Keynote Speaker
Gustav Kalbe
Acting Director in Directorate C “Emerging and Enabling Technologies”
Day 2 / 09:10 - 09:30
Company Profile
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
Keynote Speaker
Stefan Obersriebnig
SVP High Voltage Modules
Day 2 / 11:30 - 11:50
Stefan Obersriebnig is Senior Vice President and global business responsible for Infineon Technologies’ automotive module business. During his tenure in various senior-management roles within Infineon, he has had a strong focus on driving the adoption of new Wide-Bandgap devices in the automotive, industrial, and consumer space.
Before joining Infineon, Stefan worked at Siemens Management Consulting in Germany, USA, and lastly as Principal for 3 years in China. He focused on international growth, organizational transformation & cultural change, as well as turnaround & restructuring.
Stefan holds an MBA from IESE Business School (Spain) and a MSc (Honors) in Environmental Engineering from Leoben University (Austria). With his deep connection to nature and the environment, Stefan is passionate about driving Decarbonization & Digitalization for Infineon’s customers.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Keynote Speaker
Francesco La Via
Research Director
WBG Pilot Line
Day 3 / 08:45 - 09:05
In this talk the motivations, the structure, the services, the new devices developed in the WBG Pilot line will be presented.
Francesco La Via was born in Catania, Italy, in September 1961. He received the M.S. degree in physics from Catania University, Catania, Italy, in 1985. From 1985 to 1990, he had a fellowship at STM, Catania. In 1990, he joined the CNR IMM in Catania as a researcher. During this time, he was a Visiting Scientist at Philips NatLab, Eindhoven, The Netherlands. In 2001 he became senior researcher of the CNR IMM and he is responsible of the research group that work on the new metallization schemes for silicon and silicon carbide. From 2003 he is responsible of the division of CNR-IMM that developed new processes for silicon carbide epitaxy and hetero-epitaxy. From 2020 he become Research Director. He is responsible of several industrial research projects and coordinator of two European projects: CHALLENGE (http://h2020challenge.eu/) and SiC Nano for picoGeo (http://picogeo.eu/). Now is the coordinator of the Wide Band Gap Pilot Line. In this period, he has published more than 350 papers on JCR journals and 4 edited books. He has presented several invited contributions to international conferences and has organized several conferences and tutorials. He has 6 patents on SiC technology and growth. The main research interests are in the field of silicon carbide growth, power devices, detectors and MEMS.
Company Profile
The Institute for Microelectronics and Microsystems (IMM) was established in Sept. 2000, by merging the Institute for Methodologies and Technologies for Microelectronics (IMETEM, Catania), the Institute for Chemistry and Technology of Materials for Electronics (LAMEL, Bologna), the Project Sensors and Microsystems (PSM, Rome) and the Institute for the Study of New Materials for Electronics (IME, Lecce). In 2010 two additional sections joined IMM: the Materials and Devices for Microelectronics Lab (MDM, Agrate Brianza) and the centre for Materials and Technologies for Information and Communication and Solar energy (MATIS, Catania).
Speaker
Frank Bösenberg
Managing Director
Day 2 / 08:55 - 09:05
Company Profile
Speaker
Pietro Scalia
Head of Power System Marketing and Architecture
Datacenter Trends and Power Architecture evolution
Day 2 / 13:25 - 13:45
Datacenters are in big disruption with AI proliferation, introducing very fast product cycles. Power consumption at the xPU is increasing dramatically (multi-kW), bringing the total power in the rack up to several hundreds kW to 1MW.
For this reason, conventional architecture of power distribution inside the rack, based on 48V intermediate Bus generated from the AC main, needs to be modified to manage this dramatic increase of power. Current structure of the rack and architecture cannot manage the power increase without incurring in huge distribution losses.
A higher Voltage DC Bus is getting introduced by the Hyperscalers, and supported in R&D by the OEMs and PSU suppliers. This will be generated in an external side-car rack starting from the main AC, while the computational rack will be supplied by this voltage and will contain all the GPUs, or TPUS required to increase the computational performance of the AI infrastructure. The new isolated topologies involved in this high Voltage DC Architecture will require many high voltage switches, especially GaN will be extremely useful, since of the capability to switch extremely fast, and as a consequence enable a smaller size and high power density required by the huge power level of these new Racks. On the low voltage side to generate the intermediate 48V to reuse the existing ecosystem, both Silicon MOSFETs or GaN HEMT can be alternatives to achieve the performance and size requirement.
Other challenges have to be resolved also at lower voltage, where the current required by the GPU will also increase, with values that trend to a few kW. This requires to deliver the power to the load in unconventional ways, with vertical delivery, from the opposite side of the SoC, in the aim to reduce distribution losses. This vertical power delivery (VPD) can be implemented by discrete solutions, or more integrated modular approaches to reduce size and parasitics, integrating inductors and capacitors together with active elements. Renesas is able to supports all these new architectural elements, leveraging its GaN and Si switches portfolio, together with digital controllers for IBC and Multiphase, drivers, and digital and analog PoL and BMS controllers.
Pietro Scalia is the Head of System Application and Marketing for Power at Renesas Electronics. His team localized in the three regions is defining and supporting power system solutions for all the market segments, leveraging the entire Power portfolio and addressing new market trends and power architectures.
At onsemi (2021-2023) he lead the Munich Application and PLM team of Automotive EV-Traction Solutions, to define and develop SiC and Si Power Module and Bare DIE portfolio. Previously he worked 11 years at TI, with worldwide Business Development responsibilities on Power products with application focus swinging from Automotive market sector to Telecommunications and Cloud, leveraging his earlier career in Siemens, Ericsson, ST Microelectronics and Academia.
