Keynote Speaker
Stefan Obersriebnig
SVP High Voltage Modules
Innovation That Scales: Aligning Semiconductor Breakthroughs with Automotive Value Creation
Day 2 / 10:55 - 11:15
In today’s automotive landscape, cost pressure is relentless, and the need for fast innovation is evident. As high-voltage technologies rapidly evolve, our challenge is clear: deliver cutting-edge solutions that create tangible value for customers — without compromising on affordability or performance. It is only by aligning chip technology, package concepts, and application understanding that we can ultimately create sustainable value along the automotive value chain.
Stefan Obersriebnig is Senior Vice President and global business responsible for Infineon Technologies’ automotive module business. During his tenure in various senior-management roles within Infineon, he has had a strong focus on driving the adoption of new Wide-Bandgap devices in the automotive, industrial, and consumer space.
Before joining Infineon, Stefan worked at Siemens Management Consulting in Germany, USA, and lastly as Principal for 3 years in China. He focused on international growth, organizational transformation & cultural change, as well as turnaround & restructuring.
Stefan holds an MBA from IESE Business School (Spain) and a MSc (Honors) in Environmental Engineering from Leoben University (Austria). With his deep connection to nature and the environment, Stefan is passionate about driving Decarbonization & Digitalization for Infineon’s customers.
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Keynote Speaker
Francesco La Via
Research Director
WBG Pilot Line
Day 3 / 09:00 - 09:20
In this talk the motivations, the structure, the services, the new devices developed in the WBG Pilot line will be presented.
Francesco La Via was born in Catania, Italy, in September 1961. He received the M.S. degree in physics from Catania University, Catania, Italy, in 1985. From 1985 to 1990, he had a fellowship at STM, Catania. In 1990, he joined the CNR IMM in Catania as a researcher. During this time, he was a Visiting Scientist at Philips NatLab, Eindhoven, The Netherlands. In 2001 he became senior researcher of the CNR IMM and he is responsible of the research group that work on the new metallization schemes for silicon and silicon carbide. From 2003 he is responsible of the division of CNR-IMM that developed new processes for silicon carbide epitaxy and hetero-epitaxy. From 2020 he become Research Director. He is responsible of several industrial research projects and coordinator of two European projects: CHALLENGE (http://h2020challenge.eu/) and SiC Nano for picoGeo (http://picogeo.eu/). Now is the coordinator of the Wide Band Gap Pilot Line. In this period, he has published more than 350 papers on JCR journals and 4 edited books. He has presented several invited contributions to international conferences and has organized several conferences and tutorials. He has 6 patents on SiC technology and growth. The main research interests are in the field of silicon carbide growth, power devices, detectors and MEMS.
The Institute for Microelectronics and Microsystems (IMM) was established in Sept. 2000, by merging the Institute for Methodologies and Technologies for Microelectronics (IMETEM, Catania), the Institute for Chemistry and Technology of Materials for Electronics (LAMEL, Bologna), the Project Sensors and Microsystems (PSM, Rome) and the Institute for the Study of New Materials for Electronics (IME, Lecce). In 2010 two additional sections joined IMM: the Materials and Devices for Microelectronics Lab (MDM, Agrate Brianza) and the centre for Materials and Technologies for Information and Communication and Solar energy (MATIS, Catania).
Keynote Speaker
Kai Konrad
Director Global Semiconductor Purchasing
Power Modules at the Crossroads: Enabling Scalable EV Innovation
Day 2 / 11:20 - 11:40
Power modules are a key enabler in EV inverter systems—impacting thermal performance, reliability, and serving as the foundation for mechatronic integration. While the efficiency of electric vehicles is primarily driven by semiconductor technology, power modules play a crucial role in realizing that potential at the system level. The market of module manufacturing is highly fragmented, with IDMs, Tier 1s, OSATs, and new entrants each pursuing different business models. This presentation explores how the industry can evolve toward more collaborative and scalable approaches—aligning innovation, integration, and value creation to support the next generation of electric mobility.
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Kai Konrad leads Global Semiconductor Purchasing at Stellantis, drawing on over 20 years of experience in the semiconductor and automotive industries. His career spans roles in product and system marketing, innovation management, and supplier relations at companies like Infineon and Renesas. In 2019, he transitioned from marketing to procurement, bringing a strategic and cross-functional perspective to semiconductor sourcing. Passionate about transformation, innovation and collaboration, Kai is committed to shaping resilient, future-ready supply chains that support the evolution of sustainable mobility.
Speaker
Frank Bösenberg
Managing Director
Empowering Europe’s Semiconductor Future – chances and challenges
Day 2 / 08:55 - 09:05
The presentation provides a comprehensive overview of Europe’s semiconductor landscape, emphasizing the continent’s efforts to strengthen its position in the global microelectronics market. It highlights strategic initiatives such as the EU Chips Act, regional cluster collaborations, and investment in sustainable manufacturing and innovation ecosystems. While referencing Silicon Saxony as a leading example, the focus lies on broader European opportunities and challenges, including supply chain resilience, talent development, and technological sovereignty. Attendees will gain valuable insights into how coordinated efforts across Europe can empower the semiconductor industry to drive economic growth and secure technological leadership in a competitive global environment.
Frank Bösenberg is the Managing Director of Silicon Saxony, one of Europe’s largest semiconductor clusters and the current chairman of Silicon Europe.
Based in Dresden, he has steered the organization for over a decade, connecting more than 600 members across industry, research, and government. As Chairman of the Silicon Europe Alliance, Bösenberg leads initiatives to foster innovation and strengthen the European semiconductor ecosystem. Deeply committed to Saxony’s, Germany’s and Europe’s economic growth, he promotes cooperation in microelectronics, smart systems, and digital technologies, helping position the region as a global high-tech leader.
With over 600 members, Silicon Saxony is the largest high-tech network in Saxony, one of the largest ICT clusters in Germany and the largest microelectronics cluster in Europe. Completely self-financed, Silicon Saxony has been connecting manufacturers, suppliers, service providers, colleges/universities, research institutes, public institutions and industry-relevant start-ups in Saxony and beyond since its foundation in 2000.
The thematic focus of the cluster is on the technological trends of the present and future – e.g. artificial intelligence, robotics, automation, Internet of Things, sensor technology, energy efficiency, neuromorphic or edge computing. As a close cooperation partner of the Dresden Smart Systems Hub and the Leipzig Smart Infrastructure Hub, Silicon Saxony also offers direct access to the topics, projects and locations of the Digital Hub Initiative of the Federal Ministry of Economics and Technology.
