Ravi Mahajan is an Intel Fellow responsible for Assembly and Packaging Technology Pathfinding for future silicon nodes. Ravi also represents Intel in academia through research advisory boards, conference leadership and participation in various student initiatives. He has led Pathfinding efforts to define Package Architectures, Technologies and Assembly Processes for multiple Intel silicon nodes including 90nm, 65nm, 45nm, 32nm, 22nm and 7nm silicon. Ravi joined Intel in 1992 after earning his Ph.D. in Mechanical Engineering from Lehigh University. He holds the original patents for silicon bridges that became the foundation for Intel’s EMIB technology. His early insights have led to high-performance, cost-effective cooling solutions for high-end microprocessors and the proliferation of photo-mechanics techniques for thermo-mechanical stress model validation. His contributions during his Intel career have earned him numerous industry honors, including the SRC’s 2015 Mahboob Khan Outstanding Industry Liaison Award, the 2016 THERMI Award from SEMITHERM, the 2016 Allan Kraus Thermal Management Medal & the 2018 InterPACK Achievement award from ASME, the 2019 “Outstanding Service and Leadership to the IEEE” Awards from IEEE Phoenix Section & Region 6 and most recently the 2020 Richard Chu ITherm Award and the 2020 ASME EPPD Excellence in Mechanics Award. He is one of the founding editors for the Intel Assembly and Test Technology Journal (IATTJ) and currently VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT. He has long been associated with ASME’s InterPACK conference and was Conference Co-Chair of the 2017 Conference. Ravi is a Fellow of two leading societies, ASME and IEEE. He was elected to the National Academy of Engineering in 2022 for contributions to advanced microelectronics packaging architectures and their thermal management.

Jeff is an international purchasing executive recognized as an industry leader. He is a published author with six books to his credit. Jeff has been selected as one of the “Pros to Know” by Supply & Demand Chain Executive Magazine in 2002, 2004, 2007, 2012 and was a recipient of a team award in 2013 and 2015. Jeff is currently the senior vice president and chief procurement office at NXP Semiconductors, and formerly held the role as the corporate vice president, chief procurement officer at Advanced Micro Devices (AMD). He also served as faculty associate of supply chain management at Arizona State University, W.P. Carey School of Business. Previously, Jeff was the vice president, chief procurement officerat ON Semiconductor, senior director of integrated supply chain at Honeywell Aerospace; founder and president of LSC Consulting Group – an independent professional consulting service specializing in lean supply chain management; vice president and general manager modular systems, and vice president corporate procurement and materials for Donnelly Corporation; and director of worldwide purchasing for TRW.

Josef Berger has more than 20 years of experience in high-speed optics. He is the Associate Vice President, Cloud Optics Marketing at Marvell. In this role, Josef is focused on next generation data center interconnect solutions. Prior, Josef was the Associate Vice President Marketing, Optical Interconnect at Inphi, which was acquired by Marvell. Previous to Inphi, he was the Chief Commercial Officer at Optical Zonu, an analog fiberoptic systems company, developing wireless solutions for US carriers and government agencies. Josef also held roles at Source Photonics serving as its Vice President of Global Sales, Marketing and Business Development and was Director of Product Marketing at Opnext, which later merged with Oclaro. He holds a B.S. degree in Engineering Physics from the University of Applied Sciences Munich and a M.S. degree in Physics from San Diego State University. Josef is an alumnus of the Harvard Business School, Program for Leadership Development.