ficonTEC
ficonTEC is the recognized market leader for automated assembly and test manufacturing systems for high-end opto-electronic components and integrated photonic devices. Considerable process capability and dedicated assembly technologies have been accumulated over 25 years of serving the needs of a broad selection of industry segments – including telecom/datacom, high-power diode laser assembly, IoT-conform sensor devices from bio-med to automotive lidar, micro-optical modules, fiber-optics and more.
More recently, ficonTEC’s flexible and scalable Industry 4.0 automation options are enabling new approaches to development and manufacturing, in particular for co-packaged-enabled optics in data center applications as well as in mainstream industrial sectors such as photonics for automotive.
HON.PRECISION, INC. (HPI)
HON.PRECISION,INC.(HPI) was founded by a group of engineering R&D personnel with a passion and vision for excellence, innovation and semiconductor automation equipment. We come from different cultures, backgrounds and experiences, but we share a common goal: to become the leader in the IC semiconductor automation equipment industry.
We are committed to providing the highest quality automated test sorting machines and related visual AOI/AI computing processing, normal/high/low temperature temperature control,down force, bar code, network, communication, and database to IC semiconductor customers around the world.production data central monitoring system, AGV… and other complete automated integrated solutions. With unremitting efforts and quality improvement and persistence, we have established close partnerships with major semiconductor customers around the world.
REMAIN UNCHANGED WITH A REMINISCENT MIND ALONG THE JOURNEY
From the R&D and production factory in Taiwan to the investment and establishment of subsidiaries in China and the United States, we cooperate with agent partners in various regions around the world to provide customer support and services nearby, and have won the Yushan Award for Best Supplier and Brand from many customers. With honors and testimony such as the Rock Award, HON.PRECISION,INC. is honored to participate in and witness the rapid development of semiconductor technology in human history. We will continue to research and develop, continue to work hard, and grow together with world-class semiconductor customers!
DIS Tec
DIS Tech is a business branch of Technoprobe S.p.A. aimed at strengthening company’s competencies in the PCBs and high-performance interfaces market consolidating the full vertical integration of its business model.
Products & Services
Testing of a chip occurs both at wafer level and package level. These different phases require different types of device interface boards: a Probe Card (PC) with an integrated probe head and needles that contact the wafer before packaging, and the Final Test (FT) board that includes sockets specific to the packaged integrated circuits shape and size. DIS Tech provides the expertise to design, manufacture, and assemble these types of boards, as well as Prober Interface Boards (PIBs).
PI
Since its foundation in 1970, PI (Physik Instrumente) has established itself as a leading manufacturer of precision positioning technology. The key element and motivation of the entrepreneurial behavior have always remained the same: Finding the best possible solution for the customer.
PI is well known for the quality of its products and has been one of the leading players in the global market for precision positioning technology for many years. One of the most important building blocks for this is the team spirit within the international PI family, which is based on mutual understanding and support that goes beyond international borders and functional restrictions.
PI is a privately owned company with healthy growth, 1,790 employees worldwide and a flexible, vertically integrated organization, which enables it to fulfill almost any request in the field of innovative precision positioning technology. The foremost priority for PI is to be a reliable and highly qualified partner for the customer.
Products & Services
PI Supports Semiconductor Equipment Suppliers Worldwide with High-Precision and Reliable Motion and Control Solutions for Applications Such As:
- Photomask production: Mask writing, inspection, and repair
- Wafer cutting: Sawing the wafer from the silicon monocrystal (ingot)
- Resist structuring: DUV and EUV lithography, nanoimprint lithography (NIL)
- Wafer and mask inspection (optical/electron microscopy): Detection of structural failures, defects, and particles
- Wafer metrology: Measurement of the critical dimension (CD), overlay offset, and layer thickness
- Wafer probing: Testing functionality and quality of photonic structures of photonic integrated circuits (PICs)
- Wafer dicing: Laser-based separation of chips from the silicon wafer
- Back-end production: Die and wire bonding, packaging, chip testing, and die-attachments
SURUGA SEIKI Co., Ltd. TAIWAN BRANCH
We are Siliconphotonics advanced package and testing solution provider. Suruga Seiki is a Japanese company founded in 1964. Taiwan is the APAC operation center with design and CPO system assembly functions.
