity and capability to serve strategic markets, including automotive, data center, industrial, and aerospace and defense.
With over 25 years in the semiconductor industry, Tim has led initiatives in process engineering, fab operations, technology transfer, and global supply chain management. He is driving the efforts to bring new customers to Polar to provide accelerate leadership in US based semiconductor manufacturing.
Tim’s career started as a process engineer at Motorola Semiconductor and leadership roles at onsemi, Seagate Technology, and SkyWater Technology, covering high-voltage power devices, MEMS, and mixed-signal technologies. A graduate in Industrial Engineering from the University of Wisconsin–Madison, he combines deep technical knowledge with a strategic business perspective — making him a strong advocate for partnerships that advance power semiconductor innovation and manufacturing competitiveness worldwide.
Company Profile
Polar Semiconductor is a U.S.-owned MN located 200mm foundry specializing in sensor and power semiconductors, for high-volume manufacturing of silicon and wide-bandgap ICs and discrete devices, and specialty products tailored for Automotive, Industrial, and Aerospace & Defense applications.
Maike Mueller, Ph.D.
Head of Semiconductor Strategy & Development Power Modules
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Dr. Maike Mueller graduated in chemistry from Technical University of Munich and received her doctorate from the Humboldt University of Berlin while working at the Federal Institute for Materials Research and Testing. She started her career in the semiconductor industry as a quality and process engineer at Osram Opto Semiconductors in Regensburg. The past 11 years she has been working in various management roles within Infineon’s automotive and consumer divisions as well as procurement department. Since Oct 2024 she joined VW Group as Head of Semiconductor Strategy & Development of Power modules, Group Powerelectronics.
Company Profile
As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.
Patrick Schwarz, Ph.D.
Lab Director Power Packages
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Patrick Schwarz has studied chemistry in Regensburg, Germany where he completed his PhD in inorganic chemistry. He joined Infineon in 2011 as an engineer for reliability and analytics focusing on chip embedding technologies. 2013 he transferred from RnD to production in the area of process integration and transfer management , where he also took his first management role in 2015 as head of process integration and product engineering for laminate based packages. With the start of Infineons first molded power module Hybridpack DSC he took leadership of the ramp up management for the new platform becoming a specialist for critical new product introductions. After shifting to global productivity platform owner for preassembly within Infineon he joined Huawei as Lab Director for Power Packages in 2024.
Company Profile
Founded in 1987, Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We have approximately 208,000 employees and we operate in over 170 countries and regions, serving more than three billion people around the world. We are committed to bringing digital to every person, home and organization for a fully connected, intelligent world.
At Huawei, we have two key drivers of innovation: science and technology, and customer needs. Both commercial value and market demands are driving our innovation and determining how we invest in science and technology. Breakthroughs in technology, in return, stimulate customer needs and allow us to create greater value for customers.
In 2024, our total R&D spending reached CNY179.7 billion, representing 20.8% of our total revenue.
Our total R&D investment over the last decade now exceeds CNY1.249 trillion.
On December 31, 2024, 113,000 employees (about 54.1% of our workforce) worked in R&D.
Through years of sustained innovation in fundamental domains, Huawei has become one of the world’s largest patent holders, currently holding 150,000+.
Dominic Viens
VP & GM Power Test Division
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Dominic Viens is Vice President and General Manager of the Power Test Division at Teradyne, where he leads global strategy and operations for power semiconductor test solutions. With over 25 years of experience across product management, sales, and engineering, Dominic has held senior roles at both Teradyne and MathWorks. He has successfully launched high-growth product lines, driven complex design-ins, and led global teams across Asia, Europe, and North America. Dominic holds a degree in Electrical Engineering from McGill University. He is also an inventor on multiple patents in semiconductor test innovation
Company Profile
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
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www.teradyne.com
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
- Semiconductor test systems
- Storage and system-level test systems; Defense and aerospace test instrumentation and systems; Circuit-board test and inspection systems
- Wireless test systems
Roberto Antonicelli, Ph.D.
Senior Director, Automotive BU
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Professional with over 25 years of international experience in the semiconductor and automotive sectors. Currently Senior Director at STATS ChipPAC, part of JCET Group, he has previously held leadership roles at STMicroelectronics and Infineon. He holds a PhD in Microelectronics, with a focus on semiconductor packaging and RF/microwave design. His expertise spans business development, strategic partnerships, and complex program execution, with a strong emphasis on business innovation and collaboration. Married and father of three children, he is recognized for his forward-thinking approach to advancing technology and business solutions.
