Sung Jin Kim, Ph.D.
CTO
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Dr. Kim is the CTO of Absolics, a spun-off semiconductor packaging business from SK Group in the USA. With 31 years of experience in the semiconductor and microelectronic packaging industry, Dr. Kim leads new technology and business development for advanced semiconductor packaging solutions at Absolics. Prior to Absolics, he held executive positions in various companies and countries, including SKC, Georgia Institute of Technology, Foxconn Advanced Technology, Daeduck Electronics, UTAC, and Amkor Technology. Throughout his career, Dr. Kim managed package engineering, substrate manufacturing, and embedding component microelectronic package engineering. He has over 200 US patents and holds a doctorate in electrical engineering from the Technical University of Dresden, Germany.
Company Profile
Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally.
Liron Gantz, Ph.D.
Research Staff Member
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Dr. Liron Gantz has led Nvidia’s Electro-Optics group (NVEO) for the past six years, driving advancements in silicon photonics for Co-Packaged Optics products. He completed his Ph.D. in 2017. In 2016 he joined Mellanox, where he established the electro-optics lab for device characterization. He quickly transitioned into leadership roles, specializing in the design, characterization, and modeling of silicon photonic technologies. Dr. Gantz and his team have been instrumental in the Nvidia CPO project, from its inception to chip development and system bring-up. Dr. Gantz is now a Principal Research Scientist in Nvidia’s research organization. With a strong foundation in Quantum Mechanics, Nanotechnology, and Optics, he has published in leading journals such as Science and Physical Review Letters, highlighting his contributions to the semiconductor industry.
Company Profile
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.
Dae-Woo Kim, Ph.D.
Corporate VP, Head of PKG Development Team
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Dae-Woo Kim, Corporate VP at Samsung Electronics for 7 years with advanced package technology and product development. In his current position, Dae-Woo is leading the system package lab for product & technology development including 2.xD, 3D, FOWLP and FOPLP technology.
Prior to joining Samsung Electronics, he was a TD Engineering manager at Intel ATTD, Chandler Arizona. During 14 years of experience at Intel, he worked on CPI area, assembly test chip design, Si bridge design and package process & design integration for CPU flip chip package, EMIB, and Foveros technology.
Dr. Kim received a Ph. D., Master and bachelor degree in Material Science Engineering from Yonsei University, Seoul, S. Korea, Country and he was a research faculty in III-V semiconductor field for 3 years at Arizona State University, Tempe, AZ.
Company Profile
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.
Kangwook Lee, Ph.D.
SVP and Head of Packaging Development
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Dr. Lee has been one of critical leaders who are leading the era of 3D TSV stack memory such as HBM (High Bandwidth Memory) in semiconductor industry.
He has contributed broadly to, and led teams in, 3D integration/packaging R&D including core technology/product development/reliability study and mass production for HBM over 27 years.
Dr. Lee received the Ph.D. degree in machine intelligence and systems engineering from Tohoku University, Japan, in 2000. During his doctoral research at Tohoku University,Dr. Lee proposed a new 3D-IC integration technology to achieve 3D devices with high performance and multi-functionality, leading this field in the world.
From 2001 to 2002, he was a Postdoctoral Researcher with the Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA.
He worked with Memory Division, Samsung Electronics Ltd., Korea, as a Principal Engineer from 2002 to 2008.
From 2008 to 2016, he worked with the New Industry Creation Hatchery Center (NICHe), Tohoku University, Japan, as a Professor.
From 2017 to 2018, he worked with R&D center, Amkor Technology Korea, as a VP.
He joined SK hynix 2018 and currently Senior VP, Head of PKG Development at SK Hynix, Korea.
Dr. Lee has led many interdisciplinary R&D programs on 3D integration, including integration of various materials and devices to achieve 3D devices/systems with high performance and new functionality, 3D-IC reliability research to investigate the impacts of 3D integration on the device performance and reliability, unique hybrid integration of nano-materials with Si, and product development of 3D stack DRAM such as high-bandwidth memory (HBM). For over 27 years at universities and industries in Japan, US, and Korea, Dr. Lee has made exceptional technical contributions to and lasting impacts on 3D integration technology and 3D product development in broad fields, such as material science, materials characterization/analysis, semiconductor device/process, electrical packaging, and Si micro-machining.
Dr. Lee has authored more than 230 scientific publications (peered journals, international conferences), co-edited 4 books, and given 43 tutorial/invited/keynote talks in international conferences including IEEE IEDM, IEEE IRPS, VLSI Symposium, plus 23 US patent publications.
He has served as a frequent reviewer for a number of journals, including IEEE EDL, IEEE T- ED, IEEE CPMT, and technical program committees of international conferences, including IEEE ECTC, IEEE IRPS, IEEE EDTM, IEEE 3D SIC.
He is a Senior Member of IEEE.
Company Profile
An AI First Mover Leading the Global AI Memory Era
With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees.
Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in pursuit of more social value and a healthier governance structure.
SK hynix will grow into a Full Stack AI Memory Provider, offering customized solutions tailored to the diverse needs of global customers, covering both DRAM and NAND flash, in the era of full-scale AI.
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