We are focusing on Siliconphotonics, Photonics wafer restring, PIC functional test and Active alignment, passive alignment, edge coupling and grating coupling by our key components, module, and tester system.
We can also provide camera module and lens decenter alignment inspection with our laser collimator and high precision stage.
Our website:
[About Siliconphotonics, Advanced Testing&Package functions for PIC]
[About Company Profile]
Products & Services
SURUGA SEIKI provides cutting-edge technology such as high precision positioning motor stage, excellent optical alignment algorithm and laser measurement technique. Experienced domestic services on photonics wafer testing, PIC coupling, assembly by active/passive alignment.
Nitto Corporation
Founded in 1918, Nitto has developed our business globally to offer various products in fields such as electronics, automobiles, housing, infrastructure, environment, and medicine. The Nitto Group strives to become a centennial company that is always trusted by customers, embraced by employees with pride, makes an active contribution to society, and continuously grows on a global scale with our slogan, “Innovation for Customers.”
Nano Electronics and Micro System Technologies, Inc. (NEMS)
Nano Electronics and Micro System Technologies, Inc., founded in 2002, is a leader in plasma technology innovation, providing high-performance surface treatment solutions across industries including semiconductors, PCBs, and optoelectronics. With a strong R&D team, we’ve secured multiple patents in high-density vacuum and atmospheric plasma technologies, serving markets in Taiwan, China, Japan, U.S., Europe and other parts of Asia.
Our core strengths lie in continuous innovation and excellence, extending beyond electronics to consumer industries and biomedicine. We value integrity, cooperation, and a ‘family culture’ that nurtures employee growth and fosters a sense of belonging.
Committed to continuous improvement, we strive for excellence in every aspect of our operations. Looking ahead, we aim to lead in technology while contributing to societal and economic advancement through our innovative products and global partnerships.
Products & Services
With patented high-density plasma technologies, Nano Electronics and Micro System Technologies, Inc. (or “NEMS”) designs, manufactures and sells a variety of plasma solutions including vacuum and atmospheric plasma tools. NEMS focuses on developing plasma surface treatment systems that incorporate surface cleaning, etching, and modification processes.
(1) Vacuum Plasma Tools (Batch-Type/In-line Type/Reel-to-Reel Type): Plasma Cleaner, Plasma Desmear Machine, Plasma Drilling Machine, Plasma Asher, Plasma Etching Machine (Microwave, RIE), Plasma Treatment Machine.
(2) Atmospheric Plasma Tools (Batch-Type/In-line Type/Reel-to-Reel Type): Nozzle-Type Atmospheric Plasma Cleaner (Arc Jet Type, RF Jet Type, Microwave Jet Type), Bar-Type Atmospheric Plasma Cleaner (Direct/Waterfall Type, Remote/Matrix Type), Plasma Poling Machine, Wafer Back-Side Polymer Removal Plasma Machine, Plasma Waste Abatement Equipment, Plasma Waste Gas Abatement Equipment, PFC Plasma Scrubber, Plasma Waste Water Treatment Equipment.
Browave Corporation
Browave Corporation (3163, wwww.browave.com) is Engaged in the Development of Optical Communication Technology Leaders of the optical fiber communication industry with OEM/ODM development, production, and sales. Headquartered within the Science & Industrial Park of Hsinchu, Taiwan, Browave Corporation has been persisting in offering a large-scale service to world-class customers while earning much recognition since 1988.
With consistant efforts, our products are widely deployed in FTTH, Data Center, Cloud Computing, Digital Media, CATV, Broadband and, 5G applications. Customers chose Browave not only for the cutting-edge technique and manufacturing value we possess. but more for our in-time digital management ability.
Browave prides itself in the profound understanding of this new demand, committing itself to utilize the most and sophisticated All-Fiber and Micro-Optic technologies to provide our customers with a range of standardized products, in addition to offering products that cater to the special needs and specifications of our clients.
