Deepak Kulkarni
Senior Fellow Advanced Packaging
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Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Kathy Yan, Ph.D.
Director of New Technology & System Integration, Advance Packaging and Test
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Kathy Yan, currently Director of New Technology & System Integration, Advance Packaging and Test at TSMC. She is now in charge of new CoWoS-R organic interposer technology RD development for high speed HPC application, advanced packaging mechanical and thermal simulation & validation. She has been also managing new product co-development projects for system customers, across multiple packaging architecture including InFO POP, InFO-SOW, CoWoS-S and CoWoS-R. In addition She is the key player in TSMC 3D Fabric Alliance as the Memory Eco-system program owner. Prior to joining TSMC, she spend most of her career at Intel Advanced packaging RD and Medtronic technology Center in Arizona, US. She has a PhD in Electrical Engineering and Master in Material Science from Auburn University.
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
Shinichi Yoshioka
Senior Vice President and Chief Technology Officer
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Mr. Yoshioka serves as the Senior Vice President and CTO at Renesas. He was appointed to these roles in August 2019, from his experience and technological expertise of the products and the market following the years he has dedicated to Renesas.
He began his career in Hitachi, Ltd in 1986. Since Renesas Electronics Corporation was established in 2010 based on Hitachi, Mitsubishi Electric, and NEC Electronics, he has held many key roles, such as the Vice President of Automotive Control and Analog & Power Systems Business Division, Safety Solution Business Division, and the Senior Vice President of the Automotive Solutions Business Unit.
He has a Bachelor of Engineering degree in Applied Physics from the University of Tokyo and graduated from Stanford University with a Master of Science in Electrical Engineering.
Company Profile
Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.
A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Kazunari Ishimaru
Senior Managing Executive Officer, Silicon Technology Division, IEEE Fellow
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Joined Toshiba, Semiconductor Device Engineering Labs. in 1988 and engaged in development of advanced SRAM/Logic technologies. 2006-2010: engaged in development of 32nm~20nm CMOS platform technologies with IBM as Toshiba’s representative (VP of R&D). 2013 Senior Manager of Advanced Memory Technology Development Dept. 2022 Director of Memory Technology R&D Center. Joined Rapidus Corporation in April 2023.
Company Profile
Dr. Yasumitsu Orii
Senior Managing Executive Officer, 3D Assembly Division
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Education: Osaka Univ. Osaka, Japan Bachelor 1986
Graduate School of Osaka Univ. Osaka, Japan PhD 2012
Dr. Yasumitsu Orii joined IBM Japan in 1986 and was a leading expert on Flip Chip organic packages, which had contributed to the performance improvements and miniaturization of such products as servers, laptop computers, and HDDs. The packaging technology is becoming more important for next generation server products as Moore’s Law reaches its limits. His flip chip expertise extended into many related areas. Initially, he was a pioneer of flip chip on FPC (Flexible Printed Circuit) for HDDs, which allowed the read/write amplifier ICs to be mounted on the suspension and much closer to the GMR head. Later, he developed the C2 (Chip Connection) technology that supported low-cost 50-μm-pitch flip chip bonding for the commodity consumer electronics market and it was licensed to a company in Taiwan. At IBM Research Tokyo, he was leading the next generation flip chip organic package, 3D-IC projects and Neuromorphic Computing for IBM Servers and creating new technologies under a Joint Development Program involving many leading Japanese materials companies. He left IBM in 2014 and joined NAGASE & CO., LTD. He established “New Value Creation Office” under the direct control of the president and launched the material informatics software as a service in 2020. He left NAGASE and he joined Rapidus Corporation in 2022/Dec. Now he is the senior managing executive officer to lead the 3D Assembly Division.
Company Profile
Hamid Azimi, Ph.D.
Chairman of the Board
Formerly CVP of Intel
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Dr Hamid Azimi, formerly Corporate VP, Director of Substrate Packaging TD of Intel. He was responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
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