27-28 August 2025
Suwon
8-9 April 2025 - Silicon Valley
SVP and GM Foundry Services
Day 1 / 09:10 - 09:30
The shifting landscape of technology requires a multi-faceted foundry approach to keep pace with increasing workload of data centers and high-performance computing (HPC) systems. The use of chiplets and “system of chips” offer a way to unlock exponential improvements in semiconductor products. Intel Foundry is addressing these needs with decades of experience in world class manufacturing, innovative advancements in packaging and system technology optimization, delivered through a more resilient and more sustainable global supply chain. Join us as we outline how Intel Foundry is tackling the next wave of semiconductor breakthroughs.
Kevin O’Buckley is senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet standards and software, as well as U.S.- and Europe-based capacity.
Prior to joining Intel, O’Buckley was senior vice president of Marvell’s Compute and Custom Solutions Engineering teams, developing advanced technology chips for infrastructure applications including artificial intelligence and machine learning, 5G wireless, and data center compute and networking. While at Marvell he also served as senior vice president and general manager of the company’s ASIC business, and he was a member of the board of directors at Marvell Government Solutions, developing semiconductor solutions for aerospace and defense customers.
O’Buckley joined Marvell as part of its 2019 acquisition of Avera Semiconductor, where he served as chief executive. He has also held various executive engineering and business leadership roles at Global Foundries and at IBM, where he served for more than 17 years leading technology development and manufacturing organizations.
Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards. Intel Foundry is an independent foundry business that meets our customers’ unique product needs, including our industry-leading sort and test capabilities. Whether front-end or back-end design is needed, when integrated with our foundry co-optimized development kits based on industry-standard tools and flows and powerful silicon IPs, the result is true innovation.
Head of Custom Silicon Engineering Operation
Day 2 / 08:30 - 08:50
AI agents are already making waves by improving known applications that long been used by engineers, developers and every day ordinary users. Semiconductor manufacturing alike has been impacted in the areas of data analytics , traceability, commonality study , corner case identification and more. this presentation will go over some of those AI use cases.
Bizhan Delgoshaei leads custom silicon engineering operation at google in charge of Tensor manufacturing, test and quality. His career spans over two decades ramping leading edge semiconductor products (FPGA, Memory and Storage, SoC and PMIC, Security Chips and more) from new product introduction to high volume manufacturing. Bizhan has led product engineering , supplier quality engineering and engineering operation organizations in Fabless Semiconductor companies such as Altera, Apple and Google. He holds a masters degree in VLSI from University of Southern California and BS in Electrical Engineering from Sharif University of Technology, Tehran Iran.
A problem isn’t truly solved until it’s solved for all. Googlers build products that help create opportunities for everyone, whether down the street or across the globe. Bring your insight, imagination and a healthy disregard for the impossible. Bring everything that makes you unique. Together, we can build for everyone.
Head of DSRA-PKG
Day 1 / 13:40 - 14:20
Dr. Vincent (WooPoung) Kim is the Corporate EVP, Head of Packaging at Samsung Device Solutions Research America based in San Jose, California. Dr. Kim is responsible for leading the packaging division at Samsung Device Solutions Research America, dedicated to meeting industry’s needs for advanced chip packaging in high-performance systems. Prior to joining Samsung, he served as a System Architect for Signal Integrity and Power Integrity at Apple, where he played a crucial role in developing consumer computers. Before his tenure at Apple, Dr. Kim worked as an SI Manager in Snapdragon packaging at Qualcomm. Prior to that, he was a Co-Design Engineer in the Wireless Business Unit of Texas Instruments, where he specialized in optimizing the electrical design of OMAP packages and systems. Dr. Kim also gained valuable experience as an SI Engineer at Rambus, where he designed and analyzed memory systems.
Dr. Kim received his Ph.D degree in Electrical and Computer Engineering (ECE) at Georgia Tech in 2004, and his M.S. & B.A. degrees from KAIST, Korea in 1999 and 1997.
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.
VP & GM
Day 2 / 11:30 - 11:50
The scalability of new AI models is increasingly constrained by current architectures, particularly the limitations imposed by the number of GPUs that can fit inside a single rack. Moving optical attach directly to the GPU enables scale-up domains of more than 512, overcoming these bottlenecks and providing a path for the next generation of foundation models. Over the past five years, Broadcom’s significant investment over the past five years in Co-Packaged Optics (CPO), is paving the way for optical I/O from the GPUs at cost parity to traditional copper interconnects. The presentation will highlight the benefits of Broadcom’s development strategy, focusing on key decisions such as edge coupling and external lasers, core technology innovations such as a detachable fiber connector, and large-scale manufacturing through automated assembly and test.
Day 2 / 13:05 - 14:00
Dr. Near Margalit has held several executive positions in the optical connectivety industry. He founded Zaffire Inc., a metro DWDM Optical Networking company before moving on to lead Source Photonics as CEO from 2002-2013, growing the company to one of the premier optical transceiver vendors. He was the CTO and Head of Product Development for Intel’s Silicon Photonics for the commercial introduction of Silicon Photonics in 2015-2016. From 2018 to present he has been with the Optical Systems Division of Broadcom where he is currently the VP and General Manager of the division. He holds a Ph.D in Optoelectronics from UC Santa Barbara and a B.S. in Applied Physics from CalTech.
Broadcom Inc. designs, develops, and markets digital and analog semiconductors. The Company offers wireless RF components, storage adapters, controllers, networking processors, switches, fiber optic modules, motion control encoders, and optical sensors. Broadcom markets its products worldwide.
Director, LinkX Products
Day 2 / 11:05 - 11:25
Day 2 / 13:05 - 14:00
Ashkan Seyedi received a dual bachelor’s in electrical and computer engineering from the University of Missouri-Columbia and a Ph.D. from University of Southern California working on photonic crystal devices, high-speed nanowire photodetectors, efficient white LEDs, and solar cells. With a decade of industry experience at Intel, Hewlett Packard Enterprise and now NVidia, Dr. Seyedi has been working on developing high-bandwidth, efficient optical interconnects for exascale, and high-performance computing applications.
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.
VP Package Engineering , SK Hynix, America
Day 1 / 10:40 - 11:00
As the requirement of processing data in Artificial Intelligence (AI) grows exponentially, a large capacity and high bandwidth in memory technology plays a pivotal role in the integrated AI system performances. High bandwidth memories (HBMs) has been great solutions since 2017 when HBM2 was implemented in nVIDIA P100/V100. Currently, 6th generation HBM, HBM4 is in development.The continued scaling of HBM to increase memory capacity and bandwidth and additionally to enhance thermal performance has been great challenges and required the evolutions of 3D stacking technologies. In this presentation, HBM stacking technology innovations and roadmap will be presented. HBM stacking challenges associated with next generation advanced packaging technologies will be discussed.
Day 1 / 13:40 - 14:20
Dr. Jaesik Lee is Vice President of Package Engineering at SK hynix America. In this role, Jaesik is responsible for the research and development of advanced packaging for next generation High Bandwidth Memory (HBM) and pathfinding initiatives which enrich SK hynix’s innovations. He also focuses on the collaborations with customers to overcome HBM challenges associated with System in Packages (SIPs).
Prior to joining SK hynix America, Jaesik has held various key technical positions through Meta, Google, Nvidia, and Qualcomm where he drove advanced packaging technology developments, Packaging and System Co-optimization, and Manufacturing in Mobile, AI, and HPC applications. He received a PhD in mechanical engineering from University of Waterloo.
An AI First Mover Leading the Global AI Memory Era
With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees.
Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in pursuit of more social value and a healthier governance structure.
SK hynix will grow into a Full Stack AI Memory Provider, offering customized solutions tailored to the diverse needs of global customers, covering both DRAM and NAND flash, in the era of full-scale AI.
VP, Advanced Packaging Technology Development
Day 1 / 11:05 - 11:25
HBM is fueling extraordinary demands of compute in AI era. In this talk, we will explore innovations that will be critical to driving HBM roadmap.
Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He leads a global team that is responsible for delivering advanced memory packaging solutions for HBM, high performance compute and AI/ML applications. Dr. Singh joined Micron in 2006 as an interposer materials engineer and since then has held number of positions of increasing responsibility in packaging design, integration and technology development. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA.
Dr. Singh has authored several keynote publications and patents and has served as an invited panel speaker at several conferences. Dr. Singh holds master’s and doctorate degrees in mechanical engineering from Louisiana State University, bachelor’s degree in mechanical engineering from Maharaja Sayajirao University and is a graduate of the Stanford Graduate School of Business Executive Program.
Education:
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
CVP, Advanced Packaging
Day 2 / 08:55 - 09:15
Chiplet architectures are fundamental to the continued economic viable growth of power efficiency of AI hardware and edge computing. The slowing of Moore’s law has also placed advanced packaging at the critical juncture of technology-architecture intersection driving unique product capabilities. New heterogeneous architectures like 2.5D architectures and 3D Hybrid bonded architectures driving AMD’s industry leading advanced technology roadmap to enable power, performance, area, and cost (PPAC) will be discussed. Other topics including Chiplets for AI, challenges and solutions for large chiplet modules etc. will also be discussed.
Day 1 / 13:40 - 14:20
Dr. Raja Swaminathan is the Corporate Vice President of Packaging at AMD, spearheading the development of AMD’s advanced packaging and heterogeneous integration roadmap. With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan’s expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple’s Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators. Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to their name, Dr. Swaminathan was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology.
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Director, Global Supply Chain
Day 2 / 14:20 - 14:30
Supply Chains are evolving beyond traditional models. Long-term growth and profitability demands that companies transcend market fluctuations, navigate geopolitical shifts, and leverage technological advancements. Future success necessitates a robust ability to not only withstand and adapt to constant change, but to leverage resiliency as a competitive advantage, thus, ensuring businesses remain prominent even amid uncertainty. As we approach tomorrow’s markets, organizations must integrate advanced technologies like Big Data, AI, machine learning, E2E system transparency, and even autonomous drones to differentiate themselves from competitors. Key considerations include shifting from legacy solutions to future needs, examining cases like global substrate challenges during COVID-19 and the impact of geopolitical tensions on High Bandwidth Memory supply chains. Emerging trends in digital transformation—such as intelligent operational systems, end-to-end visibility, and dynamic sourcing strategies—are essential for tomorrow’s Best-in-Class supply chains. The ability to pivot quickly and recognize unforeseen opportunities is critical. True agility involves not only adapting to known demands but proactively seizing new, unanticipated opportunities, ultimately driving faster growth, stronger collaboration, and higher resilience.
Day 2 / 15:55 - 16:35
Stuart Love recently joined DSV Inventory Management Solutions (IMS) in Q4 2024 as the Director of Special Projects. He brings a wealth of knowledge and experience from his 19-year career at Intel Corporation. During his tenure at Intel, Stuart held various leadership roles throughout the Global Supply Chain, ranging from Global Planning of Assembly Materials, Assembly Equipment Sourcing leadership, Business Intelligence Systems development, Global Sourcing, Inventory optimization / procurement and most recently as the Director of Memory Sourcing & Strategy for Intel. Stuart’s broad experience and depth of knowledge within Supply Chain and Semiconductor is paired with collaborations with ASU & APICS. He holds degrees in both Marketing and Production Operations Management from University of New Mexico.
For over 20 years and a global network of 4,000+ suppliers, DSV Inventory Management Solutions have helped companies turn their supply chains into a competitive differentiator. By integrating our inventory management operations and supply chain finance program with automation, AI, and data analytics, we streamline processes, boost efficiency, and improve visibility throughout your supply chain — delivering uninterrupted revenue operations and maximizing working capital efficiency.
With the success of our solution, we were recently recognized by Intel as a 2024 Intel EPIC Distinguished Supplier
“As one of the 27 Distinguished Supplier Award recipients in 2024, DSV stands out among suppliers in Intel’s trusted supply chain,” said Keyvan Esfarjani, chief global operations officer at Intel. “Through their relentless drive to improve, they have achieved a level of performance that consistently exceeds Intel’s expectations and serves as a benchmark across the ecosystem.”
The Intel EPIC Distinguished Supplier Award recognizes a consistent level of strong performance across all performance criteria. Of the thousands of Intel suppliers around the world, only a few hundred qualify to participate in the EPIC Supplier Program. The EPIC Distinguished Award is the second-highest honor a supplier can achieve. In 2024, only 27 suppliers in the Intel supply chain network earned this award.
Dept. Head Electrical Engineering
Day 1 / 11:30 - 11:50
Moore’s law has helped us for 5+ decades through monolithic integration with doubling of transistors every two years. With the introduction of deep learning in 2012, compute demand has been out pacing Moore’s law. Progress in AI over the last decade has been hardware driven with large scale models exploiting the large transistor connectivity available. More recently there appears to be a shift towards developing software efficiencies, along with hardware advances. Nevertheless, the need for more and more transistors will never cease, and hence continuation of Moore’s law becomes a necessity. Heterogenous Integration (HI) is taking the front seat to continue Moore’s law.
But is HI ready to take on this challenge for the next decade? Are we geared towards saving our planet from an energy crisis? What are some of the key technologies that we need to focus on for HI? This presentation will address some of these questions by focusing on challenges as well as recent progress.
Madhavan Swaminathan is the Department Head of Electrical Engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center chimes.psu.edu. Prior to joining Penn State, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC) – a graduated NSF-Engineering Research Center (ERC), Georgia Tech (GT). Prior to GT, he was with IBM working on packaging for supercomputers. Prof. Swaminathan’s interdisciplinary research on semiconductor packaging and systems integration over the years have resulted in 650+ technical publications, 200+ invited presentations (seminars, keynotes, panels), 3 books, 5 book chapters, 31 patents, 33 best paper and student paper awards, 5 GT awards, 2 start-ups, and several international recognitions with the recent one being the 2024 IEEE Rao R. Tummala Electronics Packaging Award (technical field award) for “contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems”. He is also the founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is a Fellow of IEEE, Fellow of the National Academy of Inventors (NAI), Fellow of Asia-Pacific Artificial Intelligence Association (AAIA), and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. He received his MS and PhD degrees in Electrical Engineering from Syracuse University, USA.
There’s a reason Penn State consistently ranks among the top one percent of the world’s universities. Across 24 campuses, our nearly 88,000 students and 17,000 faculty and staff know the real measure of success goes beyond the classroom—it’s the positive impact made on communities across the world. From access to state-of-the-art resources to interdisciplinary pursuits in collaborative atmospheres, a Penn State degree is more than an education. The experiences and knowledge gained here will form the foundation for the lives our students build. Their contributions to the world begin with a Penn State degree. We Are Penn State.
CVP, Chiplets/FCBGA/fcCSP BU
Day 1 / 11:55 - 12:15
Roger has more than 30 years of experience in the semiconductor industry and became part of Amkor in 2003. During his tenure at Amkor, he has taken on various leadership positions, and he currently oversees the Chiplet /FCBGA/fcCSP business unit, along with its associated packaging technologies. Prior to joining Amkor, Roger worked at Digital Equipment Corporation and Microchip Technology. He earned a Bachelor of Science in Electrical Engineering from the University of Massachusetts and a Master of Science in Materials Science from Stanford University. Additionally, Roger is an inventor on more than 70 patents related to semiconductor processing, packaging, and applications.
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Fellow, Industry and Customer Collaboration
Day 1 / 15:55 - 16:15
Last year, we emphasized how packaging interconnect density requirements are driving new technologies, challenges, and solutions in the Advanced Packaging industry.
In this year’s talk, we will review front-end and packaging innovation more broadly in the context of an AI-focused semiconductor industry.
