ISIG Executive Summit USA 2026

Keynote Speaker

Naga Chandrasekaran

Chief Technology and Operations Officer, EVP & GM

Session info not yet published

Naga Chandrasekaran is responsible for Intel Foundry’s technology development, worldwide manufacturing, customer service and ecosystem operations, including research, development, and deployment of next-generation silicon logic, packaging and test technologies, as well as front-end and back-end manufacturing, foundry services, strategic planning, corporate quality and reliability and supply chain.
Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras; a master’s degree and doctorate in mechanical engineering from Oklahoma State University; a master’s degree in information and data science from the University of California, Berkeley; and dual executive MBAs from the University of California, Los Angeles, and the National University of Singapore.

Company Profile

Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards. Intel Foundry is an independent foundry business that meets our customers’ unique product needs, including our industry-leading sort and test capabilities. Whether front-end or back-end design is needed, when integrated with our foundry co-optimized development kits based on industry-standard tools and flows and powerful silicon IPs, the result is true innovation.

Keynote Speaker

Sandeep Bharathi

President Data Center Group

Session info not yet published

Company Profile

We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Speaker

Jaesik Lee Ph.D.

VP Package Engineering

High Bandwidth Memory (HBM) and Advanced Packaging in AI

Day 1 / 10:40 - 11:00

As the requirement of processing data in Artificial Intelligence (AI) grows exponentially, a large capacity and high bandwidth in memory technology plays a pivotal role in the integrated AI system performances. High bandwidth memories (HBMs) has been great solutions since 2017 when HBM2 was implemented in nVIDIA P100/V100. Currently, 6th generation HBM, HBM4 is in development.The continued scaling of HBM to increase memory capacity and bandwidth and additionally to enhance thermal performance has been great challenges and required the evolutions of 3D stacking technologies. In this presentation, HBM stacking technology innovations and roadmap will be presented. HBM stacking challenges associated with next generation advanced packaging technologies will be discussed.

Panel Session: Evolving Trends for Advanced Packaging and the Challenges for Supply Chain and End User Applications

Day 1 / 13:40 - 14:20

Dr. Jaesik Lee is Vice President of Package Engineering at SK hynix America. In this role, Jaesik is responsible for the research and development of advanced packaging for next generation High Bandwidth Memory (HBM) and pathfinding initiatives which enrich SK hynix’s innovations. He also focuses on the collaborations with customers to overcome HBM challenges associated with System in Packages (SIPs).
Prior to joining SK hynix America, Jaesik has held various key technical positions through Meta, Google, Nvidia, and Qualcomm where he drove advanced packaging technology developments, Packaging and System Co-optimization, and Manufacturing in Mobile, AI, and HPC applications. He received a PhD in mechanical engineering from University of Waterloo.

Company Profile

An AI First Mover Leading the Global AI Memory Era
With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees.
Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in pursuit of more social value and a healthier governance structure.
SK hynix will grow into a Full Stack AI Memory Provider, offering customized solutions tailored to the diverse needs of global customers, covering both DRAM and NAND flash, in the era of full-scale AI.

Panelist

Reza Kasnavi, Ph.D.

EVP Chief Operations and Technology Officer

Session info not yet published

Company Profile

Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets.
Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America.

Skyworks products are used in aerospace, automotive, broadband, cellular infrastructure, connected home, defense, entertainment and gaming, industrial, medical, military, smartphone, tablet, and wearable markets.

Panelist

Philip Martin

VP & Director Sort/Test Technology Development

Session info not yet published

Phil Martin is Vice President and Director of Sort/Test Technology Development for Intel Foundry. His responsibilities encompass test technology development across wafer, die, and package test, including the Intel High Density Modular Tester platform (HDMT). With over 30 years of experience at Intel, Phil has held multiple positions, all within test technology development. He holds a Masters of Science degree in Mechanical Engineering from the University of Idaho.

Company Profile

Intel’s systems foundry approach offers full-stack optimization from the factory network to software. Intel and its ecosystem empower customers to innovate across the entire system through continuous technology improvements, reference designs and new standards. Intel Foundry is an independent foundry business that meets our customers’ unique product needs, including our industry-leading sort and test capabilities. Whether front-end or back-end design is needed, when integrated with our foundry co-optimized development kits based on industry-standard tools and flows and powerful silicon IPs, the result is true innovation.

Panelist

Near Margalit, Ph.D.