Products & Services
Fiber Array Unit (FAU), and Integrated Fiber Harness Unit (IFAU) for SR, DR, FR, LR types in HPC, Datacenter, Computing applications. Browave provides optical design, optical subassembly process, and package service for customer. For next generation, our design and service products can apply in CPO and OIO to reduce optical coupling loss, and deattachable FAU.
UTECHZONE
Established in 1992, Utechzone has been devoted to the research and development of AOI (Automatic Optic Inspection) machines for more than three decades. Utechzone not only launches a complete product line covering the PCB, Semi, COF, and LCD/LCM industries but also presents AI deep learning to further enhance precision and efficiency.
With the core competence of ”We serve with vision”, Utechzone has integrated optics, software, mechanisms, electricity control, and algorithms to assist various manufacturers in achieving high quality at a reasonable cost. Utechzone, the worldwide AOI leader, will be your best quality guardian.
Products & Services
Automatic Optic Inspection
Syenta
High-Speed Patterned Metallization for Advanced Packaging. Syenta introduces Localized Electrochemical Modelling (LEM) direct patterning & deposition in a single process. Small features patterned at high-throughput with very high coplanarity.
Group Up Industrial Co. Ltd.
Group Up Industrial Co. Ltd. (GP) began the business in 1990, we have the core belief of “Quality First, Service Foremost“, focusing on process technologies – “Coating,” “Drying,” and “Laminating.” Through automated integration, we have successfully enhanced the equipment capacity and precision to the semiconductor equipment industry.
Printed Circuit Boards (PCBs) lay the foundation for us, keeping pace with global trends, we are a leading global supplier of equipment for Flexible Printed Circuits (FPCs) and IC substrates, maintaining a high market share worldwide.
Building on our solid industry experience, GP has expanded into FO PLP and TGV, glass core substrate market, continuously innovating with the times.
Products & Services
FO PLP or TGV process equipment, advanced packaging tools, UV or IR curing, baking, annealing equipment with automation, FOUP, loadport, SECS/GEM integration service, etc.
YAYATECH Co., Ltd.
YAYATECH began with a successful collaboration with a Germany’s partner from 2008 to 2014 together, we engineered advanced inspection machines for solar wafers and cells. This international experience was instrumental in our evolution into the semiconductor advance packaging.
Our portfolio now includes state-of-the-art using Infrared (IR) inspection machines for wafer cracks or chipping, Reel IC cracks or chipping, and substrate ICs.
These innovations have garnered recognition from leading packaging companies. With a focus on precision and next-generation packaging requirements, our R&D team is also integrating AI technology to deliver comprehensive inspection solutions.
Products & Services
YAYATECH is a leading provider of advanced Automated Optical Inspection (AOI) solutions, specializing in the design and manufacturing of advance packaging and cutting-edge inspection machines.
Our comprehensive portfolio covers a wide range of applications, including semiconductor inspection equipment, infrared (IR) inspection, and hidden crack or chipping detection. Furthermore, we offer integrated solutions featuring artificial intelligence (AI) technology, reel handling capabilities, infrared (IR) technology.
YAYATECH produts are not only the semicoductor inspection solutioni ,but also have PCB AOI inspection solution such as for PCB hole inspection machines, X-ray inspection systems, hole position verification, general optical inspection, AOI systems, microscopy, strip handling, laser marking, and laser etching inspection.
Brewer Science, Inc.
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications.
E&R Engineering Corp.
Advanced Laser & Plasma Innovation Provider
Established in 1994 and headquartered in Taiwan, E&R Engineering Corp.(OTC: 8027) has been delivering advanced laser and plasma solutions to the semiconductor industry for 30 years. Evolving from a tool provider to a solutions leader, we focus on TGV, FOPLP, FCBGA, FCCSP, ABF micromachining, and advanced materials like glass, SiC, and GaN, as well as 2.5D/3D Advanced Packaging.
