Pierre Chastanet
Head of Unit of “Microelectronics and Photonics Industry” Unit, DG CNECT
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Pierre Chastanet is Head of the Unit for Microelectronics and Photonics Industry at the European Commission, where he manages the development of European semiconductor policy and the implementation of the European Chips Act.
Mr. Chastanet has been working for over 17 years in the European Commission, supervising different digital policies in the areas of cloud, data flows, software, cybersecurity, privacy, green ICT, and telecom innovation.
Prior to that, Mr. Chastanet gained more than 10 years of ICT experience, mostly in various IT management positions in a large multinational company.
He graduated from Telecom ParisTech, the Free University of Brussels, and the London School of Economics and Political Science. He also earned a Leadership Executive Certificate from Harvard Kennedy School of Government.
Company Profile
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
The European Commission is the EU’s politically independent executive arm. The Directorate‑General for Communications Networks, Content and Technology is the Commission department responsible to develop a digital single market to generate smart, sustainable and inclusive growth in Europe.
Follow the latest EU tech news on Twitter, Facebook, Instagram and YouTube via @DigitalEU.
Aldo Bruno
Technical Lead MEMS Sensor System Competence Team
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Aldo Bruno is the Technical Lead MEMS Sensor System Competence Team within the application engineering at Infineon Technologies, specializing in consumer sensors. Before Infineon, he held the role of Digital ASIC Designer at Cirrus Logic UK, where he honed his expertise in DSP, digital filters, audio codec systems, voice activity detection, and speech enhancement algorithms. In 2018, while completing his master’s thesis at Infineon Technologies, he concentrated on the development of ANC systems to explore the potential enhancements Infineon MEMS microphones could bring. Throughout his career and personal pursuits, Aldo’s passion for audio and acoustics has been a driving force since he´s also a musician and music producer.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Ken Diest
Research Manager and Tech Lead
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Ken Diest is a Research Manager and Tech Lead at Meta’s Reality Labs, where he leads programs focused on MEMS and micro-actuator technologies. His focus is on developing these technologies from early stage through production to address critical opto-mechanical and display challenges in AR/MR.
A Materials Scientist by training, Ken’s prior work focused on tunable devices and materials with an emphasis on optical systems. He was the editor and co-author of the book Numerical Methods for Metamaterial Design, and has previously held technology development roles at Apple, MIT Lincoln Laboratories, and Northrop Grumman that focused on new displays and nano-photonics.
Company Profile
Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology.
Mo Maghsoudnia
Founder & CEO
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Mo Maghsoudnia is the visionary Founder and dedicated CEO at the helm of UltraSense Systems, a pioneering company in the technology and manufacturing sector. With a track record of transformative leadership and innovation, Mo has been instrumental in shaping the industry landscape.
Before founding UltraSense, Mo Maghsoudnia made significant contributions as the Vice President of Technology & Manufacturing at InvenSense. In this influential role, he oversaw global operations and spearheaded the development of cutting-edge Process Technology. Under his guidance, InvenSense achieved remarkable success, culminating in its acquisition by TDK for a staggering $1.4 billion in 2017.
Prior to his tenure at InvenSense, Mo Maghsoudnia served as the Vice President of Manufacturing at NetLogic MicroSystems. Here, he demonstrated his exceptional ability to steer manufacturing operations, elevating the company from a single product line to a diversified product portfolio powerhouse. His adept leadership, combined with a diverse product range, paved the way for Broadcom’s acquisition of NetLogic MicroSystems for a
remarkable $4 billion in 2012.
Mo’s expertise is firmly rooted in his academic pursuits, holding a Master of Science in Electrical Engineering from Santa Clara University. His passion for innovation is further underscored by his impressive intellectual property portfolio, boasting 12 patents, and an extensive list of research papers that he has authored.
Mo Maghsoudnia’s unwavering commitment to technological advancement and his exceptional leadership have left an indelible mark on the tech and manufacturing sectors, solidifying his status as a true industry luminary.
Company Profile
UltraSense Systems transforms driver touch interfaces in automotive with its In-Plane Sensing solutions, which enable multi-mode sensing, processing, and AI / Machine Learning algorithms to turn almost any surface into the ultimate touch experience. UltraSense In-Plane Sensing includes a SmartSurface Human Machine Interface (HMI) controller for programmable audio, illumination, haptics, and user feedback. When integrated into steering wheels, infotainment systems, and other in-vehicle interfaces, UltraSense offers a more intuitive and modern experience for drivers; a more integrated, easier to manufacture and thinner solution for tier-suppliers; and greater design options plus recyclability and sustainability benefits for automakers.
UltraSense TouchPoint HMI Controllers fully integrate multi-mode touch sensing, lighting control, and algorithm processing in a single chip – powering a new generation of Human-Machine Interfaces.
*UltraSense TouchPoint C-CapForce HMI Controller. Capacitive + Force integrated System on a Chip (SoC) controller including Analog Front End (AFE).
*UltraSense TouchPoint Z – UltraForce HMI Controller. Ultrasound + Force integrated SoC controller including AFE.
*UltraSense TouchPoint Q – TapForce HMI Controller. Piezoelectric Force sensing integrated SoC controller including AFE.
*UltraSense TouchPoint Edge – HMI SoC for cluster of buttons & slider capabilities. Integrated sensing and feedback control, MCU, AFE and Neural Touch Engine coupled with LIN communication.
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