Terushi Shimizu
Chairman
No summit linked
Company Profile
Norishige (Noly) Morimoto
VP of IBM Japan & CTO of Research & Development
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Joined IBM Japan in 1987, and later moved into IBM Research, after acquiring his master degree in EE&CS from MIT in 1995. In 2006, transferred to IBM Watson Research Center. He had served as a Director of IBM Research-Tokyo, CTO of IBM Asia Pacific Region, and VP of R&D in Japan, before becoming CTO of IBM Japan. He became Vice President of IBM Japan in 2023 and joined a member of BoD of IBM Japan in 2024.He is appointed as a member of Semiconductor and Digital Strategy Advisory Panel under the Ministry of Economy, Trade and Industry (METI).
Company Profile
Hiroshi Iwatsubo
Executive Deputy President and CTO
No summit linked
Hiroshi Iwatsubo graduated from Kyoto University, Department of Technology. He joined Murata Manufacturing Co., Ltd. in Kyoto, Japan in 1985. After engaging in the development of ceramic materials for four years, he was dispatched to Murata Europe GmbH in 1989 until his return to Murata Japan in 1993.
In 2012, he was appointed to Vice President, Head of Global Sales & Marketing
In 2015, he was appointed to Senior Executive Vice President (Board Member) Corporate Technology & Business Development Unit, In 2020, Senior Executive Vice President .
Hiroshi Iwatsubo currently serves as CTO and Executive Deputy President .
Company Profile
Rahul Manepalli, Ph.D.
Intel Fellow, VP, Director of Substrate Packaging Technology Development
No summit linked
Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and other substrate technologies. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.
Company Profile
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.
To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.
Deepak Kulkarni
Senior Fellow Advanced Packaging
No summit linked
Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
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