Our strengths include flexibility, customized solutions, and robust global support. With 10+ service bases and 50+ field service engineers across Taiwan, China, Southeast Asia, the US,and Europe, we provide swift support and continuous process optimization.
Products & Services
TGV, FOPLP, FOWLP, FCBGA, FCCSP, Fan-Out, and Fan-In (Wafer Level Packaging),Laser Marking, Laser Cutting, Laser Drilling, Laser Scribing, Laser Grooving, Laser Beveling, Laser Debonding, Laser Ablation,
Plasma Dicing, Plasma Etching and Thinning, Plasma Descum, Plasma Clean, AOI, ABF Drilling, Dry Ice Cleaning, Carrier Tape
United Silicon Innovation Corp.
USIC created the test grade silicon wafer business when it was founded in 2017. In 2024, USIC served 30+ customers and provided 36 products for various segments covering a variety of end markets including IC foundry, semiconductor equipment and OSAT segments.
USIC’s innovative refreshed technologies is a new breakthrough in silicon wafer industry. Refreshed Technology is a cost-effective choice for customers who prioritize efficiency and affordability in their operations.
USIC’s refreshed technology achieves a zero-carbon footprint manufacturing process aligned with ESG requisites. This starkly contrasts with traditional crystal growth practices that are energy intensive, making it exemplify an environmental consciousness vital in the current business landscape.
Products & Services
USIC produces the high-quality test grade Silicon wafers. USIC’s test grade Silicon wafers, which can use for a variety of segments. USIC’s products including
300mm Ultra-Clean wafer
300mm Super-Clean wafer
300mm Ultra-test wafer
300mm Super-test wafer
300mm test wafer
300mm space wafer
200mm test wafer
Rotarex
Rotarex is a global company that designs and manufactures premium quality gas control products and systems. Founded in Luxembourg 100 years ago, the company has grown to be a world-leading producer of cylinder valves, pressure regulators, equipment and fittings that deliver superior gas safety, control and productivity. Thanks to top-tier European engineering and technical excellence developed over decades, Rotarex is a valued partner of many of the world’s most demanding gas companies and gas system designers and installers.
Rotarex creates applied innovations through its rapid response R&D infrastructure and collaboration with university partners that solve real customer challenges and invent new ways of working. Driven by this culture of innovation, Rotarex holds over 100 patents and has developed many breakthrough products that are now industry standards.
With 15 logistics centers, 30 service centers and presence in 65 countries, Rotarex provides responsive service to customers around the world.
Products & Services
PREMIUM GAS SYSTEMS FOR ULTRA HIGH PURITY GASES
– Ultra High Purity Pressure Regulators
– Ultra High Purity Line Valves
– Ultra High Purity Fittings
– Ultra High Purity Cylinder Connectors
– and much more…
UHP line valves:
– Springless and threadless design for Minimized particle generation
– Maximum flow capacity thanks to a minimum dead space design
– Working pressure up to 240 bar
– Supported temperatures from -20 to 150 Celsius degrees
– Assembling, testing & packaging in cleanroom: Class ISO 4
– Excellent resistance to corrosion with electropolished surface roughness as per SEMI F19 UHP Grade
– 100% Helium leak tested
UHP line pressure regulators
– High level of outlet pressure stability
– Flow rates range Expanded to meet all applications
– Pressure handling up to 240 bar
– Supported temperatures from -20 to 65 Celsius degrees
Plasmatreat Asia Pacific Pte Ltd
Plasmatreat is the key enabler technology for microfine cleaning, surface activation and atmospheric plasma coatings (CVD) of nearly all kinds of materials – from plastics, metals and glass in a wide variety of industries including semiconductors. We prepare surfaces in an environmentally friendly way – replacing the need for chemicals and primers.
Products & Services
Atmospheric plasma equipment enabling state of the art surface preparation – activation, cleaning, reduction and nano-coatings for:
Flux-free Advanced Chip Packaging, Power Modules, Wire Bonding, Display Bonding, LED, PCBA and Consumer Electronics.
Area-selective, inline plasma processes in atmosphere including CVD coatings (dielectric barrier coatings, tie layers and anti-corrosion protection).