Front-end semi processing has seen massive innovation in the last 40 years, initially about scaling on planar processes but increasingly diversifying into complex transistor architectures, EUV, and backside power. Challenges and process control technology to enable will be reviewed, particularly those relevant for enabling AI-relevant products.
Packaging, once a minimalistic, low-cost final step in the semiconductor supply chain, is rapidly becoming an enabling technology. Particularly for new AI architectures requiring innovative memory-to-logic integration. KLA’s experience and learning in process and process control for new foundational packaging technologies like interposers, die stacking, hybrid bonding, glass substrates, and Co-packaged optics will be discussed.
Finally, KLA’s goal in bringing our deep experience in front-end semiconductor technology and methodologies to the packaging space will be briefly reviewed.
Keywords: Innovation, Advanced Packaging, Technology Roadmap, Heterogeneous Integration, Interconnect
Dr. Chet Lenox is a KLA Fellow and the leader of the Industry and Customer Collaboration Team at KLA, which engages broadly with the semiconductor ecosystem across all of the domains in front-end, packaging, PCB, and Specialty Semi that KLA serves. Previous to KLA, Chet held varies process development and integration roles at Intel, National Semiconductor, and Texas Instruments.
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
Sr. Manager Business Development, USA
Day 1 / 16:20 - 16:30
As FLI pitch scaling advances toward the single-micron range, traditional flux-based Thermocompression Bonding (TCB) faces challenges in oxide removal and residue elimination, impacting underfill quality and long-term reliability. To address these limitations, TCB equipment manufacturers are developing fluxless Thermal Compression Bonding technology with key customers to enable further pitch scaling.
Two possible fluxless TCB technologies—formic acid vapor and atmospheric plasma—are being integrated into TC Bonding equipment to remove native metal oxide grown onto the bonding interface. While both methods achieve similar oxide removal performance, only plasma Active Oxide Reduction (AOR) is entirely residue-free.
This presentation will compare these fluxless TCB technologies and highlight the advantages of plasma AOR in achieving superior metal oxide reduction for high-reliability TCB processes.
Greg Clemons is a seasoned professional with over 27 years in the semiconductor industry. He currently serves as the Senior Business Development Manager at ASMPT SEMI Solutions in the USA, driving business growth and innovation in advanced packaging. His expertise spans silicon wafer fabrication, advanced packaging, and semiconductor equipment. Greg has held key roles throughout his career, starting as a wet etch process engineer at Intel corporation and progressing from wafer fabrication to facilities construction to advanced packaging R&D where he delivered the 1st HVM TCB process for Intel products. He holds seven advanced packaging patents and continues to innovate in fluxless processing development, and has co-authored many technical papers, including a recent publication in enabling HBM 16H stacks with ASMPT Fluxless AOR technology. Greg holds a Bachelor of Science in Mechanical Engineering and a Master of Science in Materials Engineering from the University of Dayton, Ohio while working at the WPAFB Materials Directorate Labs. His leadership and innovation continue to drive advancements in the semiconductor industry.
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
Partner
Day 2 / 14:05 - 14:15
Based on AlixPartners’ Disruption Index survey of over 3,000 executives globally, several striking trends emerged that show how the semiconductor industry’s resilience is being tested amid geopolitical pressures and the transformative impact of AI. I will discuss the industry leaders’ outlook into the future, how market leaders are navigating geopolitical tensions, tariffs, and supply chain disruptions as well as implementing AI role in driving growth and evolving workforce needs. The survey shows that forward-looking leaders are optimistic about AI’s potential to enhance revenues and manufacturing capabilities and proactively change business and operating models to be the drivers of disruptions.
Markus co-leads AlixPartners’ global semiconductor practice. With 20 years of global business experience, he serves clients on their business and operating model transformation and change journeys. He is driven by a passion for measurable impact and the desire to help the semiconductors industry navigate through the disruptions of our age. Before joining Alixpartners, Markus led the strategy at a global technology leader. He started his consulting career at two leading European management consultancy firms. Before joining the consulting world, Markus led a research group for supercomputing and nanophysics research utilizing Nvidia’s CUDA to accelerate complex nanophysics simulations and collaborating with institutions globally. Markus holds a PhD and Masters in Physics and Computer Science.
AlixPartners is a results-driven global consulting firm that specializes in helping businesses respond quickly and decisively to their most critical challenges—from urgent performance improvement to complex restructuring, from risk mitigation to accelerated transformation. These are the moments when everything is on the line—a sudden shift in the market, an unexpected performance decline, a time-sensitive deal, a fork-in-the-road decision. We stand shoulder to shoulder with our clients until the job is done, and only measure our success in terms of the results we deliver.
Clients call us when they need pragmatism and cut-through to solve their most complex challenges arising from a continually disrupted world. Our services cover Artificial Intelligence, Corporate Strategy & Transformation, Data Governance, ESG, Growth, Investigations, Disputes & Advisory Services, Mergers & Acquisitions, Organizational Transformation, Supply-Chain Management & Operations, Technology, Transformative Leadership and Turnaround and Restructuring.
CTO for semiconductor materials, Resonac Holdings Corporation & Executive director, Electronics Business Headquarters, Resonac Corporation
Day 2 / 10:50 - 11:00
The cutting-edge semiconductors necessary for the evolution of AI are supported by advances in material and equipment technology. The emergence of chiplet package structures has led to increased complexity in packaging, making collaboration between materials and equipment manufacturers more critical than ever.
Resonac, a co-creative chemical company that provides a variety of semiconductor materials such as CMP slurry, etching gas, materials for HBM, epoxy molding compounds, substrate core materials, and more, is advancing materials technology development through open innovation activities. Resonac has started a Packaging Solution Center to propose one-stop solutions for customers and has established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment, and substrates for 2.xD and 3D packages. Additionally, we will soon start an open innovation activity in Silicon Valley called “US-JOINT.” In this presentation, we will describe our co-creation strategy.
Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
C&I Segment President
Day 2 / 14:35 - 14:45
AI deployment brings its own challenges to the data center market, but arguably, the biggest challenge with AI is the availability of power. In a world that is becoming more digital and electric, power and power availability are already at a premium. If we’re going to see all this AI investment, how are we going to power the infrastructure required to do so?
More AI initially means more energy consumption, especially for large language models (LLMs). However, AI also drives more efficiency in machines and increases productivity, which should reduce overall energy usage. The excitement around AI stems from its potential to create a more efficient world in the future. When applied correctly, AI can drive significant energy efficiency.
While digitization is emerging as a pivotal force in fostering sustainability, it also creates an escalating demand for energy. In the new energy landscape, we’re witnessing a shift where leading tech companies are embracing the decarbonization of their energy models. This transformation is empowering data centers to evolve from energy consumers to proactive prosumers, effectively supporting both the demand and supply of energy. Increased automation and AI in the generation and distribution of energy will have long-lasting benefits for our planet.
Currently, it is estimated that 60% of the energy we produce is either lost or wasted due to system inefficiencies, manual practices, or human behavior. In a world that is more digital, more automated, and more AI-led, imagine how much we could reduce energy loss.
Mark is a forward-thinking leader passionate about the rapid evolution of digital transformation and its impact on businesses. In his current role at Schneider Electric, he is responsible for shaping the vision and strategy that guides customers through their digitization journeys. Collaborating with cross-functional teams, Mark strives to deliver comprehensive solutions tailored to address specific customer challenges. Previously, as Segment President for Cloud & Service Providers, he led Schneider Electric’s global data center operations, growing it into the company’s largest and fastest-growing segment from 2015 to 2022. His ultimate goal is to ensure businesses are resilient, connected, and prepared for the future.
Schneider Electric is the global industrial technology leader, driving sustainable impact.
We are a powerhouse of electrification, automation, and digitization. The unique combination of our electrical and automation technologies intersect with our leadership in software, services and sustainability to rapidly accelerate sustainable impact.
Schneider’s purpose is to create Impact by empowering all to make the most of our energy and resources, bridging progress and sustainability for all. At Schneider we call this Life Is On.