Company Profile
Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.
A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Speaker
Dominic Dorfner, Ph.D.
President & CEO
Headline: Design Smarter, Move Faster: Leveraging Simulation to Unlock SiC’s Potential in Industrial Power Modules
Day 2 / 14:15 - 14:35
Silicon Carbide is redefining efficiency and power density in industrial and renewable power systems. Today, SiC is mainly used in applications like solar and battery energy storage. New chip voltage levels beyond the 2kV simplify and shrink designs. At Semikron Danfoss, our edge lies in combining advanced packaging with simulation-driven design. Virtual prototyping – based on full electromagnetic models for our power modules – allows us to simulate and optimize chip placement, wire bonding, current balancing, and switching behaviour including short-circuits from the earliest design phase. This accelerates development and ensures robust, application-ready modules.
The SEMITRANS 20 2kV SiC exemplifies this approach. Backed by our proven packaging toolbox – including soldering, sintering, Al/AlCu wire bonding, the bond buffer and thermally advanced materials – we are ready to scale SiC performance into industrial sectors like wind power, where reliability and efficiency are paramount.
PhD in Semiconductor Physics, Executive Education at INSEAD
P&L responsibility as Managing Director and Business Unit leader
Electrifying the world via Automotive & Industrial Power Modules
Management consulting with focus on Engineered products & HighTech
Experience
Semikron Danfoss: SVP and Head of Division Automotive since June 2023
Heading the global Division Automotive at Semikron Danfoss.
Full P&L responsibility incl. Sales, Business Development, Product and Project Management, Research & Development, Production / Supply-Chain, Quality, Controlling and HR.
Product scope: Power Modules for Automotive and Commercial Vehicle applications.
Semikron Danfoss: SVP and Head of Division Solutions & Systems Sept 2022 -June 2023
Heading the global Division Solutions & Systems at Semikron Danfoss (after merger).
Full P&L responsibility incl. Sales, Business Development, Product and Project Management,Research & Development, Production / Supply-Chain, Quality, Controlling and HR.
Product scope: Power Electronics Systems for Industrial and Automotive for multiple applications incl. Solar, Wind, Commercial vehicles, Material handling, Charging, Storage, Motor drives, and more.
Danfoss Silicon Power: VP and Head of Business Unit Industry & Renewables May 2021 – Sept 2022
Heading the global Industry & Renewables Business Unit at Danfoss Silicon Power (prior merger).
Product scope: Semiconductor Power Modules and Systems for multiple industries including Solar, Wind, Motor drives, Healthcare and more.
Fraunhofer Institute ISIT: Member of the Advisory Board since February 2022
Part of Advisory Board (Kuratorium) Frauenhofer Institute for Silicon Technology in Itzehoe.
Voith Turbo: Senior Vice President / Head of International Plants April 2017 – April 2021
Heading international production plants in China, India, Germany and the “Value Chain” team(localizations & Task-Forces). Located in Shanghai / China, Board-member in India.
Responsibility includes Supply-Chain Management, Production and Assembly, Quality, Industrial Engineering, Logistics, HSE. Overall size: >350m€ Sales, >1,000 FTE. Report to COO Voith Turbo.
Product scope: Rail gearboxes, couplers, front-noses, commercial vehicle components such as retarders, industrial gear-boxes and couplings – New built and Service.
Voith Turbo Schneider Propulsion GmbH & Co KG: Managing Director Nov 2015 – April 2017
Managing Director / Geschäftsführer of the Voith Turbo Business Unit “Marine”; global responsibility for Sales, R&D, Engineering, Operations, Service and Finance & Admin. Report to CEO Mobility
Voith Turbo: Senior Vice President Business Development Nov 2014 – Nov 2015
Head of Voith Turbo Business Development / Strategy and “VT 2020” (program to regain growth and increase competitiveness across business units and regions). Team size of 15 employees. Report toCEO Voith Turbo
Voith GmbH: Project Manager Corporate Development July 2014 – Oct 2014
Project Manager in the Voith Corporate Development team
Roland Berger Strategy Consultants: Senior Project Manager Jan 2009 – June 2014
Competence Center (Industry focus): Engineered Products & HighTech
Expertise: Corporate & business development, growth strategies / M&A, Sales-up initiatives, Operations / performance improvements, Turn-around
Global coverage: Germany, US, Italy, Netherlands, Austria, France, UK, Eastern Europe Member of the “Challenge Club” (internal leadership program for Top-performer)
Generation next Consulting Aug 2006 – Dec 2007
Founder and Managing Director of generation next consulting (during study / PhD time) Consulting company executing projects with focus on the process from idea creation to aninnovative product
Company Profile
Semikron Danfoss is a global technology leader in power electronics. Our product offerings include semiconductor devices, power modules, stacks and systems.
In a world that is going electric, Semikron Danfoss technologies are more relevant than ever. With our innovative solutions for automotive, industrial and renewable applications we help the world utilize energy more efficiently and sustainably and thus to significantly reduce overall CO2 emissions – facing one of the biggest challenges today.
We take care of our employees and create value for our customers by investing significantly in innovation, technology, capacity, and service to deliver best-in-industry performance and for a sustainable future.
Speaker
Giorgia Longobardi, Ph.D.
Founder and CEO
Day 2 / 13:50 - 14:10
Dr. Giorgia Longobardi, CEO of CGD, is an experienced engineer with international practice working on GaN power devices design and characterisation. As the inventor of high impact patents in the field of GaN power devices, Giorgia made the unique blend of academic and business know-how one of her biggest strengths.