Manz Asia
Manz Asia specializes in innovative production solutions for advanced panel-level packaging. We provide a comprehensive range of manufacturing systems, from customized machines for lab and pilot production to standardized modules and turnkey lines for mass production. Manz’s solutions deliver superior resource efficiency, increased throughput, and faster time-to-market, empowering customers to boost productivity and competitiveness.
Products & Services
Manz Asia continues to drive innovation in RDL solutions, expanding beyond coreless Fan-Out Panel-Level Packaging (FOPLP) to pioneering technologies for glass core production.
Our advanced RDL capabilities for glass cores, supported by etching equipment that achieves over 95% uniformity in processing 510 x 515 mm Through Glass Via (TGV) substrates, ensure precise and consistent results.
Watlow
Watlow uniquely provide thermal solutions across the entire semiconductor fab. For gas line processes, in-chamber, and sub-fab optimization, we integrate core technologies that create system-level value for heating, sensing and advanced controls.
Our thermal technology is used in many of the critical stages of wafer processing to provide consistent thermal uniformity and the precision and flexibility needed to ensure the highest level of repeatable and reliable thermal performance. Watlow customers also enjoy lower cost-of-ownership, increased machine up-time, superior product quality, and worldwide field service and support.
For example, a low-temperature heater is needed to keep chemical precursors in the vapor phase, thus ensuring uniform and accurate vapor delivery, without introducing contamination into the process chamber or the wafer surface. Within the process chamber, our innovations better manage parameters such as system cycle time as well as temperature uniformity, so wafers can be processed faster and at a higher quality.
Products & Services
For over 100 years, Watlow has grown in product capability, market experience and global reach. The company holds more than 1000 patents and employs 3700 team members working in 13 manufacturing facilities and 9 technology and development centers in the United States, Mexico, Europe and Asia.
Watlow also has sales coverage in 178 countries around the world. Watlow continues to grow, while the commitment remains the same: Pioneering thermal solutions that deliver a thriving future. The spectrum of Watlow capabilities spans advanced thermal solutions across process and power control, heating, sensing, process automation, data management and data insights software.
Watlow also provide technical support and services from small solutions to complex systems. With expertise across a wide span of industrial processes, we know that many of these require a high degree of precision, attention to detail and specialized knowledge. Investing in our support and services helps customers to optimize efficiency, maximize plant availability and protect valuable investments.
Scrona
Scrona is an innovative company that is revolutionizing the world of electrostatic multi-nozzle printing technology. Our MEMS-based printing engine enables ultra-high-resolution printing on a scalable platform. Here are some highlights:
- Resolution: Scrona’s printing technology offers 100 times better resolution than conventional inkjet printers. Even tiny details are reproduced with razor-sharp clarity.
- Material Versatility: Scrona’s print heads can handle not only thin inks but also materials that are 100 times more viscous.
- 3D Printing: Scrona enables stackable 3D printing with a high aspect ratio of over 10:1 and nanometer-scale layer thickness.
- World Record: Scrona holds the world record for the smallest color photo ever printed. This image fits within the cross-section of a human hair.
Scrona has the potential to redefine semiconductor and display production and shape the future of microfabrication. Our MEMS chips are the heart of our technology, offering sub-micrometer-precise printing on nearly any material.
Henkel Ltd.
Henkel was found in 1876 by founder Fritz Henkel. With our business units – Adhesive Technologies and Consumer Brands – we hold leading market positions in both the industrial and consumer goods businesses.
Henkel adhesive technologies is world No. 1 producer in adhesives, sealants and functional coatings. With trusted brands and high-impact solutions based on an unmatched technology portfolio we are creating value for all our stakeholders. As experts for industrial applications in more than 800 industries, we work closely with our customers and partners. Based on our broad technology portfolio and our strong innovative power, we continuously develop customized solutions.
In fiscal 2023, Henkel reported sales of more than 21.5 billion euros and adjusted operating profit of around 2.6 billion euros. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Today employs a diverse team of about 48,000 people worldwide.