Our mission is to be the trusted partner in Sustainability and Efficiency.
Energy management, Industrial Automation, Sustainability and Consulting Services, Industrial Software.
VP of Technology
Day 2 / 09:20 - 09:40
Artificial Intelligence is the largest technology transformation since Internet revolutionized communication and business. This transformation has required advancement in Si, Memory, Packaging, and System technologies. In this talk, the packaging and system technology challenges will be presented.
Dr. Babak Sabi is VP of Technology at AWS/Annapurna Lab. Babak joined AWS in 2024 after 40 years in Intel. Babak was Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development. During Babak’s tenure in ATTD 2.5D and 3D Advanced Packages were developed and ramp to high Volume Manufacturing. Additionally ATTD team made many advancement in Substrate and Test Technology.
Prior to leading ATTD, Babak oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.
Babak joined Intel in 1984 after receiving Babak his Ph.D. in solid state electronics from Ohio State University in 1984.
Launched in 2006, Amazon Web Services (AWS) began exposing key infrastructure services to businesses in the form of web services — now widely known as cloud computing. The ultimate benefit of cloud computing, and AWS, is the ability to leverage a new business model and turn capital infrastructure expenses into variable costs. Businesses no longer need to plan and procure servers and other IT resources weeks or months in advance. Using AWS, businesses can take advantage of Amazon’s expertise and economies of scale to access resources when their business needs them, delivering results faster and at a lower cost.
Today, Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. With data center locations in the U.S., Europe, Singapore, and Japan, customers across all industries are taking advantage of our low cost, elastic, open and flexible, secure platform.
CSO
Day 1 / 16:35 - 16:45
Glass offers unique properties and opportunities for advanced packaging. Research institutes and the advanced packaging industry have been working for years to integrate glass into next-generation IC substrates. Applications such as glass cores with ABF buildup on both sides, glass interposers with RDL, and other innovative glass-based solutions are continuously evolving.
Leveraging its expertise in PCP and IC substrates, along with a strong track record in turnkey solutions for photovoltaic fabs, SCHMID has developed advanced equipment and processes for TGV formation, glass core metallization, Embedded Trace Technology, and more. These innovations provide the industry with effective solutions for integrating glass into future IC substrates.
Roland Rettenmeier is a seasoned Sales and Business Development expert in Advanced Packaging with 25+ years of experience across PCB, IC substrates, Wafer-Level, and Panel-Level packaging.
After qualifying as a Mechanical Engineer in 1997, he started his career at AT&S AG, where he worked in various departments. In 2005, he completed his MBA in Vienna and continued expanding his expertise through programs like Six Sigma (AT&S, Nokia) and executive education at Stanford University.
Over his 25-year career, Roland built a solid track record in leading high-performance teams and delivering consistent revenue growth in the Advanced Packaging Industry.
In March 2025, Roland joined SCHMID Group as CSO and works with the global sales organization on current and future opportunities.
Roland also plays a key role in the industry as Committee Member and Session Chair of the SEMI Advanced Packaging Conference in Europe and Advisory Board Member of the International Semiconductor Industry Group.
With his deep industry knowledge and global network, Roland remains at the forefront of semiconductor packaging innovation.
The SCHMID Group is a world-leading global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, with its parent company Gebr. SCHMID GmbH is based in Freudenstadt, Germany. Founded in 1864, today it employs more than 800 staff members worldwide, and has technology centers and manufacturing sites in multiple locations including Germany and China, in addition to several sales and service locations globally. The Group focuses on developing customized equipment and process solutions for multiple industries including electronics, renewables, and energy storage. Our system and process solutions for the manufacture of substrates, printed circuit boards and other electrical components ensure highest level of technology, high yields with low production costs, high efficiency, quality, and sustainability in green production processes. www.schmid-group.com
VP of Research
Day 2 / 08:15 - 08:25
In this presentation, Mr. Sherman will present examples from the ISIG Chips & Wafers data reports that demonstrate the depth and scope of the information we provide to our customers.
Whether you are a Fabless company, an equipment manufacturer or an OSAT our reports provide the timely data you need to make better decisions.
Day 1 / 08:55 - 09:05
In this presentation, Mr. Sherman is excited to introduce the ISIG Chips & Wafers Data Reports for the first time to our members.
The ISIG data reports are designed as a reliable and actionable resource for semiconductor companies; providing timely and targeted data to help our members make more informed decisions.
Simi Sherman is Co-Founder and CEO of Chips & Wafers, a semiconductor data and research platform, and VP of Research with ISIG.
After six years at a Buy-Side global equities Hedge Fund, where he was a Partner and led semiconductor research, Simi Co-founded Chips & Wafers. Working together with ISIG, Chips & Wafers provides semiconductor companies and investors with timely and actionable data they utilize in making more informed decisions.
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Senior Director Business Development
Dr. Nokibul Islam is the Sr. Director of STATS ChipPAC Business Unit, where he leads product business development and advanced technology promotion. With over 21 years of experience in semiconductor product management, business development, and advanced packaging, he previously played a key role in Amkor Technology’s R&D team, focusing on product development, simulation, characterization, and process improvement. He is actively involved in leading industry conferences such as IMAPS, ECTC, InterPack, and Chiplet Summit and has contributed extensively to international publications.
STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
SVP/GM Silicon Photonics
Day 2 / 13:05 - 14:00
Kevin Soukup is Senior Vice President of Silicon Photonics Product Line at GF, a position he was appointed to in 2024. In this role, Mr. Soukup leads the company’s Silicon Photonics business that enables customers to transport enormous volumes of data through high-speed, power efficient electro-optical systems.
Prior to his current role, he served as Chief Strategy Officer developing the company’s integrated strategy and ensuring that GF has the management systems in place to deliver. Mr. Soukup joined GF in 2011 and held positions of increasing responsibility in technology development and manufacturing operations for the next seven years. In 2018, Kevin transitioned to VP of Business Transformation and helped prepare GF for IPO in 2021.
Before his career with GF, Mr. Soukup spent eleven years with Samsung Electronics’ semiconductor unit in engineering and operations management positions.
Mr. Soukup holds a Bachelor of Science in Chemical Engineering from the University of Florida. He currently serves as a member of the board of directors of VueReal.
GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.
CEO
Day 1 / 16:50 - 17:35
Amy has 26+ years of semiconductor experience in P&L management, product development, global sales and marketing, mergers and acquisitions. Prior to joining AEM, she held various senior leadership positions in California US with FormFactor, including Chief Commercial Officer, General Manager, and Chief Marketing Officer. Amy has been serving as an advisory board member of International Semiconductor Executive Summits (ISES) since 2016, and Singapore Semiconductor Industry Association (SSIA) since 2024.
Amy received a Master of Science degree in materials science and engineering from Stanford University and a Bachelor of Science degree in chemical engineering from the University of California at Berkeley.
AEM: Unleashing the Power of Tomorrow – Leader in High-Performance Processor Testing for the AI Era
AEM is a global leader in intelligent system test and handling solutions for semiconductor and electronics companies serving the advanced computing, 5G, and AI markets. Our mission is to provide the most comprehensive semiconductor and electronics test solutions based on the best-in-class technologies, processes, and customer support.
AEM is the pioneer of massively parallel, fully automated test solutions. Our expertise has been developed over the past two decades where AEM now has the largest fleet of such high parallel systems in the world serving the advanced performance compute market.
AEM has a global presence across Asia, Europe, and the Americas, with R&D centers located in Singapore, Malaysia, France, Finland and the US. AEM has manufacturing plants in Singapore, Malaysia (Penang), Indonesia (Batam), Vietnam (Ho Chi Minh City), and Finland (Lieto), and a global network of field engineering support and sales offices.
AEM: Unleashing the Power of Tomorrow – Leader in High-Performance Processor Testing for the AI Era
AEM is a global leader in intelligent system test and handling solutions for semiconductor and electronics companies serving the advanced computing, 5G, and AI markets.