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Torsten Müller, Ph.D.
Senior Director IC Technologies
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Dr. Torsten Müller holds a PhD in Physics and brings 25 years of expertise in semiconductor research, development, and production. Throughout his career, he has contributed to advancing Flash technology at Infineon and Qimonda, managed solar cell production at Conergy and Sovello, and led the technology development and ramp of a 28nm high-k metal gate technology at Globalfoundries. Returning to Infineon Dresden, he managed the 300mm technology transfer portfolio before taking his current role as Head of IC Technologies. With a proven track record in innovation, leadership, and operations, Dr. Müller remains a driving force in semiconductor advancements.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Matthias Bonkass
VP Advanced Manufacturing Engineering
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Matthias Bonkass brings over 25 years of semiconductor leadership to his role as VP of Advanced Manufacturing Engineering at GlobalFoundries. A pioneer in Dresden’s fab development since 1997, he has held key roles across AMD and Globalfoundries, including Module Manager positions for CMP/Plating, PVD/CVD and Head of the global Bump Test Facility. His expertise spans 200mm and 300mm technologies, global service integration, and automation-driven efficiency. Since 2020, he has led Fab1’s ramp-up strategy, driving innovation and operational excellence. Matthias holds several patents and serves on the ISS Europe Committee and Fab Manager Forum Europe. Based in Dresden, Germany, Matthias is recognized for his collaborative approach and commitment to innovation in advanced manufacturing environments.
Company Profile
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.
Dirk Drescher, Ph.D.
VP and Plant Manager
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Dirk started his career in 1995 as process engineer for Siemens Microelectronics Center Dresden. In 2000 he joined Infineon’s Semiconductor 300 organization to help starting up the worlds first 300mm Semiconductor Manufacturing Line. 2010 Mr. Drescher joined Globalfoundries for its green field start up of 300mm Manufacturing Site, Fab8, Malta, NY, USA. In 2013 he took over a managerial position at Globalfoundries Fab1, Dresden, Germany. From 2016-2023 Mr. Drescher joined X-FAB. After managing Semiconductor Fabs in Dresden and Corbeil-Essonnes, France, he served as VP Operations in X-FAB’s corporate management. Dirk is active in the board at Silicon SaxonyHe holds a diploma in Physics from Dresden Technical University and a PhD in Experimental Physics from the Technical University Chemnitz.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Michael Woittennek
CEO of X-FAB Dresden
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Michael Woittennek has 20 years of experience in the semiconductor industry. After his master’s degree in Physical Engineering at University of Applied Science in Zwickau he started his career in semiconductor industry. From 2005 until 2016 he worked in various roles in process engineering and project management in the field of automotive mixed signal CMOS manufacturing and development at X-FAB. In 2017 he started his management carrier in photolithography fostering transition to higher automation in a brown field fab environment. Followed by various responsibilities in the operations management of the site until end of 2022. Since 2023 he responsible as CEO of X-FAB Dresden GmbH & Co KG.
Company Profile
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
Edoardo Merli
SVP and GM of Business Group Wide Band Gap, IGBT & Modules
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Edoardo Merli, SVP and GM of Business Group Wide Band Gap, IGBT & Modules, is a highly accomplished executive with 30+ years in high-tech and automotive industries.
He brings a solid experience on semiconductors, both in automotive and industrial/consumer domains.
Before joining Nexperia, he was EVP and GM of Power Transistor SubGroup in STMicroelectronics.
His previous assignments included automotive processors and infotainment, communications, RF and -the latest one- Power Technologies.
Edoardo holds a BA in Engineering (B. Eng.), Electrical, Electronics and Communications Engineering from University of Bologna in Italy.
Company Profile
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Rodney Pelzel, Ph.D.
CTO & COO
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Dr. Rodney Pelzel is the Chief Technology Officer at IQE, the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry
Rodney has over 20 years of experience in the semiconductor industry, with deep expertise in semiconductor materials engineering and the epitaxial growth of compound semiconductors. Rodney joined IQE as a Production Engineer in 2000 and during his first twelve years at IQE he held various engineering and operational management roles focusing on scaling leading edge epitaxial technology for high volume manufacturing for wireless applications.