Speaker
Pietro Scalia
Head of Power System Marketing and Architecture
Datacenter Trends and Power Architecture evolution
Day 2 / 13:35 - 13:55
Datacenters are in big disruption with AI proliferation, introducing very fast product cycles. Power consumption at the xPU is increasing dramatically (multi-kW), bringing the total power in the rack up to several hundreds kW to 1MW.
For this reason, conventional architecture of power distribution inside the rack, based on 48V intermediate Bus generated from the AC main, needs to be modified to manage this dramatic increase of power. Current structure of the rack and architecture cannot manage the power increase without incurring in huge distribution losses.
A higher Voltage DC Bus is getting introduced by the Hyperscalers, and supported in R&D by the OEMs and PSU suppliers. This will be generated in an external side-car rack starting from the main AC, while the computational rack will be supplied by this voltage and will contain all the GPUs, or TPUS required to increase the computational performance of the AI infrastructure. The new isolated topologies involved in this high Voltage DC Architecture will require many high voltage switches, especially GaN will be extremely useful, since of the capability to switch extremely fast, and as a consequence enable a smaller size and high power density required by the huge power level of these new Racks. On the low voltage side to generate the intermediate 48V to reuse the existing ecosystem, both Silicon MOSFETs or GaN HEMT can be alternatives to achieve the performance and size requirement.
Other challenges have to be resolved also at lower voltage, where the current required by the GPU will also increase, with values that trend to a few kW. This requires to deliver the power to the load in unconventional ways, with vertical delivery, from the opposite side of the SoC, in the aim to reduce distribution losses. This vertical power delivery (VPD) can be implemented by discrete solutions, or more integrated modular approaches to reduce size and parasitics, integrating inductors and capacitors together with active elements. Renesas is able to supports all these new architectural elements, leveraging its GaN and Si switches portfolio, together with digital controllers for IBC and Multiphase, drivers, and digital and analog PoL and BMS controllers.
Pietro Scalia is the Head of System Application and Marketing for Power at Renesas Electronics. His team localized in the three regions is defining and supporting power system solutions for all the market segments, leveraging the entire Power portfolio and addressing new market trends and power architectures.
At onsemi (2021-2023) he lead the Munich Application and PLM team of Automotive EV-Traction Solutions, to define and develop SiC and Si Power Module and Bare DIE portfolio. Previously he worked 11 years at TI, with worldwide Business Development responsibilities on Power products with application focus swinging from Automotive market sector to Telecommunications and Cloud, leveraging his earlier career in Siemens, Ericsson, ST Microelectronics and Academia.
Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.
A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Speaker
Dominic Dorfner, Ph.D.
President & CEO
Session info not yet published.
Dominic Dorfner has been appointed President on September 1, 2024. Previously he served as Senior Vice President of the Automotive Division at Semikron Danfoss. In 2021 Dominic Dorfner joined Semikron Danfoss as Head of the Industrial Business of Danfoss Silicon Power.
Prior to joining Semikron Danfoss Dominic Dorfner has worked in multiple roles for Voith Turbo and as a Consultant for Roland Berger Strategy Consultants. Further, he serves as member of the advisory board for the Frauenhofer Gesellschaft ISIT.
Dominic Dorfner has a PhD in Semiconductor Physics, an Executive Education from INSEAD and lived in Germany, USA, Japan and China.
Semikron Danfoss is a global technology leader in power electronics. Our product offerings include semiconductor devices, power modules, stacks and systems.
In a world that is going electric, Semikron Danfoss technologies are more relevant than ever. With our innovative solutions for automotive, industrial and renewable applications we help the world utilize energy more efficiently and sustainably and thus to significantly reduce overall CO2 emissions – facing one of the biggest challenges today.
We take care of our employees and create value for our customers by investing significantly in innovation, technology, capacity, and service to deliver best-in-industry performance and for a sustainable future.
Speaker
Roman Straßer
SVP, Head of Technical Development VW Group Inverter Platform
Volkswagen Group Power Electronics Strategy
Day 2 / 09:25 - 09:45
The presentation will cover our newest power module design, our inhouse prototyping capabilities, and will give an outlook into the future roadmap of our power electronics strategy.
- For more than 25 years involved in Electronics Development
- Since 2022 – Head of Development Group Platform Power Electronics – Volkswagen Group
- 2004-2022 – Head of Development Power Electronics and Charging – Audi AG
- 1998-2004 – Head of Development Transmission Electronics – Jatco Europe
- 1995-1998 – Project Lead for Transmission Scheduling – Continental AG
- Dipl. Ing. Electrical Engineering (Technical University Munich)
As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.
Speaker
Giorgia Longobardi, Ph.D.
Founder and CEO
Session info not yet published.
Dr. Giorgia Longobardi, founder and CEO of Cambridge GaN Devices (CGD), is an accomplished engineer and business leader with nearly two decades of experience in power semiconductors and high-efficiency power electronics. As the inventor of several high-impact patents in GaN power devices, she combines deep technical expertise with strong commercial acumen—one of her greatest strengths.
Driven by curiosity and a passion for making a positive impact, Giorgia founded CGD to bring advanced, energy-efficient power electronics solutions to market. She now leads a diverse team of 60+ employees across Europe, Asia, the US, and Canada. Under her leadership, CGD has raised over $65 million in private and public investment and launched multiple GaN-based power device products into mass production. Her vision includes one day driving an electric vehicle powered by CGD technology and using ICeGaN to help make AI more sustainable by reducing its environmental footprint.
Giorgia serves on the Energy Management Committee of the Power Sources Manufacturers Association (PSMA) and the Advisory Board of the International Semiconductor Industry Group (I.S.I.G.).
A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible.
Operating at a market worth exceeding $30 billion, CGD completed several funding rounds to develop and deliver to the market a wide range of products for consumer and industrial applications.
In autumn 2021, the company was named Tech Scaleup of the Year by Business Weekly in the category of green electronics and was awarded the UK Business Angels Association (UKBAA) deep tech Investment of the Year.
Speaker
Thomas Heinzel
Head of Semiconductor Technical Division
Advanced low inductance SiC Power Module with 3D wiring technology
Day 2 / 14:00 - 14:20
An advanced 3D Wiring technology has been developed to increase the power density of modules equipped with silicon carbide (SiC) for electric vehicle (xEV). Applying the multi layer 3D wiring technology with copper pin-terminals demonstrates about twice the power density of a conventional copper clipped wiring structure. The ⊿Tvj power cycling lifetime of power modules with the developed 3D wiring technology is approximately five times longer than the conventional copper clipped wiring.
