JSR Corporation
JSR Corporation is a multinational company employing more than 9,000 people worldwide and a leading materials supplier in a variety of technology driven markets, driving materials innovation and creating value through materials to enrich society, people and the environment. JSR’s global network is headquartered in Tokyo (Japan) and has factories and offices in Europe, USA, China, Taiwan, Korea, and Thailand. JSR is a research-oriented organization that pursues close collaborations with leading innovators in a number of industries that are a key to the present and future welfare of human society: life-sciences, synthetic rubbers, electronic materials, display and optical materials.
For more information about JSR Corporation, please visit https://www.jsr.co.jp/jsr_e/.
Nordson TEST & INSPECTION
Nordson Test & Inspection offers its SMT & Semiconductor customers a robust product portfolio, including Acoustic, Optical and both Manual and Automated X-ray Inspection systems, X-ray Component Counting systems and Semiconductor measurement sensors. Nordson Test & Inspection is uniquely positioned to serve its customers with best-in-class precision technologies, passionate sales and support teams, global reach, and unmatched consultative applications expertise.
About Nordson
Nordson Corporation (Nasdaq: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at https://www.nordson.com/, https://x.com/nordson_corp or https://www.facebook.com/nordson/.
Products & Services
Advanced Metrology & Inspection
High Accuracy. High Resolution. High Speed.
Nordson Test & Inspection manufactures world-class metrology and inspection systems & sensors. Our inspection metrology equipment meets the highest standards for electronic assembly and semiconductor applications. Acoustic, Optical, Bond Test, X-ray Components, Manual X-ray, and Automated X-ray systems enable you to identify even the smallest defects at high resolution and capture critical measurements. Wireless Semiconductor Sensors can significantly improve semiconductor tool setup and maintenance.
We design, develop, and manufacture innovative inspection & metrology equipment for a wide range of industries, including AI, Server & 5G, Consumer, Automotive, Power & Energy, Sensors & LED, Aerospace & Defense and Medical.
Our key segments include Advanced SMT, Advanced Packaging, Front-End semiconductor, Mid-End semiconductor, and Back-End semiconductor.
The right inspection & metrology equipment can elevate your product quality. If you’re looking to save time and money, and improve your yields, processes, and productivity, of the semiconductors or the electronics you manufacture, our inspection equipment can help you ensure exceptional quality every time.
SPEA
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
Products & Services
- SPEA product portfolio includes test equipment for:
- Automotive, linear, analog mixed signal & SoC devices requiring the most advanced and powerful instrumentation. SPEA’s DOT platform addresses today’s and future roadmap needs.
- MEMS & Sensors. SPEA has been chosen by the biggest players in this market to develop the best solutions for inertial, high-g, proximity, time-of-flight, light, pressure, environmental, magnetic, acoustic sensors. SPEA equipment combines physical stimulus with a complete electrical test, fast pick&place handling, reliable contacting, tri-temp.
- Power & Discretes. DOT800 T perforfms static and dynamic measurements with extended current/voltage ranges, on the whole range of power applications: wafers, discretes (Si, SiC, GaN based), IPMs, KGDs, DBCs, IGBT modules.
- Identification. CT1000 and CT3000 are low-cost test systems dedicated to micro-controllers, RFID, UHF, combi devices. They perform complete, highly accurate measurements, offering high throughput, with high multi-site test capability at wafer test, and a fast data transfer for memory test.
ULVAC Technologies, Inc.
ULVAC GmbH which was established in 1987 as the European subsidiary of ULVAC, Inc. headquartered in Munich, Germany. ULVAC’s solutions diversely incorporate equipment, materials, and services for Semiconductors, MEMS, Flat Panel Displays, Electronic Components, PCB, TFB, and other Vacuum Equipment for the European Markets.
ULVAC is the global leader for thin film PZT deposition and etch.
ULVAC GmbH
Klausnerring 4
85551 Kirchheim b. München
Germany
Fon: +49 – 89 – 96 09 09 – 0
Fax: +49 – 89 – 96 09 09 – 96
Email: ulvac@ulvac.de
http://www.ulvac.eu
Products & Services
For MEMS application ULVAC has developed systems dedicated to MEMS sensors, actuators, switches, lab-on-chip and micromirror manufacturing. This equipment range includes sputtering and etching for piezo electric materials like PZT, AlN and ScAlN, glass and metal etching, thick resist ashing, resist and polymer removal within trench structures, and others.
Piezoelectric materials can be used to further miniaturize a range of devices, including inertial sensors, tuneable RF devices, inkjet print heads, micromirrors, microphones, autofocus lenses and others. The integration of thin film deposition directly on CMOS-processed wafers is key for highly-integrated devices. ULVAC has developed high-volume processing sputtering method that allows sub 500°C processing temperatures, is configured to pole the piezoelectric crystals during the deposition process and is compatible with other CMOS processes.
End of content
End of content