AEM’s technology pillars stem from the substantial investments made in R&D to sustain our leadership in three critical verticals: Industry leading Active Thermal Control, Advanced Factory Automation, and Application-Optimized Test Instrumentation.
AEM’s Solutions:
Industry Leading Active Thermal Control: Common active thermal collaterals integrated into various test insertion solutions ranging from the engineering lab to high volume manufacturing to enable rapid time to market and yield improvements.
Advanced Factory Automation: Factory 4.0 automation for low to massively parallel test insertions optimized for maximum throughput and lowest cost of test.
Test Instrumentation: Highly optimized test instrumentation, coupled with active thermal control and automation, that challenges the current cost-prohibitive traditional ATE test methodology.
Co-Founder
Day 2 / 15:55 - 16:35
Ilya Zabelinsky is a globally recognized technical leader with nearly 30 years of experience in vacuum and gas abatement applications for semiconductor manufacturing. Ilya joined Intel in 1996, contributing to the startup and commissioning of Israel’s first 200mm FAB. He emerged as an operational and technical leader across Intel SubFABs worldwide.
In 2022, Ilya embarked on a mission to “bring Science to SubFAB” and founded the International SubFAB Research Labs. Ilya holds a B.Sc. in Chemical Engineering and possesses broad knowledge and vast practical experience in semiconductor manufacturing processes, FAB equipment, central facilities, and infrastructure.
International SubFAB Research Labs (ISRL) is a privately owned company founded by highly experienced and skilled team of semiconductor industry veterans.
ISRL’s vision is to fill the immense gap between industry’s desire for sustainable manufacturing and its ability to effectively address fundamental efficiency issues associated with handling, abatement and reclaim of hazardous process material waste streams. In other words – all is SubFAB.
ISRL is a first of kind facility with complete infrastructure required to operate a l fleet of 300mm process tools with versatile setup of deposition and dry etching process chambers, in high volume manufacturing-like conditions, to enable a wide range of sustainability research and development projects.
We are ENABLERS.
Our facility will enable OTHERS to help semiconductor operations work more sustainably with sharing of best practices leading to a fast and highly efficient deployment of sustainability improvements with a business model enabling clients to both reduce their costs and amplify sustainability benefits, faster time to market for breakthroughs, innovations and operational excellence in sustainable semiconductor manufacturing.
We are opening new horizons in research by understanding the significant environmental challenges that have been historically overlooked by the commercial pressures of value-generating semiconductors fabrication.
Our facility will offer a unique opportunity for companies looking to validate and qualify their equipment and technologies aimed at environmental sustainability.
We will simulate HVM-like conditions to support R&D for next generation gas abatement, materials recycle/reclaim, energy efficiency and other critical segments to enable sustainable semiconductor manufacturing in decades to come.
Strategic Marketing Director, Advanced Packaging
Day 1 / 13:40 - 14:20
Monita Pau is currently Strategic Marketing Director for Advanced Packaging at Onto Innovation. She works with business leaders and executives to drive strategic planning and leads the development of collaborative initiatives to drive growth and innovation. With over 15 years of experience, her expertise spans across frontend and backend of line process control solutions as well as specialty materials for advanced packaging and assembly. Prior to joining Onto, she held various positions in applications engineering, marketing and strategic business development at DuPont and KLA. Monita holds a Ph.D. degree in Chemistry from Stanford University.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
VC & Corporate Innovation
Day 2 / 16:40 - 17:20
At Plug and Play, Davis lead investments in Fintech & Al startups raising early-stage venture rounds. With a Fintech portfolio of over 235 startups including companies BigID, Blockdaemon, Esusu, Flutterwave, Honey, Trulio, Kustomer, N26, and Tractable, we back founders who are challenging the world today and creating technologies of tomorrow.
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
Investment Director
Day 2 / 16:40 - 17:20
Dr. Henry Huang is an investment director with Micron Ventures, the $300 VC arm of the global leader in computer memory and data storage solutions. He focuses on deep-tech startups developing sustainable compute infrastructure and advanced AI/ML software solutions. Prior to Micron, he had led investments in computing and connectivity with TDK Ventures and extensive operational experience with AT&T, NextG Networks (acquired by Crown Castle), Tarana Wireless, and TTS Wireless (acquired by AMDOC). He holds an MBA degree from Wharton School, University of Pennsylvania, a Ph.D. degree from University of Missouri-Columbia and a B.S. degree from University of Science and Technology of China (USTC).
Micron Ventures is a $300M venture capital arm of Micron Technology, a global leader in innovative computer memory and data storage solutions. The fund focuses on early-stage deep tech startups that develop sustainable compute infrastructure and advanced AI, ML, and software solutions.
Investment Director
Day 2 / 16:40 - 17:20
Yvonne joined Lam Capital in October 2024 as Investment Director, bringing over 7 years of venture capital experience from Bosch Ventures USA, where she led investments in deep tech fields like AI, quantum computing, semiconductors, sensors, and industrial technology. She also has 13+ years of operational experience at Bosch, having served in leadership roles across technology scouting, business development, engineering, and manufacturing in both mobility as well as consumer electronics. Yvonne holds a PhD in Applied Physics from University of Tuebingen and a Diploma in Experimental Physics from University of Siegen, both Germany.
Lam Capital invests in innovative companies that are addressing some of today’s most challenging, high-impact problems. From semiconductor subsystems to AI chips and Industry 4.0 technologies, we invest in and partner with startups that are disrupting their respective industries.
Investment Manager
Day 2 / 16:40 - 17:20
Blair Georgakas joined Applied Ventures in 2019 while pursuing her MBA at UC Berkeley Haas. She has a broad set of interests across deep tech / hardtech verticals and is currently supporting investments in energy storage and additive manufacturing.
Prior to joining Applied Ventures, Blair led the physical product management team for 3D printing start-up, Shapeways, where she led the launch of over 10 new products, managed strategic partnerships with HP, EOS, EnvisionTec, Formlabs, etc, and implemented lean manufacturing methods to reduce cost. Earlier in her career, she also worked for Northrop Grumman as a materials science engineer with responsibilities including R&D of new materials, material characterization, failure analysis, and process optimization.
Blair graduates from UC Berkeley Haas School of Business with an MBA in May 2021. She also holds a master of science degree in engineering and advanced structural materials and a bachelor of science degree in materials science and engineering from UCLA with a technical breadth in mechanical engineering.
Applied Ventures, LLC, is the venture capital arm of Applied Materials, Inc., (NASDAQ: AMAT). Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. For more than a decade, Applied Ventures has invested in startups that are pioneering innovations in smartphones, augmented and virtual reality, AI, driverless cars, big data, life sciences, 3D printing, robotics, cleantech, and advanced materials. Applied Ventures is stage agnostic and invests up to $100M per year globally. We have invested in over 90 companies across 18 countries.
Co-Founder, Director
Day 2 / 16:40 - 17:20
Daniel Armbrust is a Silicon Catalyst co-founder, member of the Board of Directors and its initial CEO.
Daniel serves as an advisor, board member, board chairman and angel investor for many semiconductor startups. Daniel is an affiliate with Lawrence Berkeley National Labs and recently was appointed to the Industrial Advisory Committee, which advises the Department of Commerce on the R&D strategy for the CHIPS Act. He served as President and CEO of the SEMATECH semiconductor consortium and held various positions in semiconductor manufacturing and development over 25 years at IBM.
Armbrust earned a bachelor’s degree in ceramic science and engineering from Pennsylvania State University as well as a master’s of science degree in manufacturing systems engineering from Rensselaer Polytechnic Institute.
Silicon Catalyst is the only incubator + accelerator focused on the Global Semiconductor Industry including Chips, Chiplets, Materials, IP and Silicon fabrication-based Photonics, MEMS, Sensors, Life Science and Quantum.
More than 1,200 startup companies worldwide have engaged with Silicon Catalyst and the company has admitted over 100 exciting companies. With a world-class network of mentors to advise startups, Silicon Catalyst is helping new semiconductor companies address the challenges in moving from idea to realization.