During her PhD in power devices at Cambridge University, Giorgia worked on international projects with top semiconductor companies, through which, she learned about different cultures operating in this field and gained experience managing and budgeting multi-partner projects. Curious and knowledgeable, Giorgia leads an experienced diverse team of passionate people working with enthusiasm and continuous drive to do things better. She never forgets why she founded CGD: to change how energy is used and protect the environment with efficient power electronics.
She is a member of the energy management committee at PSMA (power Sources manufacturers association) and Strategic Advisory Board at the Henry Royce Institute for materials.
Company Profile
A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.
Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.
In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.
Speaker
Thomas Heinzel
Head of Semiconductor Technical Division
Advanced low inductance SiC Power Module with 3D wiring technology
Day 2 / 14:40 - 15:00
An advanced 3D Wiring technology has been developed to increase the power density of modules equipped with silicon carbide (SiC) for electric vehicle (xEV). Applying the multi layer 3D wiring technology with copper pin-terminals demonstrates about twice the power density of a conventional copper clipped wiring structure. The ⊿Tvj power cycling lifetime of power modules with the developed 3D wiring technology is approximately five times longer than the conventional copper clipped wiring.
1988 Graduation in Electrical Engineering at DHBW Mannheim
1988-1998 ABB, Mannheim (Traction Division)
• Development of a control unit for a 3-level 3-phase Inverter including the control pattern and PLD algorithm.
• Development and commissioning of a 60 kVA 3-level-Transistor-Inverter for Light Rail Vehicles
• Conception and development of a new Auxiliary Inverter System for Railways
• Project Management of the Auxiliary Inverters at Adtranz, Mannheim
1998 : Fuji Electric Europe GmbH
• Start an Application support for the all Power Semiconductor Customers in the EMEA Sales area
• Build a technical support Team including quality analysis function
• Manager of the technical Department of the Semiconductor Division
• Implementation of a R&D team for EU customers
Since Dec 2021 :
• Head of Semiconductor Technical Division
Company Profile
Fuji Electric specializes in electrical and thermal power engineering, delivering innovative solutions that promote sustainability and energy efficiency. We help customers significantly reduce energy consumption and minimize their carbon footprint with environmentally responsible technologies.
Since 1987, Fuji Electric Europe has been a trusted partner across Europe, the Middle East, and Africa. We’re proud to be a leader in high-performance power semiconductors for automotive and industrial applications. Our extensive product range includes MOSFET devices, diodes, and power semiconductor modules for energy-saving electronics, along with control ICs for high-efficiency power supplies. This ensures we provide reliable, customized solutions for energy-intensive industries, contributing to a more sustainable future.
For years, our power semiconductors powered electric drives (like frequency converters and servo drives) and uninterruptible power supplies (UPS). This built our reputation for outstanding quality, high reliability, and cutting-edge technology.
Today, our application portfolio is rapidly expanding into exciting new areas: renewable energy (wind and solar), hybrid/electric vehicles, smart grids for energy supply, and traction systems. Each new application demands innovative, efficient, and durable solutions of the highest quality.
Our state-of-the-art production facilities across front-end, back-end, and warehousing ensure we can supply our growing global customer base with power semiconductors. This guarantees flexible product availability and an excellent price-performance ratio.
Our latest 7th IGBT generation (X series) is now rolling out, seamlessly replacing older products. These new devices offer both electrical and mechanical compatibility while significantly reducing losses, pushing the boundaries of efficiency.
Speaker
Ladislav Sobotka, Ph.D.
Director of Engineering and R&D
HIGH-TECH HV IGBT AND SIC MODULES FOR RAILWAY APPLICATIONS
Day 3 / 13:40 - 14:00
Joint Collaboration Presentation
An example of vertical solution implementation through partnership is described in this presentation using rail applications. ŠKODA ELECTRIC and HITACHI ENERGY collaborate on applying high-voltage IGBT semiconductors in various module platforms, including newest LinPak IGBT modules for serial usage in traction converters with a 3 kV DC power supply system. In recent years, the ŠKODA GROUP has been intensively developing hybrid dual-system trains with battery drive for a range of 80-120 km on non-electrified lines. A necessary condition for BEMU is the development of a high-tech DC-DC converter with galvanic isolation of 10 kV and a continuous power of 800 kW. Given the weight of LTO batteries, emphasis was placed on minimum weight and installation dimensions and high efficiency of the converter. This clearly leads to the choice to adopt on power semiconductor side SiC technology both on the 800 V traction battery side and on the 3 kV DC traction converter side. Therefore, the partnership with Hitachi Energy was used to develop a SiC module for a voltage of 3.3 kV with an insulation voltage of 10.2 kV. The development of this semiconductor took place in parallel with the development at ŠKODA ELECTRIC converter development over the last couple of years, leading to the stage that as of today 4 BEMU trains are in operation on Czech Railways and these SiC based semiconductors work absolutely reliably, and were the key enabler for this new train platform. As a further step into performance of this train platform, based on the experience with another SiC Powermodule, the RoadPak SiC, for electric buses, there is now the development of a traction inverter for BEMU trains with these SiC modules with parameters of 1200V and the record current of 1150A for powering asynchronous traction motors with a continuous power of 340 kW. The development of power SiC modules and their application in railways allows to come up with ecological solutions for modern trains and significantly reduce the environmental burden and increase the comfort of passengers on the railway. European cooperation between two major companies is a best practice example of this.