1988 Graduation in Electrical Engineering at DHBW Mannheim
1988-1998 ABB, Mannheim (Traction Division)
• Development of a control unit for a 3-level 3-phase Inverter including the control pattern and PLD algorithm.
• Development and commissioning of a 60 kVA 3-level-Transistor-Inverter for Light Rail Vehicles
• Conception and development of a new Auxiliary Inverter System for Railways
• Project Management of the Auxiliary Inverters at Adtranz, Mannheim
1998 : Fuji Electric Europe GmbH
• Start an Application support for the all Power Semiconductor Customers in the EMEA Sales area
• Build a technical support Team including quality analysis function
• Manager of the technical Department of the Semiconductor Division
• Implementation of a R&D team for EU customers
Since Dec 2021 :
• Head of Semiconductor Technical Division
Fuji Electric specializes in electrical and thermal power engineering, delivering innovative solutions that promote sustainability and energy efficiency. We help customers significantly reduce energy consumption and minimize their carbon footprint with environmentally responsible technologies.
Since 1987, Fuji Electric Europe has been a trusted partner across Europe, the Middle East, and Africa. We’re proud to be a leader in high-performance power semiconductors for automotive and industrial applications. Our extensive product range includes MOSFET devices, diodes, and power semiconductor modules for energy-saving electronics, along with control ICs for high-efficiency power supplies. This ensures we provide reliable, customized solutions for energy-intensive industries, contributing to a more sustainable future.
For years, our power semiconductors powered electric drives (like frequency converters and servo drives) and uninterruptible power supplies (UPS). This built our reputation for outstanding quality, high reliability, and cutting-edge technology.
Today, our application portfolio is rapidly expanding into exciting new areas: renewable energy (wind and solar), hybrid/electric vehicles, smart grids for energy supply, and traction systems. Each new application demands innovative, efficient, and durable solutions of the highest quality.
Our state-of-the-art production facilities across front-end, back-end, and warehousing ensure we can supply our growing global customer base with power semiconductors. This guarantees flexible product availability and an excellent price-performance ratio.
Our latest 7th IGBT generation (X series) is now rolling out, seamlessly replacing older products. These new devices offer both electrical and mechanical compatibility while significantly reducing losses, pushing the boundaries of efficiency.
Speaker
Ladislav Sobotka, Ph.D.
Director of Engineering and R&D
High-tech HV IGBT and SiC Modules Designed for Railway Applications
Day 2 / 14:25 - 14:45
Joint Collaboration Presentation
An example of vertical solution implementation through partnership is described in this presentation using rail applications. ŠKODA ELECTRIC and HITACHI ENERGY collaborate on applying high-voltage IGBT semiconductors in various module platforms, including newest LinPak IGBT modules for serial usage in traction converters with a 3 kV DC power supply system. In recent years, the ŠKODA GROUP has been intensively developing hybrid dual-system trains with battery drive for a range of 80-120 km on non-electrified lines. A necessary condition for BEMU is the development of a high-tech DC-DC converter with galvanic isolation of 10 kV and a continuous power of 800 kW. Given the weight of LTO batteries, emphasis was placed on minimum weight and installation dimensions and high efficiency of the converter. This clearly leads to the choice to adopt on power semiconductor side SiC technology both on the 800 V traction battery side and on the 3 kV DC traction converter side. Therefore, the partnership with Hitachi Energy was used to develop a SiC module for a voltage of 3.3 kV with an insulation voltage of 10.2 kV. The development of this semiconductor took place in parallel with the development at ŠKODA ELECTRIC converter development over the last couple of years, leading to the stage that as of today 4 BEMU trains are in operation on Czech Railways and these SiC based semiconductors work absolutely reliably, and were the key enabler for this new train platform. As a further step into performance of this train platform, based on the experience with another SiC Powermodule, the RoadPak SiC, for electric buses, there is now the development of a traction inverter for BEMU trains with these SiC modules with parameters of 1200V and the record current of 1150A for powering asynchronous traction motors with a continuous power of 340 kW. The development of power SiC modules and their application in railways allows to come up with ecological solutions for modern trains and significantly reduce the environmental burden and increase the comfort of passengers on the railway. European cooperation between two major companies is a best practice example of this.
Ladislav is the Director of Development and Engineering at ŠKODA ELECTRIC, part of the ŠKODA Group. He joined Skoda in 1982 to develop electric locomotives, where he worked on traction drives. In 1996 he developed a new traction drive for the City Elephant double-decker unit (3 kV DC supply system ) with new HV IGBT transistors and a double star asynchronous traction motor. He also worked extensively on the development of trams and subway vehicles. He has been in the management of ŠKODA TRANSPORTATION since 1994, and in the following years he served as Technical Director and member of the Supervisory Board of ŠKODA TRANSPORTATION. In 2003, he founded ŠKODA ELECTRIC and was a member of the Board of Directors in charge of the technical departments. At ŠKODA ELECTRIC, he has been involved in a number of foreign projects, such as a traction drive for locomotives for Turkey in cooperation with the Korean company Hyundai-Rotem and a groundbreaking traction drive for a subway train for the Chinese city of Suzhou. Ladislav works very intensively with universities and is a member of three scientific councils. Since 2015 he has been working on SiC semiconductors and high efficiency traction drives.
We are Škoda Electric, belonging to the Škoda Group. We continue in the tradition of the one hundred and sixty-year tradition of Škoda plants and we are an experienced manufacturer of traction drives and motors for locomotives, trams, EMU, metro, mining vehicles.
About us | Škoda Group a.s. (skodagroup.com)
Speaker
Rainer Kaesmaier, Ph.D.
