Yu-Hua Chen, Ph.D.
VP Carrier SBU/RD Division
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Education:
- Ph.D. Chemistry, 2001, National Taiwan University
Experience:
- 2012~2021, Vice President, Unimicron Technology Corp.
- Advanced substrate, panel level RDL and glass substrate Technology
- 2001~2012, Deputy R&D Director. ITRI/EOSL
- 3DIC, wafer level stacked & 8” and 12” CIS TSV package technology
- Chip embedded in rigid and flexible substrate technology
- Flexible LED lighting package technology
Company Profile
Founded in 1990, Unimicron is a world leading company of printed circuit board (PCB) and IC carrier (substrate) manufacturing. Major products include PCBs, high density interconnection (HDI) boards, flexible PCBs, rigid flex PCBs, and IC substrates. Product applications include AI, HPC data center infrastructure (server, networking), smartphones, PC/NB, optical modules, automotive and more. Unimicron’s global footprint encompass manufacturing sites and/or service centers in Taiwan, China, Germany, Japan and Thailand, delivering high value-added, high quality and high productivity innovation and services to our global customers.
Unimicron’s high-end substrate solutions, FCBGA and FCCSP, provide our valued customers the technologies crucial in meeting today’s fast-growing development of AI, HPC applications. Our customer-oriented service, high quality standards, and innovative breakthroughs have helped Unimicron achieve the honor of No.1 ranking among the global substrate suppliers by market share for the 9th consecutive year since Y2016.
Yu-Po Wang, Ph.D.
Vice President, R&D Center
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Yu-Po Wang received Ph.D. in Mechanical Engineering from Binghamton University, State University of New York , U.S.A.
In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore.
He joins SPIL in 1998 and leads the R&D Package Application and Technology Support Team in substrate/package design, material characterization and advanced package.
Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has over 83 patents in US.
IEEE Electronics Packaging Society Board of Governors (BoG) member from 2025
IEEE Electronics Packaging Society Taipei Chapter Executive Committee from 2025
Company Profile
Kuan-Neng Chen, Ph.D.
Dean/Chair Professor
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Dr. Kuan-Neng Chen is Dean of International College of Semiconductor Technology and Chair Professor at Institute of Electronics at National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, as well as his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). Dr. Chen has held several prominent positions including Vice President for International Affairs, Associate Dean of International College of Semiconductor Technology at NYCU, Program Director of the Micro-Electronics Program at National Science and Technology Council in Taiwan, Adjunct R&D Director at Industrial Technology and Research Institute (ITRI), and Research Staff Member at IBM Thomas J. Watson Research Center.
Dr. Chen has received numerous awards and honors throughout his career, including IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST/NSTC Outstanding Research Award (twice), MOST/NSTC Futuristic Breakthrough Technology Award (twice), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored over 400 publications, including 3 books and 7 book chapters, and holds 88 patents. Dr. Chen served as Guest Editor for the MRS Bulletin, IEEE Transactions on Components, Packaging, and Manufacturing Technology, and Materials Science in Semiconductor Processing, and has held leadership roles in various conferences and committees, such as IEEE IITC General Chair. Dr. Chen is Fellow of National Academy of Inventors (NAI), IEEE, IET, IMAPS, and CIEE and member of Phi Tau Phi Scholastic Honor Society.
Additionally, Dr. Chen is Specially Appointed Professor at Institute of Tokyo Science (previously Tokyo Tech). His current research interests focus on three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
Company Profile
NYCU was founded on the idea that, in a great university, people work across the disciplines to solve real-world problems. At our university, putting this idea into practice requires integrating Chiao Tung’s strengths in information and communications technology with Yang Ming’s strengths in biomedical research. It also requires contributing to fields located at the intersection of these research areas, for example, digital medicine and bioinformatics. And it requires training our students in such a way that the next generation will not be as constrained by disciplinary boundaries as the previous one.
At NYCU, we are striving to be a great university that transcends disciplinary divides to solve the increasingly complex problems that the world faces. We will continue to be guided by the idea that we can achieve something much greater together than we can individually. After all, that was the idea that led to the creation of our university in the first place.
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