In 2012, Rodney was appointed as head of R&D for the IQE Group and was tasked with creating unique materials solutions that enable IQE’s customers and provided them with a competitive edge. Throughout his career, Rodney has been involved in numerous new product introductions, including IQE’s highly successful launch of 6” VCSELs for consumer applications.
Rodney is a chemical engineer by training and graduated from the University of Colorado in 1995 with a bachelor’s degree (high distinction) in Chemical Engineering and a PhD in Chemical Engineering (surface chemistry of semiconductors, GaAs and Si) from the University of California in 2000. He is a Chartered Engineer, Chartered Scientist, and a Fellow of the Institution of Chemical Engineers, with his work widely published and a co-inventor of 30+ patents.
Company Profile
IQE is the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry that enable a diverse range of applications across mobile handsets, global telecoms infrastructure, smart connected devices, electric vehicles, infrared and sensing applications.
Ajay Poonjal Pai, Ph.D.
Director, Head of WBG Innovation & Application Engineering
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Dr.-Ing. Ajay Poonjal Pai obtained his B. Tech in Electrical & Electronics Engineering from NITK Surathkal, India and M.Sc. in Electrical Power Engineering from RWTH Aachen University, Germany. He then pursued his PhD focusing on Silicon Carbide (SiC) power semiconductors for automotive traction inverter applications at the Friedrich Alexander University (FAU), Erlangen-Nuremberg, Germany. From 2015 to 2023, he worked at Infineon Technologies AG, Germany as a Principal Engineer responsible for next-generation automotive SiC technologies and power modules. Since May 2023, he is working at Sanan Semiconductor Munich, where he is responsible for building and growing the Wide Bandgap (WBG) Innovation and Application engineering organization. His research interests include e-mobility, SiC semiconductors, power modules and power electronics, and has contributed to numerous invited lectures and conferences worldwide.
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Christophe Maleville, Ph.D.
Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation
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Christophe Maleville has been appointed Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation.
He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer from R&D to production, and managed customer certifications. He also served as vice president, SOI Products Platform at Soitec, working closely with key customers worldwide.
Maleville has authored or co-authored more than 30 papers and also holds some 30 patents. He has a PhD in microelectronics from Grenoble Institute of Technology and obtained an executive MBA from INSEAD.
Company Profile
Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.
Denis Marcon, Ph.D.
General Manager and SVP
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Denis Marcon received a M.S. degree from the University of Padova in 2006. Subsequently, he received the degree of Doctor in Engineering (Ph. D.) from the Catholic University of Leuven and imec with the thesis entitled “Reliability study of power gallium nitride based transistors” in 2011. He is leading author or co-author of more than 50 journal papers or international conference contributions.
After his Ph.D. graduation, he has been leading projects aiming to develop GaN HEMTs for several applications (RF and power switching). Thereafter, he has joined the business development team of Imec where he was directly responsible for the partnerships with imec in the field of GaN power electronics as well as on dedicated development and manufacturing of Si-based devices, MEMS, sensors and micro-systems,
Today he is the General Manager of Innoscience Europe (subsidiary of Innoscience) and he is directly responsible for Innoscience’s GaN business in Europe.
Company Profile
Innoscience (HKEX:02577.HK) is the global leader in gallium nitride process innovation and power device manufacturing. Innoscience’s device design and performance set the worldwide standard for GaN, and the culture of continuous improvement will accelerate GaN performance and market adoption. The company’s gallium nitride products are used in multiple low, medium and high voltage applications, with GaN process nodes covering 15V to 1200V. Wafers, discrete devices, integrated power ICs, and modules provide customers with robust GaN solutions. With 800 patents granted or pending, Innoscience’s products are known for reliability, performance, and functionality within the fields of consumer electronics, automotive electronics, data centers, renewable energy and industrial power. Innoscience creates a bright future for GaN. Please visit www.innoscience.com for more information.
Innoscience’s Gallium Nitride products are used in multiple low, medium and high voltage applications, with GaN process nodes covering 15V to 1200V. Wafers, discrete devices, integrated power ICs, and modules provide customers with robust GaN solutions.
Ralf Bornefeld
SVP Business Unit Power Semiconductors & Modules
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Ralf Bornefeld is Senior Vice President with responsibility for the business unit Power Semiconductors & Modules at Bosch.
Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.
Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.
Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
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