Managing Director Semiconductors
High-tech HV IGBT and SiC Modules Designed for Railway Applications
Day 2 / 14:25 - 14:45
Joint Collaboration Presentation
An example of vertical solution implementation through partnership is described in this presentation using rail applications. ŠKODA ELECTRIC and HITACHI ENERGY collaborate on applying high-voltage IGBT semiconductors in various module platforms, including newest LinPak IGBT modules for serial usage in traction converters with a 3 kV DC power supply system. In recent years, the ŠKODA GROUP has been intensively developing hybrid dual-system trains with battery drive for a range of 80-120 km on non-electrified lines. A necessary condition for BEMU is the development of a high-tech DC-DC converter with galvanic isolation of 10 kV and a continuous power of 800 kW. Given the weight of LTO batteries, emphasis was placed on minimum weight and installation dimensions and high efficiency of the converter. This clearly leads to the choice to adopt on power semiconductor side SiC technology both on the 800 V traction battery side and on the 3 kV DC traction converter side. Therefore, the partnership with Hitachi Energy was used to develop a SiC module for a voltage of 3.3 kV with an insulation voltage of 10.2 kV. The development of this semiconductor took place in parallel with the development at ŠKODA ELECTRIC converter development over the last couple of years, leading to the stage that as of today 4 BEMU trains are in operation on Czech Railways and these SiC based semiconductors work absolutely reliably, and were the key enabler for this new train platform. As a further step into performance of this train platform, based on the experience with another SiC Powermodule, the RoadPak SiC, for electric buses, there is now the development of a traction inverter for BEMU trains with these SiC modules with parameters of 1200V and the record current of 1150A for powering asynchronous traction motors with a continuous power of 340 kW. The development of power SiC modules and their application in railways allows to come up with ecological solutions for modern trains and significantly reduce the environmental burden and increase the comfort of passengers on the railway. European cooperation between two major companies is a best practice example of this.
Panel Session: Strategic Autonomy or Global Integration? Europe’s Current and Future Semiconductor Strategy Amid Geopolitics and Supply Chains Boundaries
Day 3 / 14:40 - 15:30
Dr. Rainer Kaesmaier is leading the semiconductor business of Hitachi Energy with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes and SiC for market segments such as energy transmission & distribution, transportation & rail, renewables, industry and eMobility. Rainer is a semiconductor industry veteran having held various management and executive positions in the sector for close to 30 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing. After stations at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, he assumed 2018 the responsibility for the global semiconductor business of Hitachi Energy. In addition to that, Rainer is since 2019 also member of the management board for Hitachi Energy Switzerland. He was a member in various industries strategy committees in Europe and the US, and currently in the advisory board for International Semiconductor Industry Group (I.S.I.G.). Rainer holds a Master’s degree in Physics from the Technical University Munich and a PhD in Physics from the University Kassel in Germany. He is based in Lenzburg near Zurich, Switzerland.
We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.
Speaker
Milan Rosina, Ph.D.
Principal Analyst, Power Electronics & Batteries
Market outlook and technology trends for power devices in xEV and beyond
Day 3 / 14:15 - 14:35
The global transition toward sustainable transportation is accelerating the adoption of electrified vehicles (xEV), creating significant opportunities in the power electronics sector. Despite challenges such as high vehicle costs, geopolitical dependencies, and charging infrastructure constraints, the xEV market continues to grow, driven by long-term trends in decarbonization and electrification. This presentation will provide an in-depth analysis of the power semiconductor market for xEV applications, with a focus on Silicon, Silicon Carbide (SiC), and emerging Gallium Nitride (GaN) devices. The complex dynamics of IGBT vs. SiC choices in automotive designs will be explored, alongside the implications of cost-performance tradeoffs and supply chain dependencies. Beyond passenger EVs, the electrification of rail transport and electric aircraft also presents promising markets for power devices. Key market figures, technical innovations, and strategic collaborations—including with Chinese players—will be discussed to provide a comprehensive overview of the evolving power electronics landscape in mobility.
Panel Session: Strategic Autonomy or Global Integration? Europe’s Current and Future Semiconductor Strategy Amid Geopolitics and Supply Chains Boundaries
Day 3 / 14:40 - 15:30
Dr. Milan Rosina is Principal Analyst, Power Electronics & Battery, at Yole Group (Yole). Dr. Rosina has 20+ years of experience due diligence, technology, and market surveys in the fields of renewable energies, xEV, EV chargers, energy storage, batteries, power electronics, thermal management, and innovative materials and components. Dr. Rosina received his Ph.D. degree from National Polytechnical Institute (Grenoble, France). He previously worked for the Institute of Electrical Engineering in Slovakia; Centrotherm in Germany; Fraunhofer IWS in Germany; CEA LETI in France; and the French utility company ENGIE.
Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.
Speaker
Manuel Gaertner
Director Wide Band Gap & Electrification
Session info not yet published.
Manuel Gärtner joined STMicroelectronics Munich in 1999 and is Director of wide bandgap & Electrification for automotive applications. He has worked as a development engineer for smart power products and as a research engineer at the university of Berlin and in the Fraunhofer Institute ISiT in Berlin. He has published over 35 articles and conference speeches on automotive power electronics and holds several patents. He is member of the EEHE Scientific Advisory Board, the SIA POWER TRAIN & ELECTRONICS scientific committee for Power Electronics, Member of Technical Program committee for CIPS 2026, and he represents STMicroelectronics as principal partner and is Member of the Board of Directors in ECPE.
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Speaker
Oliver Whear
Director of Semiconductor Technology
Wet Process Technology Roadmap for Power Device Manufacturing
Day 2 / 17:30 - 17:40
In this work we demonstrate strain relief etching using an advanced chemical etching (ACE) process of the full wafer surface on commercial grade n-type 4H-SiC at production throughputs (μm’s/hr). The data shows >4x improvement of breakage strength in laser split wafers. Warp and bow of ground wafers is reduced to match wafers that have been CMP processed showing the potential of stronger, flatter wafers being available for chemical mechanical polishing.
Strain relief etching is a critical wet process technique use in high volume manufacturing of semiconductor substrates and device wafers. The goal of a strain relief etch is application dependent but can generally be considered for removal of warp/bow or improving mechanical strength by removing sub-surface damage thereby optimizing yields. Silicon Carbide (SiC) has a high chemical resistance which has blocked the manufacturing community from using strain relief etching to date.
Without an effective wet etch, the SiC substrate manufacturing community has resorted to expensive mechanical techniques for the polishing and thinning of wafers, which imparts significant stress and strain within the layer. Use of extensive mechanical techniques is also expensive and difficult to perform at volume where wafers are fragile early in the substrate manufacturing line. Research has explored mechanisms of wet etching for creating microstructures on 4H-SiC and trenches in 6H-SiC.
Oliver Whear is an 11 year industry veteran working at several points in FEOL manufacturing on metrology, deposition and wet process. He started as an applications scientist before moving in to project management and his current role as Director of Semiconductor Technology at RENA Technologies. Oliver is an expert at developing new manufacturing technologies based on challenges foreseen by industrial roadmaps and market strategy.
- Master of Science by research, Physics – University of York
- Committee Member – Semiconductor Standards (EPL/47)
- Member – Compound Semiconductor Materials Work Group
- 11 years of industry experience in FEOL manufacturing on metrology, deposition and wet process of advanced 300mm logic, 300mm memory, 2D materials and compound semiconductors.
