Wonik
Wonik creates the best quality and services with its technology, making the beauty of customers’ value generated much more valuable. Wonik not only enhances the quality of life with its creative businesses but also contributes to the development of national economy, providing top products and services based on its world-class competitiveness in the semiconductor equipment, materials, and cosmetics fields. Wonik is also expanding to more various fields such as trade, distribution, finance, and leisure, pursuing more depth in technology to generate better customer values.
HB Technology
Our company produces LCD and OLED test equipment for a wide range of IT devices, as well as diffusion plates and light guide plates. The company developed LCD AOI test equipment for the first time in the country, and AMOLED AOI test equipment for the first time in the world. We are focusing on expanding markets for laser repair equipment and PCB AOI, and has the largest market share for high-quality diffusion plates and light guide plates that are manufactured in one-stop process. With outstanding technology, our company has grown solidly, acquired materials division of Cheil Industries in 2012, and acquired LS Tech, reporting record-high revenues for three years in a row (2015-2017). The company was recently named as 300 World Class Business, an acknowledgment for strong and competent companies.
PVA TePla Analytical Systems GmbH
PVA TePla Analytical Systems designs and manufactures state of the art Scanning Acoustic Microscopes (SAM). This SAM utilizes ultrasound to non-destructively examine surfaces and internal structures of a solid sample. Voids, inclusions, cracks and even density variations are all defects sensitive to the technique of acoustic microscopy. During the last 15 years PVA TePla AS introduced fully automated inline inspection SAMs for Si wafer and DCB quality control, bonding inspection of MEMS, wafers and 3D integration products. PVA TePla AS operates an international sales and service network with own application laboratories in Europe, the US, Japan, Singapore, Korea, Taiwan, China and Malaysia and cooperates with a large number of university facilities, such as Fraunhofer Institute and IMEC. PVA TePla AS participates in a large number of funding projects and takes an active part in research and development in respect of ultrasound methodology and transducer development.
Products & Services
The product range covers measurement and testing systems with ultrasound. In this case, the customers can choose from a large number of Scanning Acoustic Microscope as laboratory, semi-automated and fully automated in line systems. All systems can be customized to customers specific needs and requirements. Furthermore, all Scanning Acoustic Microscopes offer user-friendly application and structured user interface. The measuring systems are equipped with transducers, developed and manufactured in-house. Transducers from 15 to 2000 MHz are available for the systems. Specially adapted software, adjusted to all systems, offers the possibility to analyze samples fast and reliable with standard as well as advanced ML algorithms. In opposition to competitors PVA TePla AS distinguish itself from the competition by its long time experience in acoustic GHz-Microscopy which enables resolution below the 1 μm. The inclusion of multi-channel-scans permits a high throughput of samples and a shorter scan time. The systems reduce operating costs and become an important element in quality control of industry and semi-conductor business.
Kurt J. Lesker Company
Kurt J. Lesker Company® (KJLC®) is the leading global provider of exceptional customer service and high-quality vacuum equipment, with a goal of enabling the innovation, creation, and advancement of a vast array of products.
The depth and breadth of the markets we serve include: Semiconductor, LEDs, Optics, UHV/Synchrotrons, Wear and Decorative Coatings and R&D. Working side by side with our customers, we’re making an impact on the world today as well as a better tomorrow.
We help our customers compete and succeed on the leading edge of technology. Built on a tradition of customer service and quality, KJLC has grown from a regional manufacturer and distributor of vacuum components into today’s worldwide supplier in virtually every market.
As a manufacturer and distributor of all things vacuum, focus is critical. That’s why KJLC has four divisions—each relentlessly tackling challenges that a specific application demands. But rest assured, even with our focus on progress and innovation that helps to create the future, we always keep sight of quality and environmental stewardship of resources, as well as an embedded commitment to customer satisfaction—that’s in our foundation.
Products & Services
Founded in 1954, the Kurt J. Lesker Company® (KJLC®) is a manufacturer of vacuum equipment and systems to research laboratories and high technology industries from our facilities around the world. We are a leading manufacturer custom vacuum chambers, weldments, and components, recognized worldwide for specializing in both R&D and production environments.
From smaller, spherical chambers several inches in diameter for R&D, to large box chambers over 14′ long for production coatings, our expansive facilities are poised to service any and all custom vacuum chamber needs.