Ladislav is the Director of Development and Engineering at ŠKODA ELECTRIC, part of the ŠKODA Group. He joined Skoda in 1982 to develop electric locomotives, where he worked on traction drives. In 1996 he developed a new traction drive for the City Elephant double-decker unit (3 kV DC supply system ) with new HV IGBT transistors and a double star asynchronous traction motor. He also worked extensively on the development of trams and subway vehicles. He has been in the management of ŠKODA TRANSPORTATION since 1994, and in the following years he served as Technical Director and member of the Supervisory Board of ŠKODA TRANSPORTATION. In 2003, he founded ŠKODA ELECTRIC and was a member of the Board of Directors in charge of the technical departments. At ŠKODA ELECTRIC, he has been involved in a number of foreign projects, such as a traction drive for locomotives for Turkey in cooperation with the Korean company Hyundai-Rotem and a groundbreaking traction drive for a subway train for the Chinese city of Suzhou. Ladislav works very intensively with universities and is a member of three scientific councils. Since 2015 he has been working on SiC semiconductors and high efficiency traction drives.
Company Profile
We are Škoda Electric, belonging to the Škoda Group. We continue in the tradition of the one hundred and sixty-year tradition of Škoda plants and we are an experienced manufacturer of traction drives and motors for locomotives, trams, EMU, metro, mining vehicles.
About us | Škoda Group a.s. (skodagroup.com)
Speaker
Rainer Kaesmaier, Ph.D.
Managing Director Semiconductors
HIGH-TECH HV IGBT AND SIC MODULES FOR RAILWAY APPLICATIONS
Day 3 / 13:40 - 14:00
Joint Collaboration Presentation
An example of vertical solution implementation through partnership is described in this presentation using rail applications. ŠKODA ELECTRIC and HITACHI ENERGY collaborate on applying high-voltage IGBT semiconductors in various module platforms, including newest LinPak IGBT modules for serial usage in traction converters with a 3 kV DC power supply system. In recent years, the ŠKODA GROUP has been intensively developing hybrid dual-system trains with battery drive for a range of 80-120 km on non-electrified lines. A necessary condition for BEMU is the development of a high-tech DC-DC converter with galvanic isolation of 10 kV and a continuous power of 800 kW. Given the weight of LTO batteries, emphasis was placed on minimum weight and installation dimensions and high efficiency of the converter. This clearly leads to the choice to adopt on power semiconductor side SiC technology both on the 800 V traction battery side and on the 3 kV DC traction converter side. Therefore, the partnership with Hitachi Energy was used to develop a SiC module for a voltage of 3.3 kV with an insulation voltage of 10.2 kV. The development of this semiconductor took place in parallel with the development at ŠKODA ELECTRIC converter development over the last couple of years, leading to the stage that as of today 4 BEMU trains are in operation on Czech Railways and these SiC based semiconductors work absolutely reliably, and were the key enabler for this new train platform. As a further step into performance of this train platform, based on the experience with another SiC Powermodule, the RoadPak SiC, for electric buses, there is now the development of a traction inverter for BEMU trains with these SiC modules with parameters of 1200V and the record current of 1150A for powering asynchronous traction motors with a continuous power of 340 kW. The development of power SiC modules and their application in railways allows to come up with ecological solutions for modern trains and significantly reduce the environmental burden and increase the comfort of passengers on the railway. European cooperation between two major companies is a best practice example of this.
Dr. Rainer Kaesmaier is leading the semiconductor business of Hitachi Energy with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes and SiC for market segments such as energy transmission & distribution, transportation & rail, renewables, industry and eMobility. Rainer is a semiconductor industry veteran having held various management and executive positions in the sector for close to 30 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing. After stations at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, he assumed 2018 the responsibility for the global semiconductor business of Hitachi Energy. In addition to that, Rainer is since 2019 also member of the management board for Hitachi Energy Switzerland. He was a member in various industries strategy committees in Europe and the US, and currently in the advisory board for International Semiconductor Industry Group (I.S.I.G.). Rainer holds a Master’s degree in Physics from the Technical University Munich and a PhD in Physics from the University Kassel in Germany. He is based in Lenzburg near Zurich, Switzerland.
Company Profile
We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.
Speaker
Milan Rosina, Ph.D.
Principal Analyst, Power Electronics & Batteries
Market outlook and technology trends for power devices in xEV and beyond
Day 3 / 14:30 - 14:50
The global transition toward sustainable transportation is accelerating the adoption of electrified vehicles (xEV), creating significant opportunities in the power electronics sector. Despite challenges such as high vehicle costs, geopolitical dependencies, and charging infrastructure constraints, the xEV market continues to grow, driven by long-term trends in decarbonization and electrification. This presentation will provide an in-depth analysis of the power semiconductor market for xEV applications, with a focus on Silicon, Silicon Carbide (SiC), and emerging Gallium Nitride (GaN) devices. The complex dynamics of IGBT vs. SiC choices in automotive designs will be explored, alongside the implications of cost-performance tradeoffs and supply chain dependencies. Beyond passenger EVs, the electrification of rail transport and electric aircraft also presents promising markets for power devices. Key market figures, technical innovations, and strategic collaborations—including with Chinese players—will be discussed to provide a comprehensive overview of the evolving power electronics landscape in mobility.
Dr. Milan Rosina is Principal Analyst, Power Electronics & Battery, at Yole Group (Yole). Dr. Rosina has 20+ years of experience due diligence, technology, and market surveys in the fields of renewable energies, xEV, EV chargers, energy storage, batteries, power electronics, thermal management, and innovative materials and components. Dr. Rosina received his Ph.D. degree from National Polytechnical Institute (Grenoble, France). He previously worked for the Institute of Electrical Engineering in Slovakia; Centrotherm in Germany; Fraunhofer IWS in Germany; CEA LETI in France; and the French utility company ENGIE.
Company Profile
Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.
Speaker
Manuel Gaertner
Director Wide Band Gap & Electrification
Session info not yet published.
