Joris Van Campenhout
R&D Program Director
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Joris Van Campenhout is Fellow Silicon Photonics at imec and senior director of imec’s industry-affiliation R&D program on Optical I/O, which targets the development of scalable short-reach optical interconnect technology based on silicon photonics. Prior to joining imec in 2010, he was with IBM’s TJ Watson Research Center (USA), where he developed silicon electro-optic switches. He obtained a PhD degree in Electrical Engineering from Ghent University (Belgium) in 2007, for his work on heterogeneous integration of InP lasers on silicon. Joris has been granted 15+ patents and has authored or co-authored over 100 papers in the field of silicon integrated photonics, which have received 15000+ citations.
Company Profile
Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2021, imec’s revenue (P&L) totaled 732 million euro.
Further information on imec can be found at www.imec-int.com.
C.S. Yoo, Ph.D
Vice President, Research & Development / More-than-Moore Technologies
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C.S. is a 30+ years’ veteran of semiconductor industry.
Ever since joined TSMC, he has been working in various technology R&D fields and Operations.
He took various managerial positions in RD Process Module, SRAM, DRAM and Embedded DRAM.
CS also led TSMC Mask RD and Operation Division before taking the position of VP in Specialty Technology RD.
CS received his PhD in Chemical Engineering from WPI (Worcester Polytechnic Institute)
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
Kam Lee
Senior Director, Advanced Packaging Technology and Service
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Kam currently serves as Senior Director at TSMC Advanced Packaging Technology and Service, which he joined in 2022. He specifically manages the TSMC Testing RD, Testing operations and backend turnkey operations. He has extensive experience in semiconductor industry, having worked 27 years at Intel, in various roles in technology development, product development and high volume manufacturing. He previously held the role of Vice President of Intel product development and engineering.
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
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