Alastair Attard
Director of Business Development
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Alastair Attard is Director of Business Development at UTAC Group. He has a Bachelor’s degree in Mechanical Engineering and an Executive MBA, and brings over 19 years of experience in the semiconductor assembly & test.
Alastair has previously held positions at STMicroelectronics in MEMS and SiP process engineering and package development, and at Besi where he managed the process development group for advanced die attach technologies.
Alastair joined UTAC in 2018 and today is responsible for business development of semiconductor assembly and test solutions with particular focus on MEMS, Sensing, and Advanced Packaging.
Company Profile
UTAC Group is a leading outsourced semiconductor assembly and test (OSAT) provider, founded in 1997 and headquartered in Singapore. The company specializes in advanced assembly and test services for logic, memory, analog/mixed-signal, image sensors, MEMS, and power devices. UTAC supports a global customer base that includes fabless companies, integrated device manufacturers (IDMs), and wafer foundries.
With ten manufacturing facilities across Singapore, Thailand, China, and Indonesia, and a robust global sales network spanning North America, Europe, Greater China, Japan, and Southeast Asia, UTAC delivers comprehensive turnkey solutions—from wafer probing to final testing.
UTAC serves diverse market segments including automotive, computing, communications, consumer electronics, and industrial applications. Renowned for its reliability, technological expertise, and customer-centric approach, UTAC continues to play a vital role in enabling next-generation semiconductor innovation.
UTAC Group provides a comprehensive range of semiconductor assembly and test services, delivering turnkey solutions from wafer probe to final test across key end markets.
Its packaging portfolio includes leadframe-based packages such as QFN, DFN, QFP, TLA, and Cu-clip variants, as well as laminate-based BGA/iBGA packages for mobile, computing, and automotive applications. UTAC also offers System-in-Package (SiP) modules that integrate multiple components into compact, high-density solutions for IoT, wearables, and automotive electronics.
Advanced wafer-level offerings include bumping services and Wafer-Level Chip Scale Packaging (WLCSP) for customers requiring miniaturization, high electrical performance, and low-profile form factors.
UTAC also supports image sensor packaging, including automotive-grade iBGA with cleanroom assembly to meet stringent reliability and contamination standards.
To complement mass production, UTAC provides value-added services such as package design support, reliability qualification, and failure analysis—helping customers accelerate time to market with confidence.
Volker Herbig
VP BU Microsystems
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Volker Herbig, VP BU Microsystems at X-FAB, oversees all MEMS activities within the X-FAB Group. Before assuming his current role, Volker worked as Director Product Marketing at X-FAB. Previously he held also engineering, marketing and management positions at Siemens, Inkjet Technologies and Carl Zeiss where, among other activities, he developed MEMS inkjet print heads and was responsible for setting up a manufacturing facility for those. Volker Herbig holds a master’s degree in physics from Humboldt University, Berlin, Germany.
Company Profile
X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.
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