Manuel Gärtner joined STMicroelectronics Munich in 1999 and is Director of wide bandgap & Electrification for automotive applications. He has worked as a development engineer for smart power products and as a research engineer at the university of Berlin and in the Fraunhofer Institute ISiT in Berlin. He has published over 50 articles and conference speeches on automotive power electronics and holds several patents. He is member of the EEHE Scientific Advisory Board, the SIA POWER TRAIN & ELECTRONICS scientific committee for Power Electronics, Member of Technical Program committee for CIPS 2026, and he represents STMicroelectronics as principal partner and is Member of the Board of Directors in ECPE.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Keynote Speaker
Kai Konrad
Director Global Semiconductor Purchasing
Power Modules at the Crossroads: Enabling Scalable EV Innovation
Day 2 / 11:55 - 12:15
Power modules are a key enabler in EV inverter systems—impacting thermal performance, reliability, and serving as the foundation for mechatronic integration. While the efficiency of electric vehicles is primarily driven by semiconductor technology, power modules play a crucial role in realizing that potential at the system level. The market of module manufacturing is highly fragmented, with IDMs, Tier 1s, OSATs, and new entrants each pursuing different business models. This presentation explores how the industry can evolve toward more collaborative and scalable approaches—aligning innovation, integration, and value creation to support the next generation of electric mobility.
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Kai Konrad leads Global Semiconductor Purchasing at Stellantis, drawing on over 20 years of experience in the semiconductor and automotive industries. His career spans roles in product and system marketing, innovation management, and supplier relations at companies like Infineon and Renesas. In 2019, he transitioned from marketing to procurement, bringing a strategic and cross-functional perspective to semiconductor sourcing. Passionate about transformation, innovation and collaboration, Kai is committed to shaping resilient, future-ready supply chains that support the evolution of sustainable mobility.
Company Profile
Speaker
Oliver Whear
Director of Semiconductor Technology
Strain Relief of Silicon Carbide (4H-SiC) Substrates by Wet Etching
Day 2 / 17:30 - 17:40
In this work we demonstrate strain relief etching using an advanced chemical etching (ACE) process of the full wafer surface on commercial grade n-type 4H-SiC at production throughputs (μm’s/hr). The data shows >4x improvement of breakage strength in laser split wafers. Warp and bow of ground wafers is reduced to match wafers that have been CMP processed showing the potential of stronger, flatter wafers being available for chemical mechanical polishing.
Strain relief etching is a critical wet process technique use in high volume manufacturing of semiconductor substrates and device wafers. The goal of a strain relief etch is application dependent but can generally be considered for removal of warp/bow or improving mechanical strength by removing sub-surface damage thereby optimizing yields. Silicon Carbide (SiC) has a high chemical resistance which has blocked the manufacturing community from using strain relief etching to date.
Without an effective wet etch, the SiC substrate manufacturing community has resorted to expensive mechanical techniques for the polishing and thinning of wafers, which imparts significant stress and strain within the layer. Use of extensive mechanical techniques is also expensive and difficult to perform at volume where wafers are fragile early in the substrate manufacturing line. Research has explored mechanisms of wet etching for creating microstructures on 4H-SiC and trenches in 6H-SiC.
Oliver Whear is an 11 year industry veteran working at several points in FEOL manufacturing on metrology, deposition and wet process. He started as an applications scientist before moving in to project management and his current role as Director of Semiconductor Technology at RENA Technologies. Oliver is an expert at developing new manufacturing technologies based on challenges foreseen by industrial roadmaps and market strategy.
- Master of Science by research, Physics – University of York
- Committee Member – Semiconductor Standards (EPL/47)
- Member – Compound Semiconductor Materials Work Group
- 11 years of industry experience in FEOL manufacturing on metrology, deposition and wet process of advanced 300mm logic, 300mm memory, 2D materials and compound semiconductors.
- Former Product Manager at AIXTRON SE in MOCVD solutions for 2D Materials including graphene, boron nitride and transition metal dichalcogenides. + Former Product Manager at Bruker for HRXRD solutions of Compound Semiconductors.
- Expert at developing new manufacturing technologies based on challenges foreseen by industrial roadmaps and market strategy
Company Profile
Founded in 1993, RENA Technologies has established itself as a global leader in mechanical and process engineering, for a diverse range of industries. We specialize in providing cutting-edge wet processing solutions for the semiconductor, solar, additive manufacturing, glass, and medtech industries.
A key area of expertise is wet chemical immersion, spray and single wafer processes for the manufacturing of semiconductors. With over 1,100 systems installed worldwide, our technology is trusted by manufacturers around the globe to enhance efficiency and production quality.
RENA Technologies employs approximately 1,000 professionals worldwide, all dedicated to innovation and excellence in our field. Headquartered in Gütenbach, Germany, and manufacturing sites in Albany, OR and Wykroty, Poland, we continue to drive advancements in process engineering, ensuring our customers receive the highest quality solutions for their manufacturing needs.
On top we provide worldwide onsite service support with over 150 Experts in 20 locations globally to ensure flawless installation and operation of our tools.
RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes like etching, stripping, cleaning or drying. RENA offers proven standard machines as well as customer-specific solutions and process support.
Speaker
David Clark
VP Product Marketing
Innovative Packages, Big Power: The Rise of Advanced Power Packaging
Day 3 / 14:05 - 14:25
David joined Amkor in 2013 and is currently responsible for Global Product Marketing, Market Analytics and Market Strategy. Before joining Amkor, David had held various sales management, product development and engineering positions at FlipChip International (FCI), Leica Microsystems and Agilent Technologies. David has been granted five patents in Optoelectronics and Device Packaging and holds a BEng Honours Degree in Electronic, Electrical, and Optoelectronic Engineering from the University of Glasgow.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Speaker
Prof. Jörg Schulze
Institute Director
Day 3 / 09:10 - 09:30
Company Profile
As one of 76 institutes of the Fraunhofer-Gesellschaft, the IISB conducts research for customers from industry or within the framework of publicly funded projects. The aim is to develop excellent solutions for our partners as one of the leading research institutions in the field of power electronics and to set new technological standards. Central fields of application are electromobility, aerospace, and sustainable energy supply.