Products & Services
Henkel is the world’s leading provider of qualified, compatible material sets for semiconductor packaging. We’re your global partner prepared to handle any challenge and develop a solution that is smart and sustainable — together with you.
Henkel’s total solutions approach leverages extensive global resources to deliver superior semiconductor packaging material technologies and cost-competitive performance. From die attach adhesives used in traditional wirebond packaging to advanced underfills and encapsulants for advanced packaging applications, Henkel provides the cutting-edge materials technology and global support top microelectronics companies require.
Henkel’s advanced packaging solution include:
•Anhydride-free, low warpage liquid compression molding underfill (LC-MUF) for fine-gap filling and low wafer-level warpage.
• High fracture toughness, low CTE capillary underfills for faster flow and thorough bump encapsulation on large dies.
• Low-stress, high-elongation lid attach materials for improved warpage control and enhanced reliability performance.
MPI Corporation
Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in the testing of Semiconductors, Light Emitting Diodes (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components, and more. MPI’s five main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test, Thermal Test, and Celadon Systems.
MPI offers a wide-ranging portfolio of products and services, from advanced probe card technologies, mass production and engineering probe systems, testers, material handlers, inspection systems, and thermal air stream systems. MPI’s diverse product portfolio and expertise in leading edge technologies creates a healthy environment for employee growth and retention. With the cross-pollination of technologies and talent, we are committed to delivering long-term value to enhance the competitiveness of our customers.
MPI is the first Taipei Exchange (TPEx) listed probe card company in Taiwan.
GIGAPHOTON
Gigaphoton already has grown to dominate the Asian market including Japan with a large number of installed bases including most of major semiconductor device manufacturers in this region as the world’s leading excimer laser light source manufacturer. Gigaphoton also continues to enjoy rapid growth in the US and European markets.
Semiconductors have continued to evolve toward next-generation device technologies. Based on a global business strategy, we will strive to be the No. 1 lithography light source provider by focusing on market needs in every phase of our business, from research and development to manufacturing, sales, marketing and customer support.
Products & Services
Development, manufacturing, sale, and service of excimer laser used for lithography tools in semiconductor manufacturing and for other uses, and Extreme Ultra-Violet light sources
Yamaha Robotics Holdings Co., Ltd.
Yamaha Robotics Holdings Co., Ltd. was established in July 2019 as a holding company, with Yamaha Motor Co., Ltd. as the parent company and three operating subsidiaries: SHINKAWA LTD, APIC YAMADA CORPORATION, and PFA Corporation.We can offer to provide a total solution that exceeds our customers’ expectation as the “Turn-Key Provider in Semiconductor Back-end Process Equipment” by integrating the technologies of bonders, molds，surface mounters, Industrial Robots, and various automated equipments.
Products & Services
Development, manufacturing and sales of semiconductor back-end process equipment.”Connecting” technology: die bonding, wire bonding and flip chip bonding; “Solidification” technology: resin encapsulation equipment and molding equipment; “Assembly” technology: electronic component assembly and manufacturing equipment.
Chain-Logic International Corp.
Chain Logic International Corp. (CLIC) was established in 1994, located in Hsinchu Taiwan, and our parent company is MPI Corporation/ www.mpi- corporation.com (IPO in 2003, TWSE: 6223)
CLIC is a professional agent in Taiwan, providing technical support and service for the manufacturing of high-tech industries such as Semiconductor, Optical devices, PCB, discrete devices, etc.
CLIC strives to continually deliver world-class service to our customers to assist them to optimize their production utilization.
Tel:+886-3-552 7788 Fax: +886-3-551 9899
E-mail: sales@cli.com.tw
Website: http://www.cli.com.tw/
Products & Services
We provide:
Advance Testing Solution (Modeling, Failure Analysis, RF, Low noise, High Power Applications)
Thermal Test (wafer level/package level)
Optical Devices Testing Solution (Micro LED, Lasers)
IC Package Process/Material
AOI/AVI Applications (Wafer level/ Package Level/PCB)
Kokusai Electric
The KOKUSAI ELECTRIC Group is a specialty manufacturer of semiconductor manufacturing equipment that plays a key role of cutting-edge technology of the semiconductor evolution.