- Former Product Manager at AIXTRON SE in MOCVD solutions for 2D Materials including graphene, boron nitride and transition metal dichalcogenides. + Former Product Manager at Bruker for HRXRD solutions of Compound Semiconductors.
- Expert at developing new manufacturing technologies based on challenges foreseen by industrial roadmaps and market strategy
Founded in 1993, RENA Technologies has established itself as a global leader in mechanical and process engineering, for a diverse range of industries. We specialize in providing cutting-edge wet processing solutions for the semiconductor, solar, additive manufacturing, glass, and medtech industries.
A key area of expertise is wet chemical immersion, spray and single wafer processes for the manufacturing of semiconductors. With over 1,100 systems installed worldwide, our technology is trusted by manufacturers around the globe to enhance efficiency and production quality.
RENA Technologies employs approximately 1,000 professionals worldwide, all dedicated to innovation and excellence in our field. Headquartered in Gütenbach, Germany, and manufacturing sites in Albany, OR and Wykroty, Poland, we continue to drive advancements in process engineering, ensuring our customers receive the highest quality solutions for their manufacturing needs.
On top we provide worldwide onsite service support with over 150 Experts in 20 locations globally to ensure flawless installation and operation of our tools.
RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes like etching, stripping, cleaning or drying. RENA offers proven standard machines as well as customer-specific solutions and process support.
Speaker
David Clark
VP Product Marketing
Innovative Packages, Big Power: The Rise of Advanced Power Packaging
Day 3 / 11:10 - 11:30
David joined Amkor in 2013 and is currently responsible for Global Product Marketing, Market Analytics and Market Strategy. Before joining Amkor, David had held various sales management, product development and engineering positions at FlipChip International (FCI), Leica Microsystems and Agilent Technologies. David has been granted five patents in Optoelectronics and Device Packaging and holds a BEng Honours Degree in Electronic, Electrical, and Optoelectronic Engineering from the University of Glasgow.
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Speaker
Annika Peter
Senior Technology Manager
Enabling Solutions for GaN Processing
Day 2 / 17:15 - 17:25
Gallium Nitride (GaN) is one of the most important third generation semiconductor materials. Its wide bandgap makes it an excellent candidate for power electronics – GaN high electron mobility transistors (HEMTs) have already become well established in Specialty Technology applications such as consumer fast charging and are gaining traction in automotive. In addition, GaN and its compounds are gaining momentum across a wider range of applications, including µLEDs and RF power amplifiers.
Whilst the properties of GaN bring exciting benefits to these applications it also poses some unique processing challenges. Lam has led the advancement of process technologies for 200 mm GaN on Si fabrication for almost a decade and is also enabling the transition to 300 mm GaN on Si device manufacturing.
In this paper, we will discuss some critical challenges and solutions for GaN processing both, on 200mm and 300mm Si substrates.
Annika joined Lam Research in 2017 and is currently Senior Technology Manager responsible for the Specialty Technologies application space. She previously held positions in engineering and program management, where she was partnering with our customers to enable future device generations. Holding her first fully processed device wafer in 2007, Annika received a B.Eng. in Mechatronics and Microsystems in 2008 and a M.Sc. in Applied Physics in 2011. In 2009 Annika joined a research group at the Institute of Micro Technologies, developing waveguides with integrated optics for bio-sensing. Prior to joining Lam Research Annika was part of the Technology Group at Oxford Instruments Plasma Technology, where she led multiple equipment and process developments.
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Speaker
Andrey Smirnov
Director of Business Development
Modeling tools for optimization semiconductor manufacturing processes: from material to device
Day 3 / 09:50 - 10:00
Computer modeling has long been recognized as a powerful tool for accelerating development and reducing the costs of various manufacturing processes. In the semiconductor industry, modeling has already become a reliable workhorse for certain production processes, while for other processes, companies are still looking for modeling solutions that could capture complex physical and chemical phenomena to support further technology development.
In the present work, we demonstrate the latest capabilities of STR’s modeling software, which enable accurate analysis and optimization across multiple stages of semiconductor manufacturing, including crystal growth, epitaxy, and device processing steps such as oxidation, ALD, and etching.
Andrey Smirnov started his journey in crystal growth modeling in 2006 when he joined STR as a student. During his early years at STR, he was involved in the modeling and development of physical and chemical models for different crystal growth processes, contributing to the development of models that became an integral part of the CGSim software, which is now used by all leading manufacturers of electronic and solar grade silicon wafers.
In 2009, Andrey Smirnov was promoted to the position of Product Line Manager and began his activities in managing cooperation projects with STR’s partners, interaction with clients and business development.
From 2022 Andrey Smirnov serves as Director of Business Development in STR Belgrade. His current activities include building relationships with customers, managing key cooperation projects and guiding the development of new models and software features potentially interesting for the global semiconductor community.
STR provides specialized software and consulting services for modeling of crystal growth, epitaxial process, device processing, and operation of semiconductor devices. A comprehensive research stays behind every consulting activity and software product which enables careful validation of physical models and approaches applied. STR’s expertise in the crystal growth science and device engineering is presented in variety of publications.
Five software product lines are being developed and promoted by STR:
– Crystal growth from the melt and solution;
– Wide-bandgap crystal growth from gas and vapor;
– Deposition and epitaxy;
– Device processing;
– Optoelectronic devices.
Software packages:
CGSim – Cz, DSS, Kyropoulos, Bridgman crystal growth from the melt (Si, Ge, GaAs, InP, CZT, Sapphire, YAG, LN, and more);
PolySim – polysilicon deposition by Siemens process;
Virtual Reactor – bulk crystal growth of SiC, AlN, GaN by PVT and HVPE;
DiaDeMo – CVD growth of Diamond;
CVDSim3D – epitaxy of compound semiconductors (Si, SiC, III-V, III-Nitride)
STREEM – stress buildup and relaxation in the AlGaN and InGaN based epitaxial stacks
IProS 2D – device processing steps (LPCVD, oxidation, ALD, ALE, etching);
SimuLED – optoelectronic and electronic devices (LEDs/LDs, FETs, Schottky diodes)
Panel Moderator
Mike Rosa, Ph.D.
