Yasushi Araki
Corporate Officer
No summit linked
Graduated from Applied Chemistry, Nagoya University in 1989.
1989-2000: Joined Fujitsu Ltd. Engaged in IC assembly technology.
2000-2021: Joined Shinko Electric Industries Co., Ltd. Engaged in IC Assembly technology.
From 2021: Engaged in Research and Development in the R&D Div.
Company Profile
SHINKO is a worldwide semiconductor packaging supplier with diverse technology driven initiatives and industry leading manufacturing capabilities.
Terushi Shimizu
Director and Chairman
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In April 1980, he joined Sony Corporation (renamed Sony Group Corporation in April 2021), where he served as an engineer in the semiconductor business.
From 1991, he moved to the U.S. to be engaged in planning and control of semiconductor business at Sony Electronics’ Fab.
After returning to Japan, from 1999, he was assigned to Sony Computer Entertainment Inc. as the General Manager of the planning and control department, where he was responsible for the start-up of semiconductors for PlayStation.
In 2016, he was appointed Representative Director and President of Sony Semiconductor Solutions Corporation.
From 2020 to March 31, 2025, he was Representative Director, President and CEO of the company.
From 2021 to March 31, 2025, he was Senior EVP, Officer in charge of Imaging & Sensing Solutions Business, Sony Group Corporation.
He was appointed to Director and Chairman of Sony Semiconductor Solutions Corporation as of April 1, 2025.
Company Profile
Sony Semiconductor Solutions Corporation is a wholly owned subsidiary of Sony Group Corporation and the global leader in image sensors. We strive to provide advanced imaging technologies that bring greater convenience and joy to people’s lives. In addition, we also work to develop and bring to market new kinds of sensing technologies with the aim of offering various solutions that will take the visual and recognition capabilities of both human and machines to greater heights.
Norishige (Noly) Morimoto
Vice President and Chief Technology Officer
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Norishige Morimoto is Vice President and CTO of IBM Japan, and a Board Member since 2024. He joined IBM in 1987 as a hardware engineer and earned his Master’s in EE&CS from MIT in 1995. He has held global leadership roles including Director of IBM Research-Tokyo, CTO of IBM Asia Pacific, and VP of R&D Japan. He formerly chaired the Information Processing Society of Japan and served on boards of Temple University Japan and SMBC Group. He advises METI’s semiconductor strategy panel and is a member of JAOTEX, promoting innovation and leadership in Japan’s tech ecosystem.
Company Profile
IBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. IBM’s breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients.
Visit www.ibm.com for more information.
Hiroshi Iwatsubo
CTO and Executive Deputy President
No summit linked
1985.Mar Hiroshi Iwatsubo graduated from Kyoto University, Department of Technology. He joined Murata Manufacturing Co., Ltd. in Kyoto, Japan in 1985. After engaging in the development of ceramic materials for four years, he was transferred to Murata Europe GmbH in 1989 until his return to Murata Japan in 1993.
In 2012, he was appointed to Vice President, Head of Global Sales & Marketing
In 2015, he was appointed to Senior Executive Vice President (Board Member) Corporate Technology & Business Development Unit, In 2020, Senior Executive Vice President .
Since 2024, Hiroshi Iwatsubo currently serves as CTO and Executive Deputy President.
Company Profile
Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata’s website at www.murata.com.
www.murata.com/en-global
Research, Production and Sales of Electronic Devices made from fine ceramics
Kazunari Ishimaru, Ph.D.
Senior Managing Executive Officer & CTO, IEEE Fellow
No summit linked
Dr. Kazunari Ishimaru, IEEE Fellow, is CTO and Senior Managing Executive Officer at Rapidus Corporation. He began his career at Toshiba in 1988, contributing to SRAM and logic development. As VP of R&D at Toshiba America Electronic Components, he led 32nm–20nm CMOS projects with IBM. Returning to Japan, he oversaw logic manufacturing at Toshiba Oita and emerging memory R&D at Kioxia Yokkaichi, later becoming Director of the Institute of Memory Technology R&D. He joined Rapidus in 2023 and became CTO in 2025, driving Japan’s advanced semiconductor initiatives, including 2nm logic and the RUMS model for integrated manufacturing innovation.
Company Profile
Rapidus will contribute to the fulfillment, prosperity, and well-being of people’s lives through semiconductors. We promote fab management with world-class R&D and manufacturing capabilities, collaborate with universities and research institutions to foster talents vital for semiconductor field, and further innovate toward a truly green society. Based on this corporate philosophy, we will establish new business schemes in cooperation with companies worldwide, develop and provide the world’s best cycle time reduction services, and promote creation of new industries together with our customers.
Rahul Manepalli, Ph.D.
Intel Fellow & Vice President : Advanced Packaging Technology Development
No summit linked
Dr. Rahul Manepalli is an Intel Fellow, Vice President and Director of the Substrate & Wafer Assembly Technology Development organization in Intel. He currently leads the IC substrate technology development and 3DIC wafer assembly technology development teams in Intel’s Advanced Packaging Technology and Manufacturing Organization. He and his team are driving the pathfinding & development of materials, processes and equipment for the next generation of substrate, wafer level assembly technologies. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB/EMIB-T), Panel ODI, Glass core substrate, Foveros (Solder and HBI die to wafer interconnect) technologies. Over his 25+ year career at Intel, Rahul has also held leadership roles in Intel’s assembly materials development and pathfinding teams leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 250 patent publications in semiconductor packaging, over 50 technical papers and invited talks. He has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.
Company Profile
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.
To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.
Deepak Kulkarni, Ph.D.
Senior Fellow Advanced Packaging
No summit linked
Deepak Kulkarni is a Senior Fellow at Advanced Micro Devices (AMD), where he leads the Instinct and Optics Technology Development team. In this role, he develops heterogeneous architectures for AMD’s AI accelerator products and oversees Photonics technology development.
With twenty years in technology development, Deepak has led the development of several innovative technologies such as panel-level fan-out, Embedded Multi-die Interconnect Bridge (EMIB), Elevated Fan-Out Bridge (EFB), and 3.5D packaging solutions. Recognized with top awards at both AMD and Intel, and a frequent voice on high-level industry panels, Deepak brings both technical depth and strategic vision to advancing heterogeneous integration.
Deepak’s technical interests cover Co-packaged Optics, Panel-level packaging, and design-technology co-optimization. He holds forty patents and has published over twenty papers. He earned his PhD in Mechanical Engineering with a minor in Computational Science from the University of Illinois at Urbana-Champaign.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
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