KJLC® also provides the very building blocks of the vacuum industry. We maintain the largest inventory of vacuum products available anywhere, so no matter the need, finding your part at KJLC® is a simple, straight forward process from start to finish. KJLC® has the most comprehensive inventory in the industry strategically located in our global distribution centers, providing the benefit of “buying locally” from a global supplier. Let us provide streamlined solutions to your complex supply chain and logistic issues.
Specifically, KJLC® offers the widest selection of internationally compatible flanged components, feedthroughs, valves, and components, along with a wide range of vacuum pumps, gauging, and vacuum fluids.
PLANOPTIK AG
PLANOPTIK sets global standards with glass-based solutions for the semiconductor industry, microsystems, and microfluidics with manufacturers in over 40 countries. PLANOPTIK creates customized products that support cutting-edge sensors, microelectronics, and medical diagnostics.
In advanced packaging, PLANOPTIK’s glass core substrates enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Its high-precision glass micro circuit boards are key for future semiconductor advancements, using copper-coated, lithographically processed glass for critical connections.
PLANOPTIK collaborates with its customers to design and produce high-volume, wafer-based components, offering solutions from glass wafers to thin-wafer handling tools.
Products & Services
PLANOPTIK develops and manufactures Wafers & Panels for business different business areas like Advanced Packaging and Wafer-/Panel-Level-Packaging. PLANOPTIK also creates Carrier & Tools for Thin-Wafer-Handling and processing applications. Furthermore, PLANOPTIK develops and produces Microreactors, Fluidic Chips and syringe pumps for Microfluidics and Flow Chemistry applications.
Lidrotec
Lidrotec is a German deep-tech start-up from Bochum in the heart of the German Rust Belt.
We are a solution provider for existing and new challenges in the separation of wafers.
We are a solution provider for existing and new challenges in the separation of wafers.
Founded in 2019 by 4 founders, our team of 25 people today combines extensive experience in the fields of laser technology, optics, electronics, software and mechanical engineering.
We have developed a completely new process to dice wafers. The special innovation is a combination of ultrashort laser pulses and a liquid flow.
In the LidroCUT® machine developed and built by us, a liquid flows over the surface of the wafer while the laser cuts out the components.
The liquid binds and washes away any particles, hence removing them. At the same time, the liquid cools the wafer and thus protects the components from thermal damage.
Overall, our process results in high-quality, precise cuts and particle-free components.
The liquid binds and washes away any particles, hence removing them. At the same time, the liquid cools the wafer and thus protects the components from thermal damage.
Overall, our process results in high-quality, precise cuts and particle-free components.
Products & Services
Our innovative laser process is free from mechanical stress and our liquid prevents thermal defects – hence, no cracks, microcracks or chipping nor any thermal defects, burr or delamination occur.
The rinsing property of the liquid leads to particle-free surfaces, clean cutting edges and clean cutting flanks – no smearing. We reach the highest precision and repeatability due to positioning and repositioning accuracy of ±1 µm.
In addition, the laser is material independent and enables free form cutting, offering maximum flexibility – grooving, drilling, full cut, rounded die corner and much more.
We are Literally Cutting Edge!
In addition, the laser is material independent and enables free form cutting, offering maximum flexibility – grooving, drilling, full cut, rounded die corner and much more.
We are Literally Cutting Edge!
SEMICS Inc.
“SIMPLE PERFECTION”
At the core of our values is “Simple Perfection.” Since our founding in 2000, we have adhered to the belief that no task is too difficult or complex. Our mission is to turn every challenge into a simple, flawless solution. This unwavering commitment drives us to continually evaluate and improve every aspect of our work. It encourages our team to think innovatively, aim higher, and dream of a future full of boundless opportunities.
“THE FIRST”
We are firm believers that true innovation comes from leading the way, not following in others’ footsteps. To make a meaningful impact on the future, we must be at the forefront. Our advanced technologies are crafted to deliver unmatched value to both our customers and our company. This vision goes beyond a simple goal—it is a profound mission we hold close to our hearts. We are fully committed to this journey and inspire every member of our team to contribute to realizing this extraordinary vision.
Products & Services
We have been dedicated to providing innovative wafer prober technologies for over 20 years, continuously expanding our product offerings to cover all areas of wafer testing, including BURN-IN, CP, and TESTER.
Our flagship products include OPERA, a multi-prober solution, and OSTINATO, a multi-wafer burn-in system, both designed to meet the highest industry standards and offer unparalleled performance for all your wafer testing needs.
Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
Products & Services
-Solder pastes, preforms, ribbon, foil, wire
-Fluxes and adhesives for PCBA and semiconductor
-Thermal Interface Materials
-Over 220 solder and fusible alloys
-Ag and Cu sintering materials
-Reclaim, recycling, and dross recovery
-Indium, gallium, germanium metals and compounds
-NanoFoil® and thin-film materials
United Silicon Innovation Corp.
