Kuan-Neng Chen, Ph.D.
Dean/Chair Professor
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Dr. Kuan-Neng Chen is Dean of International College of Semiconductor Technology and Chair Professor at Institute of Electronics at National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, as well as his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). Dr. Chen has held several prominent positions including Vice President for International Affairs, Associate Dean of International College of Semiconductor Technology at NYCU, Program Director of the Micro-Electronics Program at National Science and Technology Council in Taiwan, Adjunct R&D Director at Industrial Technology and Research Institute (ITRI), and Research Staff Member at IBM Thomas J. Watson Research Center.
Dr. Chen has received numerous awards and honors throughout his career, including IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST/NSTC Outstanding Research Award (twice), MOST/NSTC Futuristic Breakthrough Technology Award (twice), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored over 400 publications, including 3 books and 7 book chapters, and holds 88 patents. Dr. Chen served as Guest Editor for the MRS Bulletin, IEEE Transactions on Components, Packaging, and Manufacturing Technology, and Materials Science in Semiconductor Processing, and has held leadership roles in various conferences and committees, such as IEEE IITC General Chair. Dr. Chen is Fellow of National Academy of Inventors (NAI), IEEE, IET, IMAPS, and CIEE and member of Phi Tau Phi Scholastic Honor Society.
Additionally, Dr. Chen is Specially Appointed Professor at Institute of Tokyo Science (previously Tokyo Tech). His current research interests focus on three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
Company Profile
NYCU was founded on the idea that, in a great university, people work across the disciplines to solve real-world problems. At our university, putting this idea into practice requires integrating Chiao Tung’s strengths in information and communications technology with Yang Ming’s strengths in biomedical research. It also requires contributing to fields located at the intersection of these research areas, for example, digital medicine and bioinformatics. And it requires training our students in such a way that the next generation will not be as constrained by disciplinary boundaries as the previous one.
At NYCU, we are striving to be a great university that transcends disciplinary divides to solve the increasingly complex problems that the world faces. We will continue to be guided by the idea that we can achieve something much greater together than we can individually. After all, that was the idea that led to the creation of our university in the first place.
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