Inabata＆Co.,Ltd.
Inabata & Co., Ltd. is a global specialized trading company with a rich history, leveraging its comprehensive capabilities to offer diverse solutions across various industries. A key focus is the information and electronics sector, where Inabata plays a vital role in the semiconductor industry.
The company provides a wide range of semiconductor-related materials, including specialized encapsulating resins and adhesives for optical semiconductors, as well as materials and equipment for LEDs. Inabata’s commitment to product development and quality assurance in this field is underscored by its wholly-owned subsidiary, Inabata Optec Corporation, which focuses on developing new products for opto-semiconductors.
Inabata’s global network and expertise in advanced materials position it as a valuable partner for innovation and growth within the international semiconductor landscape.
Products & Services
Inabata & Co., Ltd. provides a comprehensive array of products and services crucial to the advanced semiconductor industry. Our offerings span a wide range of electronic materials, specializing in solutions that meet the stringent demands of next-generation devices.
Key product categories include high-performance encapsulating resins and adhesives for various semiconductor applications, with a particular focus on optical semiconductors and LEDs. We supply essential materials for advanced packaging, contributing to enhanced device reliability and performance. Furthermore, Inabata facilitates the provision of specialized equipment and related components vital for semiconductor manufacturing processes.
Beyond materials and equipment, Inabata leverages its extensive global network to offer technical support, market intelligence, and supply chain solutions, helping customers navigate complex challenges and accelerate innovation in the rapidly evolving semiconductor landscape. Our commitment lies in being a strategic partner, delivering value across the entire semiconductor ecosystem.
Murata Machinery
Murata Machinery (Muratec) is a worldwide leader and solution provider for automated material handling systems in semiconductor manufacturing and other manufacturing or distribution industries. Muratec also manufactures machinery and equipment such as Textile Machinery, Machine Tools, Sheet Metal Machinery, and Communication Equipment.
This year marks 90 years since its founding in 1935. Under the slogan “Innovation. Mark the turning point”, Muratec aims to create technologies that bring innovation to the market and society.
Products & Services
・Logistics & Automation Division
Logistics Center, Automated Storage & Retrieval Systems (AS/RS), Transportation Systems, Picking Systems, Sorting Systems, Data Management system
・Clean FA Division
Transport Systems & Storage Systems For Semiconductor fab.
・Machine Tools Division
CNC Twin-spindle Chucker, CNC Twin-spindle Turning Center, CNC Opposed Twin-spindle, FMC and FMS
CNC Turret Punch Press, CNC laser punch press,
Press Brake, Automatic CAD/CAM system for sheet metal working, FMC and FMS
・Textile Machinery Division
VORTEX Spinning Machines, Automatic Winders
・Communication Equipment Division
Digital Multifunctional Product, Laser Xerographic Printer Facsimile, LED Linear Array Optical Facsimile, Thermal Transfer Facsimile,
Document & IP Solutions
SURUGA SEIKI Co., Ltd. TAIWAN BRANCH
We are Siliconphotonics advanced package and testing solution provider. Suruga Seiki is a Japanese company founded in 1964. Taiwan is the APAC operation center with design and CPO system assembly functions.
We are focusing on Siliconphotonics, Photonics wafer restring, PIC functional test and Active alignment, passive alignment, edge coupling and grating coupling by our key components, module, and tester system.
We can also provide camera module and lens decenter alignment inspection with our laser collimator and high precision stage.
Our website:
[About Siliconphotonics, Advanced Testing&Package functions for PIC]
[About Company Profile]
Products & Services
SURUGA SEIKI provides cutting-edge technology such as high precision positioning motor stage, excellent optical alignment algorithm and laser measurement technique. Experienced domestic services on photonics wafer testing, PIC coupling, assembly by active/passive alignment.
Manz Asia
Manz Asia specializes in innovative production solutions for advanced panel-level packaging. We provide a comprehensive range of manufacturing systems, from customized machines for lab and pilot production to standardized modules and turnkey lines for mass production. Manz’s solutions deliver superior resource efficiency, increased throughput, and faster time-to-market, empowering customers to boost productivity and competitiveness.
Products & Services
Manz Asia continues to drive innovation in RDL solutions, expanding beyond coreless Fan-Out Panel-Level Packaging (FOPLP) to pioneering technologies for glass core production.
Our advanced RDL capabilities for glass cores, supported by etching equipment that achieves over 95% uniformity in processing 510 x 515 mm Through Glass Via (TGV) substrates, ensure precise and consistent results.
Kyocera
Kyocera Corporation (TOKYO:6971, https://global.kyocera.com/), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of industrial and automotive components, semiconductor packages, electronic devices, smart energy systems, printers, copiers, and mobile phones. During the year ended March 31, 2023, the company’s consolidated sales revenue totaled 2 trillion yen (approx. US$15.1 billion). Kyocera is ranked #672 on Forbes magazine’s 2023 “Global 2000” list of the world’s largest publicly traded companies, and has been named among “The World’s 100 Most Sustainably Managed Companies” by The Wall Street Journal.
Yamaha Robotics Co., Ltd.
Yamaha Robotics Co., Ltd. is a Yamaha Motor Co., Ltd. group company that handles semiconductor manufacturing equipment (back-end processing) and electronic component assembly equipment businesses.