VP & GM

Optical I/O at Copper Scale and Cost

Day 2 / 11:30 - 11:50

The scalability of new AI models is increasingly constrained by current architectures, particularly the limitations imposed by the number of GPUs that can fit inside a single rack. Moving optical attach directly to the GPU enables scale-up domains of more than 512, overcoming these bottlenecks and providing a path for the next generation of foundation models. Over the past five years, Broadcom’s significant investment over the past five years in Co-Packaged Optics (CPO), is paving the way for optical I/O from the GPUs at cost parity to traditional copper interconnects. The presentation will highlight the benefits of Broadcom’s development strategy, focusing on key decisions such as edge coupling and external lasers, core technology innovations such as a detachable fiber connector, and large-scale manufacturing through automated assembly and test.

Panel Session: How Silicon Photonics is set to transform interconnect architecture for AI

Day 2 / 13:05 - 14:00

Dr. Near Margalit has held several executive positions in the optical connectivety industry. He founded Zaffire Inc., a metro DWDM Optical Networking company before moving on to lead Source Photonics as CEO from 2002-2013, growing the company to one of the premier optical transceiver vendors. He was the CTO and Head of Product Development for Intel’s Silicon Photonics for the commercial introduction of Silicon Photonics in 2015-2016. From 2018 to present he has been with the Optical Systems Division of Broadcom where he is currently the VP and General Manager of the division. He holds a Ph.D in Optoelectronics from UC Santa Barbara and a B.S. in Applied Physics from CalTech.

Company Profile

Broadcom Inc. designs, develops, and markets digital and analog semiconductors. The Company offers wireless RF components, storage adapters, controllers, networking processors, switches, fiber optic modules, motion control encoders, and optical sensors. Broadcom markets its products worldwide.

Panel Moderator

Philippe Absil Ph.D.

Vice President IC-Link | imec silicon solutions

Panel Session: How Silicon Photonics is set to transform interconnect architecture for AI

Day 2 / 13:05 - 14:00

At IC-Link / imec silicon solutions, Philippe Absil leads programs enabling custom ASIC design, prototyping, and advanced semiconductor integration. With over 20 years of experience in CMOS technology development and system design, Philippe has driven innovation in advanced nodes, 3D integration, and heterogeneous packaging. He holds a Ph.D. in Electrical Engineering and has authored numerous publications and patents in semiconductor process technology. At imec, Philippe focuses on bridging research and industry to accelerate time-to-market for next-generation chips in AI, automotive, and high-performance computing applications.

Company Profile

Imec is a world-leading research and innovation hub in advanced semiconductor technologies. Leveraging its state-of-the-art R&D infrastructure and the expertise of over 6,500 employees, imec drives innovation in semiconductor and system scaling, artificial intelligence, silicon photonics, connectivity, and sensing.
Imec’s advanced research powers breakthroughs across a wide range of industries, including computing, health, automotive, energy, infotainment, industry, agrifood, and security. Through IC-Link, imec guides companies through every step of the chip journey – from initial concept to full-scale manufacturing – delivering customized solutions tailored to meet the most advanced design and production needs.
Imec collaborates with global leaders across the semiconductor value chain, as well as with technology companies, start-ups, academia, and research institutions in Flanders and worldwide. Headquartered in Leuven, Belgium, imec has research facilities in Belgium, across Europe and the USA, and representation on three continents. In 2024, imec reported revenues of €1.034 billion.
Further information on imec can be found at www.imec-int.com.

Panelist

Jason Conrad

Chief Operating Officer for Semiconductor Research

Session info not yet published

Jason Conrad is the Chief Operating Officer for Semiconductor Research at ASU. He leads SWAP Hub, SHIELD USA, and MacroTechnology Works, ASU’s premier facility for semiconductor research and development. Jason brings with him more than 23 years of experience in the semiconductor industry. With previous roles at industry-leading companies such as NXP, Global Wafers, and Lam Research, Jason is a proven leader focused on performance and quality.
Jason’s mission is to foster relationships with academic, industry and government partners to not only develop leap ahead technologies but also the workforce of the future.
Jason holds a bachelor’s degree in chemical engineering from the University of Notre Dame.

Company Profile

With 110,000+ undergraduate students, 30,000+ graduate and professional students, and 5,000+ faculty, Arizona State University (ASU) exemplifies a new prototype for the American public research university. At ASU, our culture of innovation and inclusion draws pioneering researchers to our faculty and attracts highly qualified students from all 50 states and more than 130 nations. ASU is expanding academic and entrepreneurial opportunities for every type of learner at all stages of life. Creating a resilient microelectronics innovation ecosystem is critical to America’s security and economic competitiveness. Arizona State University is responding to this need by working with industry and government partners to reestablish America’s capacity for domestic microelectronics and semiconductor manufacturing and innovation. ASU offers traditional degree programs and rapid, low-cost options for upskilling and re-skilling of the existing semiconductor workforce, as well as workers from outside the industry.

