27-28 August 2025
Suwon
Director of Technical Program Management & Business Development
Alastair Attard is Director of Business Development at UTAC Group. He has a Bachelor’s degree in Mechanical Engineering and an Executive MBA from the University of Malta, and has over 18 years of experience in the assembly & test of semiconductor devices.
Prior to joining UTAC, Alastair worked at STMicroelectronics firstly as part of the process engineering team for flip chip and SiP, and later in process and package development for MEMS packages. He later joined Besi, where he was manager of the process development group, with focus on advanced die attach and pick & place technologies.
Alastair joined UTAC in 2018, focusing on technical program management and assembly business development in the European region. Today he is responsible for worldwide business development of assembly and test solutions for semiconductor devices at UTAC with particular focus on MEMS, Sensing, and Advanced Packaging.
UTAC is a leading independent provider of assembly and test services for a broad range of semiconductor chips with diversified end-use applications including communication, consumer, computing, automotive, security, industrial and medical. Our customers include fabless companies, integrated device manufacturers and wafer foundries.
UTAC is headquartered in Singapore with more than 12 production facilities. Our global sales network is widely focused on five regions: the United States, Europe, China and Taiwan, Japan and the rest of Asia with sales offices located in each of these regions.
VP BU Microsystems
Volker Herbig, VP BU Microsystems at X-FAB, oversees all MEMS activities within the X-FAB Group. Before assuming his current role, Volker worked as Director Product Marketing at X-FAB. Previously he held also engineering, marketing and management positions at Siemens, Inkjet Technologies and Carl Zeiss where, among other activities, he developed MEMS inkjet print heads and was responsible for setting up a manufacturing facility for those. Volker Herbig holds a master’s degree in physics from Humboldt University, Berlin, Germany.
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
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