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Dr. Raja Swaminathan

  • CVP, Advanced Packaging
  • AMD

Dr. Raja Swaminathan is AMD’s CVP of Packaging driving the development of AMD’s industry leading advanced packaging roadmap. At Intel, Apple, and now AMD, his design-technology co-optimization expertise and relentless pursuit of PPAC optimization (power, performance, area, and cost) have fueled breakthroughs like EMIB, Apple’s Mx packages, 3D V-Cache, and the recently announced 3.5D architectures for AI. A Carnegie Mellon PhD and IIT Madras alumnus, Raja has over 100 patents and 40 publications. Recognized as an IEEE Senior Member and trusted advisor to startups, Raja’s passion for heterogeneous integration is consistently pushing capabilities of silicon.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Naga Chandrasekaran

Naga Chandrasekaran is senior vice president of technology development at Micron Technology. Dr. Chandrasekaran leads Micron’s global technology development and engineering efforts related to the scaling of current memory technologies, advanced packaging technology, as well as investigating emerging memory technology solutions to support Micron’s future requirements. He also manages mask technology development, corporate characterization labs, advanced modeling and data analytics, and R&D fabrication operations at Micron’s headquarters in Boise, Idaho. He was appointed to his current position in 2019.

In 2001, Dr. Chandrasekaran joined Micron as a CMP development engineer and since then has held a series of positions of increasing responsibility in process and equipment development across multiple R&D process areas, leading manufacturing and technology transfer efforts, integration of new business units, and development of solar, LED and display technology. From 2007 to 2008, he also served as fab engineering manager for IM Flash, Singapore Operations. He most recently served as senior vice president of process research and technology development.

Dr. Chandrasekaran has authored several keynote publications and patents, and he has served as an invited panel speaker at several conferences. He has also received several awards, including Jiri Tlusty Outstanding Young Manufacturing Engineer of the Year, awarded by the Society of Manufacturing Engineers in 2003, and Engineering Manager of the Year, awarded by the American Society of Engineering Management (ASEM) in 2018.

Dr. Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras. He earned both a master’s and a doctorate degree in mechanical engineering from Oklahoma State University and dual executive MBAs from the University of California, Los Angeles (UCLA-Anderson School of Management) and the National University of Singapore.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Dr. Jun He

  • VP Quality & Reliability, Advanced Packaging Technology & Service
  • TSMC

Dr. Jun He is Vice President of Quality & Reliability as well as Advanced Packaging Technology & Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system and the Company’s backend business and operations management. Within the Q&R scope, his function covers incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Besides overseeing all TSMC advanced packaging and testing manufacturing, his backend team is also accountable for key building blocks including bump/passivation/RDL process innovations and test technology development. Seamless collaboration and joint development with external partners across material, OSAT and substrate supply chain is one of his focus areas to enable customers’ product innovations at system level.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations.

Dr. He holds over 40 patents globally and published 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Dr. Babak Sabi

  • SVP & GM Assembly and Test Technology Development
  • Intel

Dr. Babak Sabi is a Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development.

Babak joined Intel in 1984. Prior to leading ATTD, he oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.

Babak received his Ph.D. in solid state electronics from Ohio State University in 1984. He has authored ten papers on reliability physics and has received five Intel Achievement Awards. He currently holds two patents.

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Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Thomas Sonderman

Thomas Sonderman is the president and CEO of SkyWater Technology, a U.S.-owned and operated pure-play semiconductor manufacturer and a DOD-accredited Trusted supplier. He joined SkyWater in 2017 as the lead executive, driving the company’s successful business transformation from an IDM to a pure play foundry. He has effectively diversified SkyWater’s customer base by defining new product markets and target customers while simultaneously improving operational efficiencies. Mr. Sonderman has leveraged SkyWater’s U.S-based manufacturing operations to expand the company’s government business and to focus on reinstating a strong domestic commercial manufacturing presence. He has built a world class leadership team that inspires over 500 employees to deliver process R&D innovation and operational excellence.

Mr. Sonderman’s extensive industry experience in all aspects of fab operations has delivered market leadership and increased shareholder value to high-technology industry leaders Rudolph Technologies, Globalfoundries and AMD. Notably, he played a critical role serving as part of an executive team at AMD that spun-off manufacturing operations to form Globalfoundries.

A widely recognized subject matter expert, Mr. Sonderman is the author of 50 patents and a highly sought-after industry speaker. He received a Bachelor of Science degree in chemical engineering from Missouri University of Science Technology and a Master of Science degree in electrical engineering from National Technological University.

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SkyWater Technology

SkyWater (NASDAQ: SKYT) is a U.S.-owned semiconductor manufacturer and a DOD-accredited Trusted supplier. SkyWater’s Technology as a Servicesm model streamlines the path to production for customers with development services, volume production and advanced packaging solutions in its world-class U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology with diverse categories including mixed-signal CMOS, read-out ICs, rad-hard, power discretes, MEMS, superconducting ICs, photonics, carbon nanotubes and interposers. SkyWater serves growing markets including aerospace & defense, automotive, biomedical, cloud & computing, consumer, industrial and loT. For more information, visit: www.skywatertechnology.com.

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