ASU is building the semiconductor talent pipeline and mobilizing the expertise and capabilities of the Fulton Schools of Engineering to drive research, development and innovation. The Fulton Schools of Engineering at Arizona State University is the largest and most comprehensive engineering school in the nation, offering 25 undergraduate degree programs, and 48 graduate degree programs. With over 30,000 students within the Fulton Schools of Engineering, 7000+ students studying microelectronics-related fields, and 150+ faculty engaged in microelectronics research and teaching. We offer extensive research facilities including our research in semiconductor manufacturing and advanced semiconductor packaging which is supported by our extensive lads which includes MacroTechnology Works with 250,000 total sq ft capacity, 43,000 sq ft clean rooms, and 23,00 sq ft wet/dry labs. We also offer graduate programs in semiconductor manufacturing, packaging, and assembly as well as certificate programs to support workforce development.

Panelist

Kevin Soukup

SVP/GM Silicon Photonics

Panel Session: How Silicon Photonics is set to transform interconnect architecture for AI

Day 2 / 13:05 - 14:00

Kevin Soukup is Senior Vice President of Silicon Photonics Product Line at GF, a position he was appointed to in 2024. In this role, Mr. Soukup leads the company’s Silicon Photonics business that enables customers to transport enormous volumes of data through high-speed, power efficient electro-optical systems.
Prior to his current role, he served as Chief Strategy Officer developing the company’s integrated strategy and ensuring that GF has the management systems in place to deliver. Mr. Soukup joined GF in 2011 and held positions of increasing responsibility in technology development and manufacturing operations for the next seven years. In 2018, Kevin transitioned to VP of Business Transformation and helped prepare GF for IPO in 2021.
Before his career with GF, Mr. Soukup spent eleven years with Samsung Electronics’ semiconductor unit in engineering and operations management positions.
Mr. Soukup holds a Bachelor of Science in Chemical Engineering from the University of Florida. He currently serves as a member of the board of directors of VueReal.

Company Profile

GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.

Panelist

Mark Kuemerle

VP of Technology Custom Cloud Solutions

Session info not yet published

Mark Kuemerle is Vice President, Technology, Custom Cloud Solutions at Marvell. In this role, Mark is responsible for defining leading-edge ASIC offerings, drives product competitiveness, and architects system-level solutions. Before joining Marvell, Mark was a Fellow in Integrated Systems Architecture at GLOBALFOUNDRIES and has held multiple engineering positions at IBM.
He has authored numerous articles on die-to-die connectivity and multichip systems and holds multiple patents related to low-power technologies and package integration. Mark earned a Bachelors and Master of Science in Computer Engineering from Case Western Reserve University.

Company Profile

We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Panelist

Hamid Azimi, Ph.D.

Senior Vice President, Advanced Packaging and Foundry

Formerly CVP of Intel

Session info not yet published

Dr. Hamid R. Azimi is Senior Vice President of Advanced Packaging and Foundry at Marvell. In this role, he leads the development and deployment of next-generation packaging technologies and foundry strategies to support Marvell’s data infrastructure products.
Prior to joining Marvell, Hamid spent nearly 30 years at Intel, where he most recently served as Corporate Vice President and Director of Substrate Packaging Technology Development. He led global R&D and manufacturing teams and delivered industry-leading innovations including die-embedded panel level fanout, EMIB and glass packaging for AI and high-performance computing.
A recognized pioneer in semiconductor packaging, Hamid holds over 40 U.S. patents, including the patent on first-generation organic flip-chip ABF-based substrate. He has received multiple Intel Achievement Awards and is widely known for building high-performing, inclusive teams and mentoring future industry leaders.
Hamid earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.

Company Profile

We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you.
Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.

Speaker

Subramanian Iyer

Distinguished Professor

Session info not yet published

Company Profile

Speaker

ASMPT Semiconductor Solutions

Session info not yet published

Company Profile

ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

Speaker

Resonac Corporation

Session info not yet published

Company Profile

Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.

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Completed Summits

Completed Summits

Supported by:

2026 Speakers

Naga Chandrasekaran

Sandeep Bharathi

Jaesik Lee Ph.D.

Reza Kasnavi, Ph.D.

Philip Martin

Near Margalit, Ph.D.

Philippe Absil Ph.D.

Jason Conrad

Kevin Soukup

Mark Kuemerle

Hamid Azimi, Ph.D.

Subramanian Iyer

ASMPT Semiconductor Solutions

Resonac Corporation

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