The institute offers broad expertise in wide-bandgap semiconductors and high-efficiency power electronics. Device know-how merges here with complex system development. For silicon carbide (SiC), the institute has the complete technological process chain at its disposal – starting with materials, via components and modules, all the way to integration in power electronic systems.
Panel Moderator
Mike Rosa, Ph.D.
CMO & SVP Strategy
Panel Session: Optimizing Fab Operations
Day 3 / 11:30 - 12:30
Mike Rosa is chief marketing officer (CMO) and senior vice president responsible for strategy at Onto Innovation. Prior to his current role, Mike served as CMO for Applied Materials ICAPS and Advanced Packaging Groups, where he was responsible for leadership of strategic and technical marketing, marketing communications, charting device segment inflection roadmaps and providing strategic business development support toward M&A activities. He has over 25 years’ experience in semiconductor engineering and technology, with roles that span device design and fabrication, equipment development, marketing and sales. His technical qualifications include B.Eng. (Hons) and Ph.D. degrees in Microelectronic Engineering and an MBA with dual majors in Marketing and Business Strategy. Mike has authored over 40 journal and conference publications and holds over 29 U.S. patents
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Panel Moderator
Aly Mashaly
Technical Director
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Aly Mashaly is a renowned expert in power electronic systems and power semiconductors, with over 20 years of experience in the electronics industry. He holds several patents in the field and is a keynote speaker at numerous international conferences. Aly studied Electrical Engineering with a focus on Power Electronics at Ain Shams University in Cairo. In late 2002, he moved to Germany to pursue his master’s degree at the University of Hanover. He began his career as a pioneer in the early development of power electronic systems for avionic applications and later shifted his focus to advancing power electronics in the electric vehicle market. In his current role as Technical Director at ROHM Semiconductor Europe, Aly has played a key role in driving the company’s vision to establish itself as a global player in the field of power devices.
Company Profile
ROHM, a leading semiconductor and electronic component manufacturer, was established in 1958. From the automotive and industrial equipment markets to the consumer and communication sectors, ROHM supplies ICs, discretes, and electronic components featuring superior quality and reliability through a global sales and development network. Our strengths in the analog and power markets allow us to propose optimized solutions for entire systems that combine peripheral components (i.e., transistors, diodes, resistors) with the latest SiC power devices as well as drive ICs that maximize their performance.
Panelist
Alexander Krick
Executive Vice President
Day 2 / 11:05 - 11:25
- For more than 20 years employed at Volkswagen Group
- Since 2025 – Acting Head of Technical Development & Product Management
- Since 2020 – Head of Development E-Drive, Power Electronics & Transmission
- 2019-2020 – Head of Planning- & Development Steering of the Business Unit Transmission & E-Drive
- Until 2019 – several national and international managing positions in the development environment (e.g. China)
- Dipl. Ing. Electrical Engineering (University Kassel and University of Massachusetts Dartmouth)
- Member of the Board with the FVA and VDE GMM
Company Profile
As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.
Speaker
Marc Isabelle, Ph.D.
Founder & CEO
Day 3 / 14:55 - 15:10
Marc ISABELLE, engineer & PhD in economics, is the Founder & CEO of european economics. In 15 years, Marc helped secure €37 billion of public funding for 220 projects in various industries. During his numerous interactions with the European Commission & national public authorities, Marc has contributed in co-developing the tools & best practices for public funding applications and assessment in Europe. Before starting european economics in 2009, Marc has worked for more than 15 years in economic departments of large businesses and public agencies (Total, CEA, AII, Bpifrance). He has been teaching economics at Paris Dauphine University since 1996 and has published several research papers on the economics of science and innovation. He is reviewer for the European State Aid Law Quarterly.
Company Profile
Founded in 2009, european economics is a recognised pure-player consultancy in public funding. We offer tailor made and high-value-added services across Europe to help our clients design and implement turn-key public funding solutions – State aid & European funding – for their strategic projects:
– 37 B€ public funding secured for 220 projects; of which 7.9 B€ in 2023.
– 100 % success rate for State aid notifications to the European Commission.
We support our clients with a turn-key approach at every step of their project’s life-cycle: funding strategy definition, application file preparation (at National & EU level), European Commission validation process, and funding monitoring.
Panelist
Ajay Poonjal Pai, Ph.D.
Director, Head of WBG Innovation & Application
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Dr.-Ing. Ajay Poonjal Pai obtained his B. Tech in Electrical & Electronics Engineering from NITK Surathkal, India and M.Sc. in Electrical Power Engineering from RWTH Aachen University, Germany. He then pursued his PhD focusing on Silicon Carbide (SiC) power semiconductors for automotive traction inverter applications at the Friedrich Alexander University (FAU), Erlangen-Nuremberg, Germany. From 2015 to 2023, he worked at Infineon Technologies AG, Germany as a Principal Engineer responsible for next-generation automotive SiC technologies and power modules. Since May 2023, he is working at Sanan Semiconductor Munich, where he is responsible for building and growing the Wide Bandgap (WBG) Innovation and Application engineering organization. His research interests include e-mobility, SiC semiconductors, power modules and power electronics, and has contributed to numerous invited lectures and conferences worldwide.
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Panelist
Ralf Bornefeld
SVP Business Unit Power Semiconductors & Modules
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Ralf Bornefeld is Senior Vice President with responsibility for the business unit Power Semiconductors & Modules at Bosch.
Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.
Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.
Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Panelist
Edoardo Merli
SVP WBG, IGBT & Modules
Session info not yet published
Company Profile
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Panelist
Michael Woittennek
CEO of X-FAB Dresden
Panel Session: Optimizing Fab Operations
Day 3 / 11:30 - 12:30
Company Profile
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
Panelist
Dirk Drescher, Ph.D.
Plant Manager
Panel Session: Optimizing Fab Operations
Day 3 / 11:30 - 12:30
Dirk Drescher is Plant Manager of BOSCH Semiconductor Manufacturing Dresden.
He started his career in semiconductors in 1995 as process engineer for Siemens Microelectronics Center Dresden and served in different managerial functions until 1999. In 2000 he joined Infineon’s Semiconductor 300 organization as Module Manager to help starting up the worlds first 300mm Semiconductor Manufacturing Line. In 2008 he joined Calyxo GmbH managing a thin film Solar Panel manufacturing line. 2010 Mr. Drescher joined Globalfoundries to help starting up its green field/ leading edge 300mm Manufacturing Site, Fab8, Malta, NY, USA. In 2013 he took over a managerial position at Globalfoundries Fab1, Dresden, Germany. From 2016-2023 Mr. Drescher worked at X-FAB. After managing Semiconductor Fabs in Dresden and Corbeil-Essonnes, France, he served as VP Operations in X-FAB’s corporate management.
Dirk is member of the board at Silicon Saxony
Mr. Drescher holds a diploma in Physics from Dresden Technical University and a PhD in Experimental Physics from the Technical University Chemnitz.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Panelist
Torsten Mueller, Ph.D.
Senior Director IC Technologies
Panel Session: Optimizing Fab Operations
Day 3 / 11:30 - 12:30
Dr. Torsten Müller holds a PhD in Physics and brings 25 years of expertise in semiconductor research, development, and production. Throughout his career, he has contributed to advancing Flash technology at Infineon and Qimonda, managed solar cell production at Conergy and Sovello, and led the technology development and ramp of a 28nm high-k metal gate technology at Globalfoundries. Returning to Infineon Dresden, he managed the 300mm technology transfer portfolio before taking his current role as Head of IC Technologies. With a proven track record in innovation, leadership, and operations, Dr. Müller remains a driving force in semiconductor advancements.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Panelist
Maike Mueller, Ph.D.
Head of Semiconductor Strategy & Development Power Modules
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Dr. Maike Mueller graduated in chemistry from Technical University of Munich and received her doctorate from the Humboldt University of Berlin while working at the Federal Institute for Materials Research and Testing. She started her career in the semiconductor industry as a quality and process engineer at Osram Opto Semiconductors in Regensburg. The past 11 years she has been working in various management roles within Infineon’s automotive and consumer divisions as well as procurement department. Since Oct 2024 she joined VW Group as Head of Semiconductor Strategy & Development of Power modules, Group Powerelectronics.
Company Profile
As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.
Panelist
Javier Hernandez, Ph.D.
VP Corporate Strategy
Session info not yet published
Dr. Javier Hernandez is the Vice President of Corporate Strategy at Littelfuse Inc. (Nasdaq: LFUS). With over twenty-five years of experience in the semiconductor industry, Dr. Hernandez is pivotal in shaping Littelfuse’s strategic direction and driving business development. Previously, Dr. Hernandez served as Senior Director of Mergers and Acquisitions at Littelfuse, where he led multiple initiatives for sustainable long-term growth. He has also held various positions related to business development within the semiconductor ecosystem.
Dr. Hernandez holds a Ph.D. in Engineering from the University of Navarra, an Executive MBA from IESE Business School, University of Navarra, and has completed an Executive Program on Mergers and Acquisitions (M&A) at Harvard Business School.
Company Profile
Littelfuse is a diversified industrial technology manufacturing company empowering a sustainable, connected, and safer world. Across more than 20 countries, and with approximately 17,000 global associates, we partner with customers to design and deliver innovative, reliable solutions. Serving over 100,000 end customers, our products are found in a variety of industrial, transportation, and electronics end markets—everywhere, every day. Headquartered in Chicago, Illinois, United States, Littelfuse was founded in 1927.
We work with our customers and partners to design, manufacture, and deliver innovative solutions for automotive and commercial vehicles, industrial applications,
data and telecommunications, medical devices, consumer electronics, and appliances. Everywhere, every day, our work focuses on safety and connection. We’re passionate about working with our customers and partners to sustainably create products that protect, control, and sense for a safer, greener, and more connected world.
Panelist
Roberto Antonicelli
Senior Director, Automotive BU
Panel Session: Strategic Autonomy or Global Integration? Europe’s Semiconductor Future Amid Geopolitics, Supply Chains, and China Collaboration
Day 3 / 15:15 - 16:00
Professional with over 25 years of international experience in the semiconductor and automotive sectors. Currently Senior Director at STATS ChipPAC, part of JCET Group, he has previously held leadership roles at STMicroelectronics and Infineon. He holds a PhD in Microelectronics, with a focus on semiconductor packaging and RF/microwave design. His expertise spans business development, strategic partnerships, and complex program execution, with a strong emphasis on business innovation and collaboration. Married and father of three children, he is recognized for his forward-thinking approach to advancing technology and business solutions.
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Panelist
Rodney Pelzel, Ph.D.
CTO & COO
Panel Session: Optimizing Fab Operations
Day 3 / 11:30 - 12:30
Dr. Rodney Pelzel is the Chief Technology Officer at IQE, the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry
Rodney has over 20 years of experience in the semiconductor industry, with deep expertise in semiconductor materials engineering and the epitaxial growth of compound semiconductors. Rodney joined IQE as a Production Engineer in 2000 and during his first twelve years at IQE he held various engineering and operational management roles focusing on scaling leading edge epitaxial technology for high volume manufacturing for wireless applications.