USIC created the test grade silicon wafer business when it was founded in 2017. In 2024, USIC served 30+ customers and provided 36 products for various segments covering a variety of end markets including IC foundry, semiconductor equipment and OSAT segments.
USIC’s innovative refreshed technologies is a new breakthrough in silicon wafer industry. Refreshed Technology is a cost-effective choice for customers who prioritize efficiency and affordability in their operations.
USIC’s refreshed technology achieves a zero-carbon footprint manufacturing process aligned with ESG requisites. This starkly contrasts with traditional crystal growth practices that are energy intensive, making it exemplify an environmental consciousness vital in the current business landscape.
Products & Services
USIC produces the high-quality test grade Silicon wafers. USIC’s test grade Silicon wafers, which can use for a variety of segments. USIC’s products including
300mm Ultra-Clean wafer
300mm Super-Clean wafer
300mm Ultra-test wafer
300mm Super-test wafer
300mm test wafer
300mm space wafer
200mm test wafer
Exyte Asia-Pacific Holding Limited
Exyte is a global leader in design, engineering and delivery of facilities for high-tech industries. With a history of more than 100 years, the company has developed a unique expertise in cleanroom and related manufacturing technology.
Operating in over 20 countries and with around 9,900 talented employees across 80 nationalities worldwide, Exyte is serving the most technically demanding markets such as semiconductors, batteries, pharmaceuticals, biotechnology, and data centers. Exyte offers a full range of services globally from consulting to managing the implementation of turnkey solutions with the highest standards in safety and quality.
Exyte serves industry leaders determining the future of technology through world-class solutions to accelerate their sustainable growth and overcome future challenges.
With our global supply chain network, in-house technology prowess and experienced engineering and project execution teams, we deliver Certainty in schedule, cost and quality to our clients while addressing the need to reduce environmental impacts
Products & Services
Exyte’s Advanced Technology Facilities (ATF) business segment provides consulting and planning services, engineering and design services, as well as project management services surrounding the building of semiconductor fabs and their related installations for manufacturing, research and development.
We combine our range of services to provide turnkey engineering, procurement, and implementation solutions (Design & Build). Additionally, We offer services in the area of mechanical, electrical, and process systems (MEP), provides cleanroom technology, as well as necessary gas and chemical dosing systems, and carries out the installation (Tool Install) of the process equipment used for semiconductor manufacturing purposes.
The integration of the Critical Process Systems Group (CPS), Airgard, and Intega within the Exyte Group has expanded the range of products and services offered to microelectronic clients. The range offered encompasses innovative, critical subsystems, such as precision chemical and gas mixing systems, distribution and delivery systems, and special exhaust gas cleaning systems that enable chip manufacturers to significantly reduce their greenhouse gas emissions.
Our extensive experience in delivering sophisticated high-tech facilities, by means of its integrated design and build approach, provides our clients with the reliability they expect in terms of safety, costs, timelines, and quality.
Yield Engineering Systems (YES)
YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company’s products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via and Cavity Etch and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit YES.tech.
Products & Services
Yield Engineering Systems, (YES), manufactures precision cleaning, coating, curing, and wet process equipment for innovative leaders in the life sciences, emerging technologies, and advanced semiconductor packaging.
YES-VertaCure XP G2 is a production-proven automated vacuum cure system, equipped with 5-zone uniform temperature control and laminar gas flow. This system provides excellent film performance, much higher throughput and lower CoO than atmospheric curing.
The semiconductor industry is ramping up the development of panel-level packaging (PLP). As Heterogeneous Integration becomes mainstream, PLP can also pave a path for larger size, multi-die, chiplet-based solutions for applications such as AI and HPC. YES offers tools to create Through Glass Vias for PLP.
YES’s Fluxless Formic Acid Reflow System, VeroTherm™ FAR offers:
Industry’s best reflow performance extendable to sub-55µm (down to 12µm) bump pitch, multi-substrate, die stacks
Low vacuum technology enables wicking-free reflow for high aspect ratio bumps across wafer and die locations
Designed to minimize formic acid usage per wafer
Yamaha Robotics Co., Ltd.
Yamaha Robotics Co., Ltd. is a Yamaha Motor Co., Ltd. group company that handles semiconductor manufacturing equipment (back-end processing) and electronic component assembly equipment businesses.