CMO & SVP Strategy
Panel Session: Optimizing Fab Operations
Day 3 / 11:35 - 12:45
Mike Rosa is chief marketing officer (CMO) and senior vice president responsible for strategy at Onto Innovation. Prior to his current role, Mike served as CMO for Applied Materials ICAPS and Advanced Packaging Groups, where he was responsible for leadership of strategic and technical marketing, marketing communications, charting device segment inflection roadmaps and providing strategic business development support toward M&A activities. He has over 25 years’ experience in semiconductor engineering and technology, with roles that span device design and fabrication, equipment development, marketing and sales. His technical qualifications include B.Eng. (Hons) and Ph.D. degrees in Microelectronic Engineering and an MBA with dual majors in Marketing and Business Strategy. Mike has authored over 40 journal and conference publications and holds over 29 U.S. patents
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Panel Moderator
Aly Mashaly
Founder & CEO
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Aly Mashaly is a renowned expert in power electronic systems and power semiconductors, with over 20 years of experience in the electronics industry. He holds several patents in the field and is a keynote speaker at numerous international conferences. Aly earned his degree in Electrical Engineering with a focus on Power Electronics from Ain Shams University in Cairo. In late 2002, he moved to Germany to pursue his master’s degree at the University of Hanover.
He began his career as a pioneer in the early development of power electronic systems for avionic applications before shifting his focus to advancing power electronics in the electric vehicle market. In his most recent role as Technical Director at ROHM Semiconductor Europe, Aly played a key role in driving the company’s vision to establish itself as a global leader in power devices.
Today, Aly is the Founder and CEO of Verotera, a German startup that bridges the gap between system developers and semiconductor innovators by combining deep system-level expertise with advanced semiconductor power modules and AI-driven hardware optimization.
Verotera is a German startup and a next-generation semiconductor company driven by deep system-level expertise and a vision for a smarter, cleaner world. Our team brings hands-on experience in inverter development, semiconductor design, and real-world system integration. We operate across the full stack — from chip physics to complete systems — designing technologies that address the actual needs and constraints of modern applications.
This unique positioning allows us to reduce integration costs, accelerate design cycles, and deliver higher system efficiency. With strong industry networks and credibility in both the OEM and semiconductor domains, we bridge the gap between demand and innovation — enabling faster validation, strategic partnerships, and more effective go-to- market execution.
Please visit Verotera’s website for more information: www.verotera.com
Speaker
Marc Isabelle, Ph.D.
Founder & CEO
Public funding opportunities for the semiconductors industry in the EU
Day 2 / 09:10 - 09:20
The semiconductors industry is among the highest beneficiaries of public funding in the EU. Grants target R&D activities, first industrial deployment of breakthrough innovations and first of a kind manufacturing facilities. Securing such State aid and EU funding is a highly competitive process which requires a thorough understanding of the numerous opportunities and associated regulations. Based on several use cases, Marc Isabelle’s presentation will provide a valuable first dive into public funding opportunities for the semiconductors industry in the EU.
Marc ISABELLE, engineer & PhD in Economics, is the founder and CEO of european economics.
Marc is a recognised expert in the public funding of strategic projects. Since 2009, he has helped 195 companies secure €41 billion in public funding for 246 major projects. These initiatives tackle key societal challenges – including disruptive innovation, decarbonisation, resilience and infrastructure – across a wide range of industrial sectors including microelectronics, software, telecoms, automotive, energy and environment, batteries, pharmaceuticals and biotech.
Through his extensive work with the European Commission and national authorities, Marc has actively contributed to shaping the methodologies and best practices used to assess public funding applications and their compatibility with EU regulations.
Founded in 2009, european economics is a recognised pure-player consultancy specialising in public funding. We deliver tailored, high value-added services across Europe to support our clients in designing and implementing turnkey public funding strategies – State aid and European funding – for their most strategic projects:
• €41 billion in public funding secured for 246 projects, including €5.8 billion in 2024,
• 100% success rate for State aid notifications to the European Commission.
We support our clients with a turn-key approach at every step of their project’s life-cycle: funding strategy definition, application file preparation (at National and EU level), European Commission validation process, and funding monitoring.
Panelist
Ajay Poonjal Pai, Ph.D.
Director, Head of WBG Innovation & Application Engineering
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Dr.-Ing. Ajay Poonjal Pai obtained his B. Tech in Electrical & Electronics Engineering from NITK Surathkal, India and M.Sc. in Electrical Power Engineering from RWTH Aachen University, Germany. He then pursued his PhD focusing on Silicon Carbide (SiC) power semiconductors for automotive traction inverter applications at the Friedrich Alexander University (FAU), Erlangen-Nuremberg, Germany. From 2015 to 2023, he worked at Infineon Technologies AG, Germany as a Principal Engineer responsible for next-generation automotive SiC technologies and power modules. Since May 2023, he is working at Sanan Semiconductor Munich, where he is responsible for building and growing the Wide Bandgap (WBG) Innovation and Application engineering organization. His research interests include e-mobility, SiC semiconductors, power modules and power electronics, and has contributed to numerous invited lectures and conferences worldwide.
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Panelist
Ralf Bornefeld
SVP Business Unit Power Semiconductors & Modules
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Ralf Bornefeld is Senior Vice President with responsibility for the business unit Power Semiconductors & Modules at Bosch.
Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.
Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.
Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Panelist
Edoardo Merli
SVP and GM of Business Group Wide Band Gap, IGBT & Modules
Session info not yet published
Edoardo Merli, SVP and GM of Business Group Wide Band Gap, IGBT & Modules, is a highly accomplished executive with 30+ years in high-tech and automotive industries.
He brings a solid experience on semiconductors, both in automotive and industrial/consumer domains.
Before joining Nexperia, he was EVP and GM of Power Transistor SubGroup in STMicroelectronics.
His previous assignments included automotive processors and infotainment, communications, RF and -the latest one- Power Technologies.
Edoardo holds a BA in Engineering (B. Eng.), Electrical, Electronics and Communications Engineering from University of Bologna in Italy.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Panelist
Michael Woittennek
CEO of X-FAB Dresden
Panel Session: Optimizing Fab Operations
Day 3 / 11:35 - 12:45
Michael Woittennek has 20 years of experience in the semiconductor industry. After his master’s degree in Physical Engineering at University of Applied Science in Zwickau he started his career in semiconductor industry. From 2005 until 2016 he worked in various roles in process engineering and project management in the field of automotive mixed signal CMOS manufacturing and development at X-FAB. In 2017 he started his management carrier in photolithography fostering transition to higher automation in a brown field fab environment. Followed by various responsibilities in the operations management of the site until end of 2022. Since 2023 he responsible as CEO of X-FAB Dresden GmbH & Co KG.
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
Panelist
Dirk Drescher, Ph.D.