The incubator + accelerator supplies startups with access to design tools, silicon devices, networking, and a path to funding, banking and marketing acumen to successfully launch and grow their company’s novel technology solutions. Over the past nine years, the Silicon Catalyst model has been proven to dramatically accelerate a startup’s trajectory while at the same time de-risking the equation for investors.
The Silicon Catalyst Angels was established in July 2019 as a separate organization to provide access to seed and Series A funding for Silicon Catalyst Portfolio Companies.
SiliconCatalyst.UK, a subsidiary of Silicon Catalyst, was selected by the UK government to manage ChipStart UK, an early-stage semiconductor incubator funded by the UK government.
In February of 2024, Silicon Catalyst Ventures (SCV) was launched to fund early-stage startups accepted into the incubator’s two-year program. SCV has already made eleven investments in Silicon Catalyst Portfolio Companies.
More information is available at www.siliconcatalyst.com, www.siliconcatalystangels.com, www.siliconcatalyst.uk, and Silicon Catalyst Ventures www.sicatalystvc.com.
CVP, Product Engineering Operations
Day 1 / 16:50 - 17:35
Todd Foulds is the Corporate Vice President of Product Engineering Operations at AMD with nearly 30 years of experience in the semiconductor industry. His team’s responsibilities cover Product Management, Product & Test engineering, Hardware & Infrastructure development, and Engineering Lab operations. Prior to joining AMD, Todd was a technical consultant at Hewlett Packard/Agilent Technologies in the ATE Test & Measurement division. Todd holds a Bachelor of Science degree in Electrical Engineering from Texas A&M University.
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Chief Operating Officer
Najwa Khazal is the Chief Operating Officer for Busch Group USA and a global business leader with 20+ years of experience across America, China, EMEA, India, and Mexico. She specializes in supply chain management, program management, and digital transformation for $3B organizations in industries such as aerospace, automotive, energy, medical, and more. Najwa excels in leading complex, multimillion-dollar projects from concept to commercialization, while driving cost optimization and sustainable performance. A passionate educator with 12+ years of teaching international business, she is trilingual and recognized for her exceptional leadership, strategic execution, and commitment to operational excellence across global markets.
Pfeiffer Vacuum+Fab Solutions delivers best-in-class vacuum and semiconductor fabrication solutions for a wide range of industries, including semiconductor manufacturing, analytics, research, and other high-tech applications. We combine advanced vacuum technologies, such as pumps, leak detection systems, and measurement instruments, with specialized fab solutions to support critical processes with maximum precision and reliability.
As part of the Busch Group, one of the world’s largest manufacturers of vacuum pumps, vacuum systems, blowers, compressors, and gas abatement systems, we have access to a global network of expertise and innovation. The Busch Group brings together three industry-leading brands: Busch Vacuum Solutions, Pfeiffer Vacuum+Fab Solutions, and centrotherm clean solutions.
With over 8,000 employees in 44 countries, the Busch Group is committed to delivering superior service and cutting-edge technologies worldwide. The group operates 23 production plants across key regions, including China, Germany, the USA, Vietnam, and others, ensuring global reach with local support.
Co-founder and CEO
Dave Lazovsky is the Co-founder and CEO of Celestial AI, the creators of the Photonic FabricTM. Celestial AI, founded in April 2020, has developed the optical interconnectivity technology platform for AI computing.
Prior to founding Celestial AI, Mr. Lazovsky was a Venture Partner at Khosla Ventures. He has 30 years of experience in the semiconductor industry and over two decades of experience building andleading successful start-ups.
In 2004 Mr. Lazovsky founded Intermolecular, a semiconductor and clean energy R&D and Intellectual Property licensing company. He served as the company’s Chief Executive Officer,President and as a member of the board of directors from September 2004 through October 2014. As President and CEO, Mr. Lazovsky led all aspects of the business through its lifecycle from early-stage start-up to public company. Intermolecular (IMI) went public on the NASDAQ in 2011.
He currently has over 80 issued and pending U.S. patents.
AI is touching our lives and driving breakthroughs in healthcare, finance, autonomous systems, and countless other domains. Its ability to process vast data, derive insights, and automate complex tasks unlocks new levels of efficiency and innovation. However, the exponential growth of AI workloads demands greater computational power and more efficient data movement. Traditional electronic interconnects are struggling to keep up, necessitating a paradigm shift in AI infrastructure.
The answer is like night and day.
Celestial AI’s Photonic Fabric is a revolutionary technology that scales AI compute within package and package-to-package across multiple racks. It forms the foundation for an optical scale-up network, overcoming the physical limitations of electronic interconnects. Offering terabytes of low-latency bandwidth, in-network computing, and high-performance memory, Photonic Fabric heralds a new dawn in AI infrastructure.
Switching to optical interconnects enables larger multi-die packages and bigger scale-up domains, creating a leap into the next decade. Photonic Fabric-based products transform AI data centers, scaling thousands of XPUs across racks, enabling larger models, better reasoning, and more efficient inference. By reducing total cost of ownership, this innovation unlocks new use cases and more profitable GenAI business models.
With an aggressive roadmap, a robust ecosystem of partners, and a tier-one supply chain, Celestial AI isn’t just reimagining AI data centers, it’s delivering an AI-driven, sustainable future. At its core, AI isn’t just about algorithms or hardware, it’s about people. Unlocking creativity, solving humanity’s biggest challenges, and making the impossible possible. The future of AI is here. Intelligence, illuminated.
Co Founder & CEO
Day 1 / 16:50 - 17:35
Srini Chinamilli is the Co-founder and CEO of Tessolve. He has more than 25 years of experience in semiconductor Test and Product engineering and held management and technical positions at Cirrus Logic and Centillium communications prior to co-founding Tessolve. Under his leadership, Tessolve has evolved to be the largest standalone semiconductor engineering solutions company, with over 3200 employees across 10 countries worldwide.
Tessolve is a leading semiconductor & systems engineering services company founded in 2004. With a global presence and over 3,200 employees, they support major technology companies. Tessolve offers a wide range of services including ASIC design, chip design, test engineering, complex PCB design, and embedded systems design. Their focus on emerging areas like AI, hyperscalars, semiconductor design and testing, avionics and automotive solutions helps clients bring high-quality products to market faster and more cost-effectively.
Vice President of Global Supply Chain Management
Day 2 / 15:55 - 16:35
Shiva Esturi is the Vice President of Global Supply Chain Management at Micron Technology, Inc. In this role, Shiva is responsible for overseeing the end-to-end orchestration of the supply chain to achieve customer service levels, time-to-market, and cost-to-serve objectives. Throughout his career, Shiva has made significant contributions to the field, authoring several publications and frequently lecturing at universities and conferences. He is also an active member of multiple industry advisory boards, where he shares his expertise and insights to help shape the future of supply chain management.
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
VP imec.IC-link / imec silicon solutions
Day 2 / 13:05 - 14:00
Philippe Absil received his Ph.D. degree from the Department of Electrical Engineering, University of Maryland, College Park, MD, USA, in 2000. His doctoral work contributed to the early demonstrations of optical semiconductor microring resonators. In the early 2000s, he developed the passive photonics platform technology for Little Optics, Inc., Annapolis Junction, MD USA. From 2013 till 2024 he was VP R&D and the head of the 3-D and Optical I/O Technologies Department at imec and has been responsible for the silicon photonics technology platform development since 2010. Before that he spent seven years managing the advanced CMOS scaling program at imec.Now, Philippe is Vice President of imec.IC-link, Silicon Solutions, that offers unique technology services, leveraging imec’s state-of-the-art semiconductor fabrication infrastructure.
Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2021, imec’s revenue (P&L) totaled 732 million euro.
Further information on imec can be found at www.imec-int.com.