We can offer to provide a total solution that exceeds our customers’ expectation as the “Turn-Key Provider in Semiconductor Back-end Process Equipment” by integrating the technologies of bonders, molds，surface mounters, Industrial Robots, and various automated equipments.
Products & Services
Development, manufacturing and sales of semiconductor back-end process equipment.”Connecting” technology: die bonding, wire bonding and flip chip bonding; “Solidification” technology: resin encapsulation equipment and molding equipment; “Assembly” technology: electronic component assembly and manufacturing equipment.
Core Insight, Inc.
Core Insight is a leading company for EOS/ESD control with technical expertise and key insights for Advanced Package Device application. Heterogeneous Integration technology revolutionary achieved new device era. This new technology also brought new challenges that much less ESD sensitivity before it finished package device. Core Insight has prepared to meet new level of ESD control with world best ionization solution which no one else have. Core Insight has understanding device technology, manufacturing process and ESD control know-how for Advanced Package Device handling.
Kokusai Electric
The KOKUSAI ELECTRIC Group is a specialty manufacturer of semiconductor manufacturing equipment that plays a key role of cutting-edge technology of the semiconductor evolution.
We specialize in the indispensable thin film deposition, and treatment in which to improve the thin film quality of the semiconductor device manufacturing process, expanding our business that has garnered immense praise by the customers from all around the world.
Based on our corporate slogan “Technology & Tai-wa for Tomorrow”, we will pursue economic, environmental, and social values from both business and ESG (resolving environmental and social issues and strengthening governance) aspects, with the aim of contributing to the achievement of SDGs and realizing a sustainable society and our group’s sustainable development.
TSE Co,.Ltd.
Connecting the Future
“TSE’s 30 years is a history of innovation and challenge.”
Through relentless innovation and challenge, we have become a pioneer in Korea’s semiconductor test industry, and have grown into a visionary creator of cutting-edge technologies that surpass today’s limitations, leading the way to a positive future.
TSE’s 30-year heritage of innovation is built upon diverse customer experiences, proven capabilities, and outstanding performance. We have not simply followed technology; we have set new standards and became an industry leader.
We develop LC components using MEMS technology and provide i3unify, an only integrated interface solution for probe cards, interface boards, and test sockets – the three key test interconnection hardware components for high-performance semiconductor devices. TSE’s continuous innovation and challenge provide unique value that allows us to lead the future together with our customers.
Products & Services
[Probe Card]
Through cutting-edge probe card design and manufacturing technology, TSE provides innovative solutions capable of precisely inspecting the electrical operation of DRAM, NAND, and SoC chips. Our probe cards are equipped with technology that allows for highly accurate probing of all pads on a die fabricated on a wafer.
[Interface Board]
Memory and non-memory test interface boards are crucial interconnection hardware in semiconductor test systems, acting as a medium for transmitting electrical signals between the semiconductor under test (device) and the test equipment. They provide stable test solutions in various test environments to verify the performance of high-speed memory devices such as DDR, LPDDR, and GDDR, as well as non-memory devices like CPUs, GPUs, Chipsets, APs, and Microcontrollers.
[Test Socket]
A test socket is a device used to test the performance of semiconductor chips after the packaging process. As a test interconnection hardware used in the process of screening good and defective packaged products before shipment, it temporarily houses the packaged chip (Device Under Test, DUT) and establishes a mechanical contact, serving as a medium for electrical signal transmission between the DUT and the test equipment.
Resonac Corporation
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
SPEA
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
Products & Services
- SPEA product portfolio includes test equipment for:
- Automotive, linear, analog mixed signal & SoC devices requiring the most advanced and powerful instrumentation. SPEA’s DOT platform addresses today’s and future roadmap needs.
- MEMS & Sensors. SPEA has been chosen by the biggest players in this market to develop the best solutions for inertial, high-g, proximity, time-of-flight, light, pressure, environmental, magnetic, acoustic sensors. SPEA equipment combines physical stimulus with a complete electrical test, fast pick&place handling, reliable contacting, tri-temp.
- Power & Discretes. DOT800 T perforfms static and dynamic measurements with extended current/voltage ranges, on the whole range of power applications: wafers, discretes (Si, SiC, GaN based), IPMs, KGDs, DBCs, IGBT modules.
- Identification. CT1000 and CT3000 are low-cost test systems dedicated to micro-controllers, RFID, UHF, combi devices. They perform complete, highly accurate measurements, offering high throughput, with high multi-site test capability at wafer test, and a fast data transfer for memory test.
Evatec
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
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