We specialize in the indispensable thin film deposition, and treatment in which to improve the thin film quality of the semiconductor device manufacturing process, expanding our business that has garnered immense praise by the customers from all around the world.
Based on our corporate slogan “Technology & Tai-wa for Tomorrow”, we will pursue economic, environmental, and social values from both business and ESG (resolving environmental and social issues and strengthening governance) aspects, with the aim of contributing to the achievement of SDGs and realizing a sustainable society and our group’s sustainable development.
DSV Inventory Management Solutions
For over 20 years and a global network of 4,000+ suppliers, DSV Inventory Management Solutions have helped companies turn their supply chains into a competitive differentiator. By integrating our inventory management operations and supply chain finance program with automation, AI, and data analytics, we streamline processes, boost efficiency, and improve visibility throughout your supply chain — delivering uninterrupted revenue operations and maximizing working capital efficiency.
With the success of our solution, we were recently recognized by Intel as a 2024 Intel EPIC Distinguished Supplier
“As one of the 27 Distinguished Supplier Award recipients in 2024, DSV stands out among suppliers in Intel’s trusted supply chain,” said Keyvan Esfarjani, chief global operations officer at Intel. “Through their relentless drive to improve, they have achieved a level of performance that consistently exceeds Intel’s expectations and serves as a benchmark across the ecosystem.”
The Intel EPIC Distinguished Supplier Award recognizes a consistent level of strong performance across all performance criteria. Of the thousands of Intel suppliers around the world, only a few hundred qualify to participate in the EPIC Supplier Program. The EPIC Distinguished Award is the second-highest honor a supplier can achieve. In 2024, only 27 suppliers in the Intel supply chain network earned this award.
AEM Holdings Ltd.
AEM: Unleashing the Power of Tomorrow – Leader in High-Performance Processor Testing for the AI Era
AEM is a global leader in intelligent system test and handling solutions for semiconductor and electronics companies serving the advanced computing, 5G, and AI markets. Our mission is to provide the most comprehensive semiconductor and electronics test solutions based on the best-in-class technologies, processes, and customer support.
AEM is the pioneer of massively parallel, fully automated test solutions. Our expertise has been developed over the past two decades where AEM now has the largest fleet of such high parallel systems in the world serving the advanced performance compute market.
AEM has a global presence across Asia, Europe, and the Americas, with R&D centers located in Singapore, Malaysia, France, Finland and the US. AEM has manufacturing plants in Singapore, Malaysia (Penang), Indonesia (Batam), Vietnam (Ho Chi Minh City), and Finland (Lieto), and a global network of field engineering support and sales offices.
Products & Services
AEM: Unleashing the Power of Tomorrow – Leader in High-Performance Processor Testing for the AI Era
AEM is a global leader in intelligent system test and handling solutions for semiconductor and electronics companies serving the advanced computing, 5G, and AI markets.
AEM’s technology pillars stem from the substantial investments made in R&D to sustain our leadership in three critical verticals: Industry leading Active Thermal Control, Advanced Factory Automation, and Application-Optimized Test Instrumentation.
AEM’s Solutions:
Industry Leading Active Thermal Control: Common active thermal collaterals integrated into various test insertion solutions ranging from the engineering lab to high volume manufacturing to enable rapid time to market and yield improvements.
Advanced Factory Automation: Factory 4.0 automation for low to massively parallel test insertions optimized for maximum throughput and lowest cost of test.
Test Instrumentation: Highly optimized test instrumentation, coupled with active thermal control and automation, that challenges the current cost-prohibitive traditional ATE test methodology.
SUSS
SUSS is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS supports more than 8,000 installed systems worldwide. SUSS is headquartered in Garching near Munich, Germany. For more information, please visit suss.com.