CEO
Day 2 / 13:05 - 14:00
Mark is Chief Executive Officer and Co-Founder of Ayar Labs. His prior roles at Ayar Labs include Chief Technology Officer and Senior Vice President of Engineering. He is recognized as a pioneer in photonics technologies and, prior to founding the company, led the team that designed the optics in the world’s first processor to communicate using light. He and his co-founders invented breakthrough technology at MIT and UC Berkeley from 2010-2015 which led to the formation of Ayar Labs. He holds a PhD from University of Colorado.
Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a 1000x improvement in interconnect bandwidth density at 10x lower power. Ayar Labs’ patented approach uses industry standard cost-effective silicon processing techniques to develop high speed, high density, low power optical based interconnect “chiplets” and lasers to replace traditional electrical based I/O. The company was founded in 2015 and is funded by a number of domestic and international venture capital firms as well as strategic investors. For more information, visit www.ayarlabs.com.
Address: 695 River Oaks Parkway, San Jose, CA 95134
Phone: 650-963-7200
Email: info@ayarlabs.com
VP Product Development, Semiconductor Test Division
Day 1 / 16:50 - 17:35
Roy Chorev is the vice president of product development for the semiconductor test division at Teradyne, where he is responsible for product development for Teradyne’s semiconductor test products. With more than twenty years of experience in the automated test equipment industry, he has held a number of roles in software development, systems engineering and product marketing at Teradyne. Roy holds a Bachelor of Arts in computer science from McGill University and Master of Business Administration from Babson College.
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
Contact Us
www.teradyne.com
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
President and Chief Executive Officer
Day 1 / 16:50 - 17:35
Michael D. Slessor has served as our Chief Executive Officer of FormFactor, Inc. since 2014, and as a Director since 2013. Mike served as President from 2013 to 2014, and as Senior Vice President and General Manager, MicroProbe Product Group from 2012 to 2013. Before joining FormFactor, he was President and Chief Executive Officer of MicroProbe from 2008 through the 2012 closing of FormFactor’s acquisition of MicroProbe. Prior to joining MicroProbe, he held various management, product-marketing, and applications-engineering positions in the semiconductor industry, primarily with KLA.
Mike received his Ph.D. in Aeronautics and Physics from the California Institute of Technology and his B.A.Sc. in Engineering Physics from the University of British Columbia.
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.
Distinguished Engineer
Day 2 / 13:05 - 14:00
Matt Traverso is a Distinguished Engineer for Marvell Technology with a focus on next generation optical interconnect solutions based on silicon photonics. He has led the development of multiple high volume optical module products at 100Gbps and beyond. Matt has been active in the development and definition of optical communications standards and optical form factors since 2000 including as the original editor of the CFP MSA (Multi-Source Agreement). He has dozens of journal publications and has over 30 patents awarded and pending. He graduated from Stanford University in Materials Science & Engineering.
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.
President and CTO
Day 1 / 16:50 - 17:35
With decades of experience in the semiconductor capital equipment industry, Samer has extensive experience in leading technology M&A, R&D, business strategies development, implementation, and competitive strategy. He excels in product innovation and development that is designed to align to both market and customer requirements.
Before joining AEM, Samer was the Executive Vice President at Advantest and Astronics Test Systems. In his 14-year tenure at Cohu, Samer served in senior management roles, including Delta Design Systems president.
Samer is a prolific innovator with 30+ registered patents in areas of advanced thermal management, photoresist processing, factory automation, and vision alignment and inspection.
AEM: Unleashing the Power of Tomorrow – Leader in High-Performance Processor Testing for the AI Era
AEM is a global leader in intelligent system test and handling solutions for semiconductor and electronics companies serving the advanced computing, 5G, and AI markets. Our mission is to provide the most comprehensive semiconductor and electronics test solutions based on the best-in-class technologies, processes, and customer support.
AEM is the pioneer of massively parallel, fully automated test solutions. Our expertise has been developed over the past two decades where AEM now has the largest fleet of such high parallel systems in the world serving the advanced performance compute market.
AEM has a global presence across Asia, Europe, and the Americas, with R&D centers located in Singapore, Malaysia, France, Finland and the US. AEM has manufacturing plants in Singapore, Malaysia (Penang), Indonesia (Batam), Vietnam (Ho Chi Minh City), and Finland (Lieto), and a global network of field engineering support and sales offices.
AEM: Unleashing the Power of Tomorrow – Leader in High-Performance Processor Testing for the AI Era
AEM is a global leader in intelligent system test and handling solutions for semiconductor and electronics companies serving the advanced computing, 5G, and AI markets.
AEM’s technology pillars stem from the substantial investments made in R&D to sustain our leadership in three critical verticals: Industry leading Active Thermal Control, Advanced Factory Automation, and Application-Optimized Test Instrumentation.
AEM’s Solutions:
Industry Leading Active Thermal Control: Common active thermal collaterals integrated into various test insertion solutions ranging from the engineering lab to high volume manufacturing to enable rapid time to market and yield improvements.
Advanced Factory Automation: Factory 4.0 automation for low to massively parallel test insertions optimized for maximum throughput and lowest cost of test.
Test Instrumentation: Highly optimized test instrumentation, coupled with active thermal control and automation, that challenges the current cost-prohibitive traditional ATE test methodology.
SVP & General Manager, Advanced Packaging
Day 1 / 13:40 - 14:20
Bassel Haddad is Sr Vice President and General Manager of Advanced Packaging at SkyWater Technology. He leads all aspects of SkyWater’s advanced packaging business including technology development, engineering, marketing and Florida fab operations. He is responsible for building and scaling the business serving both the defense and commercial market sectors. He is focused on strengthening collaborations with the advanced packaging ecosystem, such as equipment and material vendors, government partners and research institutes & consortia, while driving the growth trajectory of the business.
Before joining SkyWater, Haddad was with Intel since 2011 holding various engineering and business leadership roles. Most recently, he was the Vice President and General Manager of edge device and AI products, in the network and edge group. In this role, he managed a multi-billion dollar P&L, and leading innovations in edge AI and Internet of Things, or IoT. Earlier in his career, he held roles in platform architecture, silicon development, systems and software engineering, delivering leadership products to various end markets.
Haddad holds a Bachelor’s and Master’s degree in electrical engineering from Technion – Israel Institute of Technology. He is the inventor of five USPTO-issued patents in the areas of digital communication and systems architecture.
SkyWater (NASDAQ: SKYT) is a U.S.-based semiconductor manufacturer and a DMEA-accredited Category 1A Trusted Supplier. SkyWater’s Technology as a Service model streamlines the path to production for customers with development services, volume production and heterogeneous integration solutions in its U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology within diverse categories including mixed-signal CMOS, ROICs, rad-hard ICs, MEMS, superconducting ICs, photonics and advanced packaging. SkyWater serves the growing markets of aerospace & defense, automotive, biomedical, industrial and quantum computing. For more information, visit: www.skywatertechnology.com.
Executive Director
Day 2 / 16:40 - 17:20
Quick Tsai (Shiann-Tsong Tsai) received a Bachelor’s degree in Physics in Taiwan and a Master’s degree in Electrical Engineering from Syracuse University in 2001. He began his career at UTAC Taiwan, where he worked for nine years as the R&D and Engineering Department Manager. During this time, he pioneered the pressure oven devoid process in die attachment, which laid the foundation for the widespread application of pressure oven technology in assembly processes today.
In 2011, he joined MediaTek as the Technical Manager for Package Technology, where he worked for thirteen years. He led initiatives in multi-tier Cu wire bonding packaging technology, enhancing the performance, cost reduction, and efficiency of semiconductor devices.
He then moved to Whalechip Technology, serving as a consultant and board member for six years. Whalechip Technology, a TSMC partner, accomplished the world’s first computing device using Wafer on Wafer technology.
Currently, he is the Executive Director at Amazing Cool Technology, where he drives Covetics material innovation and mass production in various areas, including semiconductors. Throughout his career, he has helped companies obtain several patents in numerous area.