VP and Plant Manager
Panel Session: Optimizing Fab Operations
Day 3 / 11:35 - 12:45
Dirk started his career in 1995 as process engineer for Siemens Microelectronics Center Dresden. In 2000 he joined Infineon’s Semiconductor 300 organization to help starting up the worlds first 300mm Semiconductor Manufacturing Line. 2010 Mr. Drescher joined Globalfoundries for its green field start up of 300mm Manufacturing Site, Fab8, Malta, NY, USA. In 2013 he took over a managerial position at Globalfoundries Fab1, Dresden, Germany. From 2016-2023 Mr. Drescher joined X-FAB. After managing Semiconductor Fabs in Dresden and Corbeil-Essonnes, France, he served as VP Operations in X-FAB’s corporate management. Dirk is active in the board at Silicon SaxonyHe holds a diploma in Physics from Dresden Technical University and a PhD in Experimental Physics from the Technical University Chemnitz.
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Panelist
Torsten Müller, Ph.D.
Senior Director IC Technologies
Panel Session: Optimizing Fab Operations
Day 3 / 11:35 - 12:45
Dr. Torsten Müller holds a PhD in Physics and brings 25 years of expertise in semiconductor research, development, and production. Throughout his career, he has contributed to advancing Flash technology at Infineon and Qimonda, managed solar cell production at Conergy and Sovello, and led the technology development and ramp of a 28nm high-k metal gate technology at Globalfoundries. Returning to Infineon Dresden, he managed the 300mm technology transfer portfolio before taking his current role as Head of IC Technologies. With a proven track record in innovation, leadership, and operations, Dr. Müller remains a driving force in semiconductor advancements.
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Panelist
Maike Mueller, Ph.D.
Head of Semiconductor Strategy & Development Power Modules
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Dr. Maike Mueller graduated in chemistry from Technical University of Munich and received her doctorate from the Humboldt University of Berlin while working at the Federal Institute for Materials Research and Testing. She started her career in the semiconductor industry as a quality and process engineer at Osram Opto Semiconductors in Regensburg. The past 11 years she has been working in various management roles within Infineon’s automotive and consumer divisions as well as procurement department. Since Oct 2024 she joined VW Group as Head of Semiconductor Strategy & Development of Power modules, Group Powerelectronics.
As group-wide „Powerhouse“ of Volkswagen, the group resort Technology with its business units is responsible for the core transformation-topics “battery”, “charging and energy”, and “components”. It shapes the development and production of strategic components for the car-manufacturing brands of the group and with its “platform business” also for OEMs outside the Volkswagen Group. As an independent company inside the group resort Technology, Volkswagen Group Components employs 70.000 employees in more than 60 factories worldwide. They provide a valuable contribution for the Volkswagen Group, its brands and products. Thomas Schmall is the board member for the group resort Technology and CEO of Volkswagen Group Components.
Panelist
Roberto Antonicelli, Ph.D.
Senior Director, Automotive BU
Panel Session: Strategic Autonomy or Global Integration? Europe’s Current and Future Semiconductor Strategy Amid Geopolitics and Supply Chains Boundaries
Day 3 / 14:40 - 15:30
Professional with over 25 years of international experience in the semiconductor and automotive sectors. Currently Senior Director at STATS ChipPAC, part of JCET Group, he has previously held leadership roles at STMicroelectronics and Infineon. He holds a PhD in Microelectronics, with a focus on semiconductor packaging and RF/microwave design. His expertise spans business development, strategic partnerships, and complex program execution, with a strong emphasis on business innovation and collaboration. Married and father of three children, he is recognized for his forward-thinking approach to advancing technology and business solutions.
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Panelist
Rodney Pelzel, Ph.D.
CTO & COO
Panel Session: Optimizing Fab Operations
Day 3 / 11:35 - 12:45
Dr. Rodney Pelzel is the Chief Technology Officer at IQE, the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry
Rodney has over 20 years of experience in the semiconductor industry, with deep expertise in semiconductor materials engineering and the epitaxial growth of compound semiconductors. Rodney joined IQE as a Production Engineer in 2000 and during his first twelve years at IQE he held various engineering and operational management roles focusing on scaling leading edge epitaxial technology for high volume manufacturing for wireless applications.
In 2012, Rodney was appointed as head of R&D for the IQE Group and was tasked with creating unique materials solutions that enable IQE’s customers and provided them with a competitive edge. Throughout his career, Rodney has been involved in numerous new product introductions, including IQE’s highly successful launch of 6” VCSELs for consumer applications.
Rodney is a chemical engineer by training and graduated from the University of Colorado in 1995 with a bachelor’s degree (high distinction) in Chemical Engineering and a PhD in Chemical Engineering (surface chemistry of semiconductors, GaAs and Si) from the University of California in 2000. He is a Chartered Engineer, Chartered Scientist, and a Fellow of the Institution of Chemical Engineers, with his work widely published and a co-inventor of 30+ patents.
IQE is the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry that enable a diverse range of applications across mobile handsets, global telecoms infrastructure, smart connected devices, electric vehicles, infrared and sensing applications.
Panelist
Denis Marcon, Ph.D.
General Manager and SVP
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Denis Marcon received a M.S. degree from the University of Padova in 2006. Subsequently, he received the degree of Doctor in Engineering (Ph. D.) from the Catholic University of Leuven and imec with the thesis entitled “Reliability study of power gallium nitride based transistors” in 2011. He is leading author or co-author of more than 50 journal papers or international conference contributions.
After his Ph.D. graduation, he has been leading projects aiming to develop GaN HEMTs for several applications (RF and power switching). Thereafter, he has joined the business development team of Imec where he was directly responsible for the partnerships with imec in the field of GaN power electronics as well as on dedicated development and manufacturing of Si-based devices, MEMS, sensors and micro-systems,
Today he is the General Manager of Innoscience Europe (subsidiary of Innoscience) and he is directly responsible for Innoscience’s GaN business in Europe.
Innoscience (HKEX:02577.HK) is the global leader in gallium nitride process innovation and power device manufacturing. Innoscience’s device design and performance set the worldwide standard for GaN, and the culture of continuous improvement will accelerate GaN performance and market adoption. The company’s gallium nitride products are used in multiple low, medium and high voltage applications, with GaN process nodes covering 15V to 1200V. Wafers, discrete devices, integrated power ICs, and modules provide customers with robust GaN solutions. With 800 patents granted or pending, Innoscience’s products are known for reliability, performance, and functionality within the fields of consumer electronics, automotive electronics, data centers, renewable energy and industrial power. Innoscience creates a bright future for GaN. Please visit www.innoscience.com for more information.