We can offer to provide a total solution that exceeds our customers’ expectation as the “Turn-Key Provider in Semiconductor Back-end Process Equipment” by integrating the technologies of bonders, molds，surface mounters, Industrial Robots, and various automated equipments.
Products & Services
Development, manufacturing and sales of semiconductor back-end process equipment.”Connecting” technology: die bonding, wire bonding and flip chip bonding; “Solidification” technology: resin encapsulation equipment and molding equipment; “Assembly” technology: electronic component assembly and manufacturing equipment.
Hermes-Epitek Corp.
Hermes-Epitek was founded in 1977. Our vision is to “be a world-class semiconductor and Opto-Electronic company“ by delivering exceptional products and services, uniting the team with the motto ”service by Hermes-Epitek”. Over the 40 years, Hermes-Epitek has been supporting customers in Asia with our partners, serving more than 200 semiconductor and opto-electronic plants. We have successfully developed E-beam inspection, Ion beam implanter, and MOCVD systems. Our service teams are located in Taiwan, Singapore, Malaysia, and China, with more than 1200 employees worldwide. For more information, please visit https://www.hermes.com.tw/en/ Head Office Tel +886-3-579-0022 Fax +886-3-579-0011 Address No.18, Creation Rd., 1, Hsinchu Science Park, Hsinchu 300093, Taiwan
Sekisui Chemical Co., Ltd.
Established in 1947, Sekisui Chemical Co., Ltd. is one of Japan’s leading integrated chemical manufacturers. Sekisui operates a residential business known as the Sekisui Heim brand, an environmental lifeline business that handles piping materials for factories and social infrastructure, a high-performance plastics business that provides chemical products in the mobility, electronics and industrial fields, and a life sciences business that provides testing and drug development support. In the electronics industry, we provides various products such as tapes, films, adhesives, fine particles, and binder resins for a wide range of applications such as displays, electronic components, and semiconductors.
Products & Services
Major products for the semiconductor field include “SELFA” temporary fixed tapes with excellent heat and chemical resistance, FCBGA build-up films with excellent low transmission loss property, heat dissipation sheets that combine proprietary magnetic field alignment technology and resin design technology, and conductive micro-particles with the highest particle size accuracy in the industry.
FujiFilm Corporation
FUJIFILM Electronic Materials develops and manages chemical formulations that power the most critical processes of semiconductor technology. We are a diverse, global supplier that delivers tailored support where our customers need us most. The spirit of partnership drives everything we do — our commitment to the continued success and innovation of our customers is our primary focus. Through state-of-the-art systems, leading-edge technologies, and a commitment to the continuous development of environmentally friendly processes, FUJIFILM Electronic Materials is:
DEDICATED — to the success of our customers and team
CURIOUS — with a genuine interest in finding new ways to innovate
DRIVEN — motivated to push the boundaries of possibility
COLLABORATIVE — committed to working jointly to develop the best solutions
Headquartered in Japan, FUJIFILM Electronic Materials has 20 production and 6 R&D sites globally. As proud members of the FUJIFILM Group, we are one of the leading and most trusted producers of the chemical formulations that enable our partners to progress semiconductor technology to the next node and beyond. Our assured, stable supply is proven through our state-of-the-art quality system. Leveraging leading-edge technologies, our formulations help to power cell phones, computers, medical devices, cars, refrigerators and other goods essential to human life.
For the detail, please check our website at https://www.fujifilm.com/em-global/en.
Applied Materials
We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.
Pentamaster
Pentamaster Group provides automation technology and solutions to multinational manufacturers in the automotive, semiconductor, electro-optical, consumer electronics, and medical sector, spanning across APAC, North America and Europe. Besides the HQ and production plant in Penang, Malaysia, the Group has strategic presence globally with offices located in the USA, Japan, Germany, Singapore and production facilities in China.
With the speed and magnitude of technology progress today, Pentamaster Group will always be bold enough to explore new innovations. For years, the Group has been one of the leading global providers of automated test equipment to suit different requirements and needs of customers from various industries. In the automotive segment, the group has developed a proprietary SiC wafer burn-in system, being one of the top four manufacturers in the world, in creating a niche market space for this growth sub-segment and to solidify the Group’s position in the automotive industry.
SPEA
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
Products & Services
- SPEA product portfolio includes test equipment for:
- Automotive, linear, analog mixed signal & SoC devices requiring the most advanced and powerful instrumentation. SPEA’s DOT platform addresses today’s and future roadmap needs.
- MEMS & Sensors. SPEA has been chosen by the biggest players in this market to develop the best solutions for inertial, high-g, proximity, time-of-flight, light, pressure, environmental, magnetic, acoustic sensors. SPEA equipment combines physical stimulus with a complete electrical test, fast pick&place handling, reliable contacting, tri-temp.
- Power & Discretes. DOT800 T perforfms static and dynamic measurements with extended current/voltage ranges, on the whole range of power applications: wafers, discretes (Si, SiC, GaN based), IPMs, KGDs, DBCs, IGBT modules.
- Identification. CT1000 and CT3000 are low-cost test systems dedicated to micro-controllers, RFID, UHF, combi devices. They perform complete, highly accurate measurements, offering high throughput, with high multi-site test capability at wafer test, and a fast data transfer for memory test.
Evatec
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
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