ACOOL uses a patented process to produce graphene-modified copper, which is a new material after graphene and copper form a covalent-metallic bond.
The world‘s only mass-producible graphene copper material, all properties exceed those of oxygen-free copper, we named ACOOL COPPER, that are transcendent.
It is formed by graphene and copper. It has dozens of excellent characteristics such as improved mechanical properties, electrical conductivity, thermal conductivity, corrosion resistance, oxidation resistance, EMI resistance, bending resistance, fusible current resistance, high voltage and low leakage, and low temperature coefficient.
Founder
Day 2 / 16:40 - 17:20
Hamid Sadjadpour received the Ph.D. degree from University of Southern California. In 1995, he joined the AT&T Shannon Research Laboratory, as a Technical Staff Member and later as a Principal Member of Technical Staff. In 2001, he joined the University of California at Santa Cruz where he is currently a Professor. He has over 240 publications and 25 patents. He is a co-recipient of the best paper awards at the 2007 International Symposium on Performance Evaluation of Computer and Telecommunication Systems, 2008 Military Communications conference, 2010 European Wireless Conference, and 2017 Conference on Cloud and Big Data Computing.
Practical OTP Encryption Inc. was founded by Professor Hamid Sadjadpour from the University of California, Santa Cruz (UCSC). The company’s innovative encryption technology stems from extensive research conducted at UCSC with support from the Army Research Office. Practical OTP Encryption specializes in advanced information-theoretic solutions designed to provide corporations, financial institutions, and government organizations with unmatched, unconditional data security. Its mission is to safeguard sensitive information stored in public clouds or transmitted over networks against state adversaries and cybercriminals, even those with unlimited computational resources. Unlike conventional encryption methods, Practical OTP Encryption ensures immunity from future scientific breakthroughs, offering protection against harvest-now-decrypt-later attacks. Its unique solution is highly adaptable, seamlessly integrating with devices of any size, making it an ideal choice for addressing the dynamic challenges of modern cybersecurity. Practical OTP Encryption is committed to redefining data security with its groundbreaking, future-proof technology.
Head of Strategic Initiatives and Growth
Day 2 / 16:40 - 17:20
Dr. Bonnie Tsim is Head of Strategic Initiatives at ATLANT 3D and holds a PhD in Theoretical Physics on the electronic properties of twistronic graphene from the University of Manchester. With expertise across deep-tech strategy, advanced materials, and international ecosystem building, she has led AI strategy and digital transformation at Turner & Townsend and convened global stakeholders in exponential technologies such as quantum and semiconductors at MATTER.
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Co-Founder
Day 2 / 16:40 - 17:20
Catherine is the Co-Founder of Kelvin Cooling, which builds high-efficiency nano-film evaporation cooling solutions for data centers. She has a background in data engineering and product development and is passionate about turning advanced thermal technologies into scalable, real-world solutions. Catherine leads business operations, bridging deep-tech innovation with practical execution. She has had the opportunity to collaborate with researchers at UC Berkeley for further test validations. Catherine is deeply driven by sustainability and the need for energy-efficient cooling in next-gen computing. She also works closely with company partners and advisors to support customer discovery, fundraising, and strategic growth.
CEO and Co-Founder
Day 1 / 08:15 - 08:30
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Founder & CEO
Day 1 / 08:35 - 08:50
Saeed is a seasoned investor and executive with over 30 years of experience growing businesses in numerous industries, including real estate, bottled water, packaging, and technology investing. Following the early success of his various businesses, The Amidi Group initially purchased a building in Palo Alto and decided to rent the extra office spaces to startups.
As the CEO and founder of Plug and Play, Saeed applies his passion for the tech industry daily by working with forward-thinking partners and the best global startups to facilitate positive change worldwide. Since Plug and Play’s launch in 2006, the company has worked with over 90,000 startups, made over 2,000 investments, and boasts over 30 unicorns including Dropbox, PayPal, Lending Club, N26, and Honey. Similar to his unexpected success with the “Lucky Building,” Saeed considered himself lucky overall when he moved to Silicon Valley in the late 70s, where he was then unaware of the ecosystem it would become.
Plug and Play is the ultimate innovation platform. Our mission is to build the world’s leading innovation platform and make innovation open to anyone, anywhere. We do this by connecting entrepreneurs, corporations, and investors worldwide.
Over the past 15 years, we have brought together 35,000+ startups, 500+ world-leading corporations, and hundreds of venture capital firms, universities, and government agencies across 20+ industries.
We are active in 50+ locations globally, including the U.S., China, France, Germany, South Africa, Singapore, Indonesia, Brazil, and more.
Together with our partners, we are creating a unique ecosystem designed to facilitate meaningful introductions, invest in startups, and bring together key stakeholders.
The industries we focus on include Agtech, Animal Health, Brand & Retail, Crypto & Digital Assets, Energy, Enterprise, Fintech, Food & Beverage, Health, Insurtech, IoT, Maritime, Media & Ad, Mobility, New Materials & Packaging, Real Estate & Construction, Smart Cities, Supply Chain, Sustainability, and Travel & Hospitality.
VP US Business Units
Day 1 / 19:40 - 22:30
Welcome Dinner Speaker
Ben Rathsack is Vice President of 2 US Business Units within Tokyo Electron America (TEA). He is responsible for the US business management (P/L) of the lithography track/ cleaning system BU (CTSPS) and assembly (3DI)/ test systems BU (ATS) including sales, marketing and service within the US. These business units drive advanced FEOL scaling and BEOL advanced packaging equipment sales. He has worked at TEA for 17 years in various roles including VP of Product and Technology Development (R&D), marketing, new product introduction and process development. He has 23 years of semiconductor experience at Tokyo Electron and Texas Instruments (50 publications/ 30 patents). He received his BS in Chemical Engineering from the University of Illinois/UC and his MS/PhD at the University of Texas/Austin.
As a leading global company of semiconductor and flat panel display (FPD) production equipment, Tokyo Electron Limited (TEL) engages in development, manufacturing, and sales in a wide range of product fields. Building on the technological expertise and know-how that we have been cultivating since our inception over 50 years ago, we strive to contribute to the development of a dream-inspiring society. All of TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network in the U.S., Europe, and Asia.
Website: https://www.tel.com/
Phone: +1-512-424-100
Additional Contact Information: https://www.tel.com/contactus/
Head of Strategic Business Development
Day 1 / 19:10 - 19:20
Christine Dunbar is the Head of Strategic Business Development at Natcast, the non-profit entity designated by the U.S. Department of Commerce to operate the National Semiconductor Technology Center (NSTC). In this role, she leads strategic initiatives to advance the U.S. semiconductor ecosystem, fostering collaboration between industry, government, and academia.
Before joining Natcast in March 2025, Christine served as Senior Vice President of Global Sales at IQE, a leading provider of compound semiconductor wafer products and advanced materials solutions. Prior to joining IQE in 2022, she held key executive roles at GlobalFoundries and IBM’s Microelectronics Division.
A Cornell University graduate with a bachelor’s degree in Materials Science and Engineering, Christine has dedicated her entire career to advancing the global semiconductor industry. In recognition of her leadership, she was nominated for the Global Semiconductor Association’s inaugural “Rising Woman of Influence” award in 2018.
Beyond her executive roles, Christine is a recognized thought leader and sought-after speaker on the critical issues shaping the future of the semiconductor industry. She is frequently called upon to present at global industry forums, where she has provided insights on technology innovation, supply chain resilience, workforce development, and global policy. A longtime advocate for diversity in tech, she is also deeply committed to mentoring and inspiring the next generation of leaders, helping to shape a more inclusive and dynamic semiconductor ecosystem.
Natcast is a purpose-built, non-profit entity designated to operate the National Semiconductor Technology Center (NSTC) by the Department of Commerce. Established by the bipartisan CHIPS and Science Act of the U.S. government, the NSTC is a public-private consortium with a mission to advance U.S.-led semiconductor research and innovation, foster a skilled workforce, and strengthen America’s economic and national security.
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