In 2012, Rodney was appointed as head of R&D for the IQE Group and was tasked with creating unique materials solutions that enable IQE’s customers and provided them with a competitive edge. Throughout his career, Rodney has been involved in numerous new product introductions, including IQE’s highly successful launch of 6” VCSELs for consumer applications.
Rodney is a chemical engineer by training and graduated from the University of Colorado in 1995 with a bachelor’s degree (high distinction) in Chemical Engineering and a PhD in Chemical Engineering (surface chemistry of semiconductors, GaAs and Si) from the University of California in 2000. He is a Chartered Engineer, Chartered Scientist, and a Fellow of the Institution of Chemical Engineers, with his work widely published and a co-inventor of 30+ patents.
Company Profile
IQE is the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry that enable a diverse range of applications across mobile handsets, global telecoms infrastructure, smart connected devices, electric vehicles, infrared and sensing applications.
Panelist
Denis Marcon, Ph.D.
General Manager
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Denis Marcon received a M.S. degree from the University of Padova in 2006. Subsequently, he received the degree of Doctor in Engineering (Ph. D.) from the Catholic University of Leuven and imec with the thesis entitled “Reliability study of power gallium nitride based transistors” in 2011. He is leading author or co-author of more than 50 journal papers or international conference contributions.
After his Ph.D. graduation, he has been leading projects aiming to develop GaN HEMTs for several applications (RF and power switching). Thereafter, he has joined the business development team of Imec where he was directly responsible for the partnerships with imec in the field of GaN power electronics as well as on dedicated development and manufacturing of Si-based devices, MEMS, sensors and micro-systems,
Today he is the General Manager of Innoscience Europe (subsidiary of Innoscience) and he is directly responsible for Innoscience’s GaN business in Europe.
Company Profile
Innoscience (HKEX:02577.HK) is the global leader in gallium nitride process innovation and power device manufacturing. Innoscience’s device design and performance set the worldwide standard for GaN, and the culture of continuous improvement will accelerate GaN performance and market adoption. The company’s gallium nitride products are used in multiple low, medium and high voltage applications, with GaN process nodes covering 15V to 1200V. Wafers, discrete devices, integrated power ICs, and modules provide customers with robust GaN solutions. With 800 patents granted or pending, Innoscience’s products are known for reliability, performance, and functionality within the fields of consumer electronics, automotive electronics, data centers, renewable energy and industrial power. Innoscience creates a bright future for GaN. Please visit www.innoscience.com for more information.
Innoscience’s Gallium Nitride products are used in multiple low, medium and high voltage applications, with GaN process nodes covering 15V to 1200V. Wafers, discrete devices, integrated power ICs, and modules provide customers with robust GaN solutions.
Panelist
Dominic Viens
VP & GM Power Test Division
Panel Session: Optimizing Fab Operations
Day 3 / 11:30 - 12:30
Company Profile
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
Contact Us
www.teradyne.com
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
- Semiconductor test systems
- Storage and system-level test systems; Defense and aerospace test instrumentation and systems; Circuit-board test and inspection systems
- Wireless test systems
Panelist
Patrick Schwarz, Ph.D.
Lab Director Power Packages
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Patrick Schwarz has studied chemistry in Regensburg, Germany where he completed his PhD in inorganic chemistry. He joined Infineon in 2011 as an engineer for reliability and analytics focusing on chip embedding technologies. 2013 he transferred from RnD to production in the area of process integration and transfer management , where he also took his first management role in 2015 as head of process integration and product engineering for laminate based packages. With the start of Infineons first molded power module Hybridpack DSC he took leadership of the ramp up management for the new platform becoming a specialist for critical new product introductions. After shifting to global productivity platform owner for preassembly within Infineon he joined Huawei as Lab Director for Power Packages in 2024.
Company Profile
Founded in 1987, Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We have approximately 208,000 employees and we operate in over 170 countries and regions, serving more than three billion people around the world. We are committed to bringing digital to every person, home and organization for a fully connected, intelligent world.
At Huawei, we have two key drivers of innovation: science and technology, and customer needs. Both commercial value and market demands are driving our innovation and determining how we invest in science and technology. Breakthroughs in technology, in return, stimulate customer needs and allow us to create greater value for customers.
In 2024, our total R&D spending reached CNY179.7 billion, representing 20.8% of our total revenue.
Our total R&D investment over the last decade now exceeds CNY1.249 trillion.
On December 31, 2024, 113,000 employees (about 54.1% of our workforce) worked in R&D.
Through years of sustained innovation in fundamental domains, Huawei has become one of the world’s largest patent holders, currently holding 150,000+.
Panelist
Matthias Bonkaß
VP Advanced Manufacturing Engineering
Panel Session: Optimizing Fab Operations
Day 3 / 11:30 - 12:30
Company Profile
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.
Panelist
Tim Maloney
Senior Director BD
Panel Session: Optimizing Fab Operations
Day 3 / 11:30 - 12:30
Company Profile
Polar Semiconductor is a U.S.-owned MN located 200mm foundry specializing in sensor and power semiconductors, for high-volume manufacturing of silicon and wide-bandgap ICs and discrete devices, and specialty products tailored for Automotive, Industrial, and Aerospace & Defense applications.
Speaker
Salah Nasri
CEO and Co-Founder
Welcome Speech
Day 2 / 08:30 - 08:50
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Speaker
Lam Research Corporation
Session info not yet published
Company Profile
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
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