Innoscience’s Gallium Nitride products are used in multiple low, medium and high voltage applications, with GaN process nodes covering 15V to 1200V. Wafers, discrete devices, integrated power ICs, and modules provide customers with robust GaN solutions.
Panelist
Dominic Viens
VP & GM Power Test Division
Panel Session: Optimizing Fab Operations
Day 3 / 11:35 - 12:45
Dominic Viens is Vice President and General Manager of the Power Test Division at Teradyne, where he leads global strategy and operations for power semiconductor test solutions. With over 25 years of experience across product management, sales, and engineering, Dominic has held senior roles at both Teradyne and MathWorks. He has successfully launched high-growth product lines, driven complex design-ins, and led global teams across Asia, Europe, and North America. Dominic holds a degree in Electrical Engineering from McGill University. He is also an inventor on multiple patents in semiconductor test innovation
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
Contact Us
www.teradyne.com
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
- Semiconductor test systems
- Storage and system-level test systems; Defense and aerospace test instrumentation and systems; Circuit-board test and inspection systems
- Wireless test systems
Panelist
Patrick Schwarz, Ph.D.
Lab Director Power Packages
Panel Session: Electrification Market & WBG Adoption
Day 2 / 16:10 - 17:10
Patrick Schwarz has studied chemistry in Regensburg, Germany where he completed his PhD in inorganic chemistry. He joined Infineon in 2011 as an engineer for reliability and analytics focusing on chip embedding technologies. 2013 he transferred from RnD to production in the area of process integration and transfer management , where he also took his first management role in 2015 as head of process integration and product engineering for laminate based packages. With the start of Infineons first molded power module Hybridpack DSC he took leadership of the ramp up management for the new platform becoming a specialist for critical new product introductions. After shifting to global productivity platform owner for preassembly within Infineon he joined Huawei as Lab Director for Power Packages in 2024.
Founded in 1987, Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We have approximately 208,000 employees and we operate in over 170 countries and regions, serving more than three billion people around the world. We are committed to bringing digital to every person, home and organization for a fully connected, intelligent world.
At Huawei, we have two key drivers of innovation: science and technology, and customer needs. Both commercial value and market demands are driving our innovation and determining how we invest in science and technology. Breakthroughs in technology, in return, stimulate customer needs and allow us to create greater value for customers.
In 2024, our total R&D spending reached CNY179.7 billion, representing 20.8% of our total revenue.
Our total R&D investment over the last decade now exceeds CNY1.249 trillion.
On December 31, 2024, 113,000 employees (about 54.1% of our workforce) worked in R&D.
Through years of sustained innovation in fundamental domains, Huawei has become one of the world’s largest patent holders, currently holding 150,000+.
Panelist
Matthias Bonkass
VP Advanced Manufacturing Engineering
Panel Session: Optimizing Fab Operations
Day 3 / 11:35 - 12:45
Matthias Bonkass brings over 25 years of semiconductor leadership to his role as VP of Advanced Manufacturing Engineering at GlobalFoundries. A pioneer in Dresden’s fab development since 1997, he has held key roles across AMD and Globalfoundries, including Module Manager positions for CMP/Plating, PVD/CVD and Head of the global Bump Test Facility. His expertise spans 200mm and 300mm technologies, global service integration, and automation-driven efficiency. Since 2020, he has led Fab1’s ramp-up strategy, driving innovation and operational excellence. Matthias holds several patents and serves on the ISS Europe Committee and Fab Manager Forum Europe. Based in Dresden, Germany, Matthias is recognized for his collaborative approach and commitment to innovation in advanced manufacturing environments.
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.
Panelist
Tim Maloney
Senior Director of Business Development
Panel Session: Optimizing Fab Operations
Day 3 / 11:35 - 12:45
Tim Maloney is Senior Director of Business Development at Polar Semiconductor in Bloomington, Minnesota, USA — a newly transformed, majority U.S.-owned pure-play foundry delivering advanced power and sensor devices. With a heritage of high-volume automotive manufacturing and a $525M CHIPS Act-backed expansion underway, Polar is doubling capacity and capability to serve strategic markets, including automotive, data center, industrial, and aerospace and defense.
With over 25 years in the semiconductor industry, Tim has led initiatives in process engineering, fab operations, technology transfer, and global supply chain management. He is driving the efforts to bring new customers to Polar to provide accelerate leadership in US based semiconductor manufacturing.
Tim’s career started as a process engineer at Motorola Semiconductor and leadership roles at onsemi, Seagate Technology, and SkyWater Technology, covering high-voltage power devices, MEMS, and mixed-signal technologies. A graduate in Industrial Engineering from the University of Wisconsin–Madison, he combines deep technical knowledge with a strategic business perspective — making him a strong advocate for partnerships that advance power semiconductor innovation and manufacturing competitiveness worldwide.
Polar Semiconductor is a U.S.-owned MN located 200mm foundry specializing in sensor and power semiconductors, for high-volume manufacturing of silicon and wide-bandgap ICs and discrete devices, and specialty products tailored for Automotive, Industrial, and Aerospace & Defense applications.
Panelist
Christophe Maleville, Ph.D.
Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation
Panel Session: Strategic Autonomy or Global Integration? Europe’s Current and Future Semiconductor Strategy Amid Geopolitics and Supply Chains Boundaries
Day 3 / 14:40 - 15:30
Christophe Maleville has been appointed Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation.
He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer from R&D to production, and managed customer certifications. He also served as vice president, SOI Products Platform at Soitec, working closely with key customers worldwide.
Maleville has authored or co-authored more than 30 papers and also holds some 30 patents. He has a PhD in microelectronics from Grenoble Institute of Technology and obtained an executive MBA from INSEAD.
Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.
Panelist
Achim Kempe
COO
Panel Session: Strategic Autonomy or Global Integration? Europe’s Current and Future Semiconductor Strategy Amid Geopolitics and Supply Chains Boundaries
Day 3 / 14:40 - 15:30
Achim Kempe is the Chief Operating Officer at Nexperia, bringing over three decades of experience in the semiconductor industry. Based in Hamburg, he has led global operations since 2018, following senior leadership roles at NXP Semiconductors and Philips Semiconductors. His expertise spans wafer fabrication, test engineering, and business group management, with a career grounded in technical excellence and strategic leadership. Achim holds a Master’s degree from the University of Siegen and a Bachelor’s degree from FH Cologne, both in Electrical Engineering. Known for his operational insight and engineering depth, Achim continues to shape the future of semiconductor manufacturing.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
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