Products & Services
The SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. After sales, the company supports the entire life cycle of the tools: its range of services begins with the installation and startup of the systems including user training. Once systems are integrated in the customer’s environment, SUSS provides consistent support. Since long life cycles are very common for the company’s equipment, preventive maintenance programs are available, as well as reliable spare parts systems, warranty extensions and system upgrades. SUSS maintains service locations and local support teams in all areas of the globe to provide quick help.
Applied Materials
We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.
Pentamaster Technology
Pentamaster Group provides automation technology and solutions to multinational manufacturers in the automotive, semiconductor, electro-optical, consumer electronics, and medical sector, spanning across APAC, North America and Europe. Besides the HQ and production plant in Penang, Malaysia, the Group has strategic presence globally with offices located in the USA, Japan, Germany, Singapore and production facilities in China.
With the speed and magnitude of technology progress today, Pentamaster Group will always be bold enough to explore new innovations. For years, the Group has been one of the leading global providers of automated test equipment to suit different requirements and needs of customers from various industries. In the automotive segment, the group has developed a proprietary SiC wafer burn-in system, being one of the top four manufacturers in the world, in creating a niche market space for this growth sub-segment and to solidify the Group’s position in the automotive industry.
FormFactor
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.
ULVAC Technologies, Inc.
ULVAC GmbH which was established in 1987 as the European subsidiary of ULVAC, Inc. headquartered in Munich, Germany. ULVAC’s solutions diversely incorporate equipment, materials, and services for Semiconductors, MEMS, Flat Panel Displays, Electronic Components, PCB, TFB, and other Vacuum Equipment for the European Markets.
ULVAC is the global leader for thin film PZT deposition and etch.
ULVAC GmbH
Klausnerring 4
85551 Kirchheim b. München
Germany
Fon: +49 – 89 – 96 09 09 – 0
Fax: +49 – 89 – 96 09 09 – 96
Email: ulvac@ulvac.de
http://www.ulvac.eu
Products & Services
For MEMS application ULVAC has developed systems dedicated to MEMS sensors, actuators, switches, lab-on-chip and micromirror manufacturing. This equipment range includes sputtering and etching for piezo electric materials like PZT, AlN and ScAlN, glass and metal etching, thick resist ashing, resist and polymer removal within trench structures, and others.
Piezoelectric materials can be used to further miniaturize a range of devices, including inertial sensors, tuneable RF devices, inkjet print heads, micromirrors, microphones, autofocus lenses and others. The integration of thin film deposition directly on CMOS-processed wafers is key for highly-integrated devices. ULVAC has developed high-volume processing sputtering method that allows sub 500°C processing temperatures, is configured to pole the piezoelectric crystals during the deposition process and is compatible with other CMOS processes.
SPEA
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
Products & Services
- SPEA product portfolio includes test equipment for:
- Automotive, linear, analog mixed signal & SoC devices requiring the most advanced and powerful instrumentation. SPEA’s DOT platform addresses today’s and future roadmap needs.
- MEMS & Sensors. SPEA has been chosen by the biggest players in this market to develop the best solutions for inertial, high-g, proximity, time-of-flight, light, pressure, environmental, magnetic, acoustic sensors. SPEA equipment combines physical stimulus with a complete electrical test, fast pick&place handling, reliable contacting, tri-temp.
- Power & Discretes. DOT800 T perforfms static and dynamic measurements with extended current/voltage ranges, on the whole range of power applications: wafers, discretes (Si, SiC, GaN based), IPMs, KGDs, DBCs, IGBT modules.
- Identification. CT1000 and CT3000 are low-cost test systems dedicated to micro-controllers, RFID, UHF, combi devices. They perform complete, highly accurate measurements, offering high throughput, with high multi-site test capability at wafer test, and a fast data transfer for memory test.
mks | Atotech
Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com
Airspace
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.
With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.
Products & Services
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert team that understands the specific needs of shipments such as those in the semiconductor business.
From NFO, to OBC, dedicated drives, charters and more, the Airspace technology will calculate the best routing for you, taking your specific requirements into consideration as well as automating the process to save your team valuable time.
Your supply chain is complicated — we make it easy for you.
Lam Research Corporation
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
Products & Services
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
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